FR2659344B1 - - Google Patents
Info
- Publication number
- FR2659344B1 FR2659344B1 FR9003037A FR9003037A FR2659344B1 FR 2659344 B1 FR2659344 B1 FR 2659344B1 FR 9003037 A FR9003037 A FR 9003037A FR 9003037 A FR9003037 A FR 9003037A FR 2659344 B1 FR2659344 B1 FR 2659344B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/751—Means for controlling the bonding environment, e.g. valves, vacuum pumps
- H01L2224/75101—Chamber
- H01L2224/75102—Vacuum chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75314—Auxiliary members on the pressing surface
- H01L2224/75315—Elastomer inlay
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75314—Auxiliary members on the pressing surface
- H01L2224/75317—Removable auxiliary member
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/085—Using vacuum or low pressure
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9003037A FR2659344A1 (en) | 1990-03-09 | 1990-03-09 | Process for bubble-free instantaneous adhesive bonding, especially of surfaces of rigid and nonporous components, and device for its use |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9003037A FR2659344A1 (en) | 1990-03-09 | 1990-03-09 | Process for bubble-free instantaneous adhesive bonding, especially of surfaces of rigid and nonporous components, and device for its use |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2659344A1 FR2659344A1 (en) | 1991-09-13 |
FR2659344B1 true FR2659344B1 (en) | 1995-01-06 |
Family
ID=9394579
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9003037A Granted FR2659344A1 (en) | 1990-03-09 | 1990-03-09 | Process for bubble-free instantaneous adhesive bonding, especially of surfaces of rigid and nonporous components, and device for its use |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2659344A1 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5556493A (en) * | 1995-01-13 | 1996-09-17 | Libbey-Owens-Ford Co. | Mounting an optical moisture sensor on a windshield using a vacuum chamber device |
US5605547A (en) * | 1995-03-27 | 1997-02-25 | Micron Technology, Inc. | Method and apparatus for mounting a component to a substrate using an anisotropic adhesive, a compressive cover film, and a conveyor |
DE19616073A1 (en) * | 1996-04-23 | 1997-10-30 | Teves Gmbh Alfred | Device for bubble-free fixing of components to be glued |
DE19755088A1 (en) * | 1997-12-11 | 1999-06-17 | Daimler Chrysler Ag | Calibrated bonding device for bubble-free adhesive bonding of structured semiconductor wafers |
DE19946745C1 (en) * | 1999-09-29 | 2001-04-05 | Siemens Ag | Surface bonding, for use in e.g. circuit boards, uses laid adhesive strand between surfaces forming sealed zone where pressure difference is formed through surface opening to press surfaces together without mechanical or manual pressures |
DE10102848B4 (en) * | 2000-05-31 | 2004-04-15 | Sebastian Erb | Process for positive and bubble-free gluing of populated or non-populated printed circuits with flat heat sinks using adhesive foils |
DE10209615A1 (en) * | 2002-03-05 | 2003-09-18 | Bosch Gmbh Robert | Device and method for fixing a sensor means |
FR2873499B1 (en) * | 2004-07-23 | 2007-05-25 | Thales Sa | PROCESS FOR SOLDING OR ASSEMBLING MULTIPLE ELEMENTS |
US7416011B2 (en) * | 2005-01-27 | 2008-08-26 | Delphi Technologies, Inc. | Electronic assembly having a substrate laminated within a backplate cavity |
DE102009049386B4 (en) * | 2009-10-14 | 2018-06-28 | Pierburg Pump Technology Gmbh | Method and device for bonding by means of vacuum |
EP2521430A1 (en) * | 2011-05-06 | 2012-11-07 | Pierburg Pump Technology GmbH | Method for fixing a PCB to a body and pump driven by an electric motor |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS536341A (en) * | 1976-07-06 | 1978-01-20 | Nitto Electric Ind Co Ltd | Method for vacuum pressure application |
JPS63238182A (en) * | 1987-03-26 | 1988-10-04 | Chiyouwa Kogyo Kk | Bonding of adhesive sheet and device therefor |
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1990
- 1990-03-09 FR FR9003037A patent/FR2659344A1/en active Granted
Also Published As
Publication number | Publication date |
---|---|
FR2659344A1 (en) | 1991-09-13 |