FR2655508B1 - METHOD FOR PRODUCING MULTI-COMPARTMENT PACKAGES FOR ENCAPSULATION OF MICROELECTRONIC CIRCUITS. - Google Patents

METHOD FOR PRODUCING MULTI-COMPARTMENT PACKAGES FOR ENCAPSULATION OF MICROELECTRONIC CIRCUITS.

Info

Publication number
FR2655508B1
FR2655508B1 FR8915845A FR8915845A FR2655508B1 FR 2655508 B1 FR2655508 B1 FR 2655508B1 FR 8915845 A FR8915845 A FR 8915845A FR 8915845 A FR8915845 A FR 8915845A FR 2655508 B1 FR2655508 B1 FR 2655508B1
Authority
FR
France
Prior art keywords
encapsulation
producing multi
microelectronic circuits
compartment packages
packages
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR8915845A
Other languages
French (fr)
Other versions
FR2655508A1 (en
Inventor
Jean Pierre Prouteau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SEPT DOLOY SA
Original Assignee
SEPT DOLOY SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SEPT DOLOY SA filed Critical SEPT DOLOY SA
Priority to FR8915845A priority Critical patent/FR2655508B1/en
Publication of FR2655508A1 publication Critical patent/FR2655508A1/en
Application granted granted Critical
Publication of FR2655508B1 publication Critical patent/FR2655508B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H05K5/0095—Housing specially adapted for small components hermetically-sealed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Casings For Electric Apparatus (AREA)
FR8915845A 1989-12-01 1989-12-01 METHOD FOR PRODUCING MULTI-COMPARTMENT PACKAGES FOR ENCAPSULATION OF MICROELECTRONIC CIRCUITS. Expired - Fee Related FR2655508B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8915845A FR2655508B1 (en) 1989-12-01 1989-12-01 METHOD FOR PRODUCING MULTI-COMPARTMENT PACKAGES FOR ENCAPSULATION OF MICROELECTRONIC CIRCUITS.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8915845A FR2655508B1 (en) 1989-12-01 1989-12-01 METHOD FOR PRODUCING MULTI-COMPARTMENT PACKAGES FOR ENCAPSULATION OF MICROELECTRONIC CIRCUITS.

Publications (2)

Publication Number Publication Date
FR2655508A1 FR2655508A1 (en) 1991-06-07
FR2655508B1 true FR2655508B1 (en) 1996-04-19

Family

ID=9388010

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8915845A Expired - Fee Related FR2655508B1 (en) 1989-12-01 1989-12-01 METHOD FOR PRODUCING MULTI-COMPARTMENT PACKAGES FOR ENCAPSULATION OF MICROELECTRONIC CIRCUITS.

Country Status (1)

Country Link
FR (1) FR2655508B1 (en)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE7224452U (en) * 1972-06-30 1972-11-30 Licentia Shielding can
US4152671A (en) * 1977-07-25 1979-05-01 Atari, Inc. Oscillator-modulator apparatus and method therefor
JPS5961998A (en) * 1982-09-30 1984-04-09 富士通株式会社 Integrated circuit board containing housing structure
US4649229A (en) * 1985-08-12 1987-03-10 Aegis, Inc. All metal flat package for microcircuitry

Also Published As

Publication number Publication date
FR2655508A1 (en) 1991-06-07

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Legal Events

Date Code Title Description
ST Notification of lapse