FR2690304B1 - Procede d'assemblage de composants sur une plaquette de circuit imprime double face et plaquette ainsi obtenue. - Google Patents

Procede d'assemblage de composants sur une plaquette de circuit imprime double face et plaquette ainsi obtenue.

Info

Publication number
FR2690304B1
FR2690304B1 FR9204695A FR9204695A FR2690304B1 FR 2690304 B1 FR2690304 B1 FR 2690304B1 FR 9204695 A FR9204695 A FR 9204695A FR 9204695 A FR9204695 A FR 9204695A FR 2690304 B1 FR2690304 B1 FR 2690304B1
Authority
FR
France
Prior art keywords
wafer
double
circuit board
printed circuit
sided printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9204695A
Other languages
English (en)
Other versions
FR2690304A1 (fr
Inventor
Philippe Houard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marelli Autronica SA
Original Assignee
Marelli Autronica SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marelli Autronica SA filed Critical Marelli Autronica SA
Priority to FR9204695A priority Critical patent/FR2690304B1/fr
Publication of FR2690304A1 publication Critical patent/FR2690304A1/fr
Application granted granted Critical
Publication of FR2690304B1 publication Critical patent/FR2690304B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0455—PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
FR9204695A 1992-04-16 1992-04-16 Procede d'assemblage de composants sur une plaquette de circuit imprime double face et plaquette ainsi obtenue. Expired - Fee Related FR2690304B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9204695A FR2690304B1 (fr) 1992-04-16 1992-04-16 Procede d'assemblage de composants sur une plaquette de circuit imprime double face et plaquette ainsi obtenue.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9204695A FR2690304B1 (fr) 1992-04-16 1992-04-16 Procede d'assemblage de composants sur une plaquette de circuit imprime double face et plaquette ainsi obtenue.

Publications (2)

Publication Number Publication Date
FR2690304A1 FR2690304A1 (fr) 1993-10-22
FR2690304B1 true FR2690304B1 (fr) 1999-09-24

Family

ID=9428941

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9204695A Expired - Fee Related FR2690304B1 (fr) 1992-04-16 1992-04-16 Procede d'assemblage de composants sur une plaquette de circuit imprime double face et plaquette ainsi obtenue.

Country Status (1)

Country Link
FR (1) FR2690304B1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6599031B2 (en) * 2001-09-12 2003-07-29 Intel Corporation Optical/electrical interconnects and package for high speed signaling
DE102004038964A1 (de) * 2004-08-10 2006-02-23 Endress + Hauser Gmbh + Co. Kg Leiterplatte mit wenigstens einem thermisch kritischen SMD-Bauteil und Verfahren zum Herstellen, Bestücken und Löten einer Leiterplatte

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2556550B1 (fr) * 1983-12-09 1987-01-30 Lignes Telegraph Telephon Procede de brasage de composants electroniques sur un circuit imprime et circuit hybride obtenu par ce procede
CH670927A5 (en) * 1986-10-03 1989-07-14 Mettler Instrumente Ag PCB with mounted components connected by solder bath process - has capillary bores only partially overlapped by component connection elements to facilitate solder flow
US4985601A (en) * 1989-05-02 1991-01-15 Hagner George R Circuit boards with recessed traces
JP2844778B2 (ja) * 1989-12-28 1999-01-06 ソニー株式会社 片面プリント基板に２種類の部品を半田付けする方法
US5180096A (en) * 1990-07-25 1993-01-19 Nihon Den-Netsu Keiki Co., Ltd. Method and apparatus for reflow-soldering of printed circuit boards

Also Published As

Publication number Publication date
FR2690304A1 (fr) 1993-10-22

Similar Documents

Publication Publication Date Title
DE69400677D1 (de) Verbinderanordnung für gedruckte Leiterplatte
DE68921117D1 (de) Randverbinder für Leiterplatten und Anschlusselement dafür.
DE69103652T3 (de) Verbinderanordnung für gedruckte Leiterplatten.
FR2762929B1 (fr) Boitier de semi-conducteur ayant un element semi-conducteur, une structure de fixation de boitier de semi-conducteur montee sur une plaquette de circuits imprimes, et procede d'assemblage de boitier de semi-conducteur
FR2706223B1 (fr) Elément connecteur d'une plaquette à circuits imprimés .
DE69008963D1 (de) Elektronisches Schaltungssubstrat.
DE68908687D1 (de) Gedruckte Schaltungsplatte.
DE69015878D1 (de) Mehrschichtleiterplattenstruktur.
DE69103999D1 (de) Mehrlagige Leiterplatte.
FR2575627B1 (fr) Procede de fabrication d'une carte multicouche de circuits imprimes
DE69020204D1 (de) Mehrschichtige gedruckte Leiterplatte.
DE69011958D1 (de) Verbindungszusammenbau für gedruckte Schaltungskarten.
DE69023972D1 (de) Randverbinder für gedruckte Leiterplatten.
IT8967974A0 (it) Sistema di montaggio e di collegamento di schede di circuiti elettronici, in particolare per l'impiego a bordo di autoveicoli
DE69406581D1 (de) Gedruckte Schaltungsplatten
DE69200544D1 (de) Integraler Randverbinder für Leiterkarten.
DE3679627D1 (de) Mehrschichtige gedruckte schaltungsplatte.
DE68906160D1 (de) Gedruckte schaltungsplatte.
FR2652703B1 (fr) Procede de montage d'un composant electronique sur une carte de circuit imprime.
DE3872865D1 (de) Gedruckte leiterkarte.
FR2690304B1 (fr) Procede d'assemblage de composants sur une plaquette de circuit imprime double face et plaquette ainsi obtenue.
DE59300799D1 (de) Leiterkarte für eine Leistungshalbleiter aufweisende Leistungselektronikschaltung.
FR2709634B1 (fr) Structure pour relier des cartes de circuits imprimés.
FR2670074B1 (fr) Connexion entre des composants smd et une carte de circuits imprimes.
FR2617667B1 (fr) Procede de fabrication d'une plaquette a circuit imprime et cette plaquette

Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20061230