FR2689360B1 - Procede de fabrication de cartes imprimees, et cartes imprimees obtenues par ledit procede. - Google Patents
Procede de fabrication de cartes imprimees, et cartes imprimees obtenues par ledit procede.Info
- Publication number
- FR2689360B1 FR2689360B1 FR9302873A FR9302873A FR2689360B1 FR 2689360 B1 FR2689360 B1 FR 2689360B1 FR 9302873 A FR9302873 A FR 9302873A FR 9302873 A FR9302873 A FR 9302873A FR 2689360 B1 FR2689360 B1 FR 2689360B1
- Authority
- FR
- France
- Prior art keywords
- printed cards
- manufacturing
- cards
- manufacturing printed
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
- H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/143—Treating holes before another process, e.g. coating holes before coating the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH93892A CH687490A5 (de) | 1992-03-25 | 1992-03-25 | Leiterplattenverstaerkung. |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2689360A1 FR2689360A1 (fr) | 1993-10-01 |
FR2689360B1 true FR2689360B1 (fr) | 1995-10-20 |
Family
ID=4198672
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9302873A Expired - Fee Related FR2689360B1 (fr) | 1992-03-25 | 1993-03-12 | Procede de fabrication de cartes imprimees, et cartes imprimees obtenues par ledit procede. |
Country Status (4)
Country | Link |
---|---|
CH (1) | CH687490A5 (fr) |
DE (1) | DE4305399B4 (fr) |
FR (1) | FR2689360B1 (fr) |
GB (1) | GB2265496B (fr) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4439239A1 (de) * | 1994-11-03 | 1996-05-09 | Univ Dresden Tech | Schaltungsträger mit beidseitig laminierten Foliensystem |
GB2324200A (en) * | 1997-04-08 | 1998-10-14 | Option Technologies Int Limite | Strengthening and venting of multi-layer printed circuit boards |
US6237304B1 (en) | 1997-07-18 | 2001-05-29 | Henkel Corporation | Laminate structural bulkhead |
GB9814835D0 (en) | 1998-07-08 | 1998-09-09 | Europ Org For Nuclear Research | A thermal management board |
WO2001076330A1 (fr) * | 2000-03-31 | 2001-10-11 | Dyconex Patente Ag | Element de connexion electrique et son procede de fabrication |
DE112009003811B4 (de) * | 2008-12-25 | 2017-04-06 | Mitsubishi Electric Corporation | Verfahren zum Herstellen einer Leiterplatine |
DE102010060855A1 (de) * | 2010-11-29 | 2012-05-31 | Schweizer Electronic Ag | Elektronisches Bauteil, Verfahren zu dessen Herstellung und Leiterplatte mit elektronischem Bauteil |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1312714A (en) * | 1970-04-09 | 1973-04-04 | Gen Electric Co Ltd | Methods of making multilayer printed circuit assemblies |
GB2080729A (en) * | 1980-06-25 | 1982-02-10 | Gen Electric | A multi-layer metal core circuit board laminate with a controlled thermal coefficient of expansion and method for making same. |
DE3027336A1 (de) * | 1980-07-18 | 1982-02-18 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur bohrungsisolierung bei metallkernleiterplatten |
JPS6433998A (en) * | 1987-07-29 | 1989-02-03 | Hitachi Chemical Co Ltd | Manufacture of wiring board with high heat conduction |
JPH0744344B2 (ja) * | 1988-08-30 | 1995-05-15 | 富士通株式会社 | 金属コア内蔵型多層プリント基板の製造方法 |
EP0373363A3 (fr) * | 1988-12-15 | 1991-09-11 | International Business Machines Corporation | Remplissage de trous dans un plan métallique |
EP0393312A1 (fr) * | 1989-04-21 | 1990-10-24 | Dyconex AG | Plaquette de circuit multicouche |
ATE124599T1 (de) * | 1990-04-05 | 1995-07-15 | Dyconex Ag | Herstellung von mehrschichtigen leiterplatten mit erhöhter leiterbahnendichte. |
-
1992
- 1992-03-25 CH CH93892A patent/CH687490A5/de not_active IP Right Cessation
-
1993
- 1993-02-22 DE DE19934305399 patent/DE4305399B4/de not_active Expired - Lifetime
- 1993-03-12 FR FR9302873A patent/FR2689360B1/fr not_active Expired - Fee Related
- 1993-03-23 GB GB9305962A patent/GB2265496B/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
GB9305962D0 (en) | 1993-05-12 |
DE4305399B4 (de) | 2006-08-24 |
FR2689360A1 (fr) | 1993-10-01 |
DE4305399A1 (de) | 1993-09-30 |
GB2265496B (en) | 1995-05-31 |
CH687490A5 (de) | 1996-12-13 |
GB2265496A (en) | 1993-09-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |