FR2655508B1 - METHOD FOR PRODUCING MULTI-COMPARTMENT PACKAGES FOR ENCAPSULATION OF MICROELECTRONIC CIRCUITS. - Google Patents
METHOD FOR PRODUCING MULTI-COMPARTMENT PACKAGES FOR ENCAPSULATION OF MICROELECTRONIC CIRCUITS.Info
- Publication number
- FR2655508B1 FR2655508B1 FR8915845A FR8915845A FR2655508B1 FR 2655508 B1 FR2655508 B1 FR 2655508B1 FR 8915845 A FR8915845 A FR 8915845A FR 8915845 A FR8915845 A FR 8915845A FR 2655508 B1 FR2655508 B1 FR 2655508B1
- Authority
- FR
- France
- Prior art keywords
- encapsulation
- producing multi
- microelectronic circuits
- compartment packages
- packages
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0091—Housing specially adapted for small components
- H05K5/0095—Housing specially adapted for small components hermetically-sealed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Casings For Electric Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8915845A FR2655508B1 (en) | 1989-12-01 | 1989-12-01 | METHOD FOR PRODUCING MULTI-COMPARTMENT PACKAGES FOR ENCAPSULATION OF MICROELECTRONIC CIRCUITS. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8915845A FR2655508B1 (en) | 1989-12-01 | 1989-12-01 | METHOD FOR PRODUCING MULTI-COMPARTMENT PACKAGES FOR ENCAPSULATION OF MICROELECTRONIC CIRCUITS. |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2655508A1 FR2655508A1 (en) | 1991-06-07 |
FR2655508B1 true FR2655508B1 (en) | 1996-04-19 |
Family
ID=9388010
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8915845A Expired - Fee Related FR2655508B1 (en) | 1989-12-01 | 1989-12-01 | METHOD FOR PRODUCING MULTI-COMPARTMENT PACKAGES FOR ENCAPSULATION OF MICROELECTRONIC CIRCUITS. |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2655508B1 (en) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE7224452U (en) * | 1972-06-30 | 1972-11-30 | Licentia | Shielding can |
US4152671A (en) * | 1977-07-25 | 1979-05-01 | Atari, Inc. | Oscillator-modulator apparatus and method therefor |
JPS5961998A (en) * | 1982-09-30 | 1984-04-09 | 富士通株式会社 | Integrated circuit board containing housing structure |
US4649229A (en) * | 1985-08-12 | 1987-03-10 | Aegis, Inc. | All metal flat package for microcircuitry |
-
1989
- 1989-12-01 FR FR8915845A patent/FR2655508B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2655508A1 (en) | 1991-06-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |