FR2640430B1 - Composant opto-electronique comprenant, notamment un boitier dans lequel est decoupee une fenetre - Google Patents

Composant opto-electronique comprenant, notamment un boitier dans lequel est decoupee une fenetre

Info

Publication number
FR2640430B1
FR2640430B1 FR8816222A FR8816222A FR2640430B1 FR 2640430 B1 FR2640430 B1 FR 2640430B1 FR 8816222 A FR8816222 A FR 8816222A FR 8816222 A FR8816222 A FR 8816222A FR 2640430 B1 FR2640430 B1 FR 2640430B1
Authority
FR
France
Prior art keywords
opto
window
housing
cut
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR8816222A
Other languages
English (en)
Other versions
FR2640430A1 (fr
Inventor
Christian Caville
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel CIT SA
Original Assignee
Alcatel CIT SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel CIT SA filed Critical Alcatel CIT SA
Priority to FR8816222A priority Critical patent/FR2640430B1/fr
Publication of FR2640430A1 publication Critical patent/FR2640430A1/fr
Application granted granted Critical
Publication of FR2640430B1 publication Critical patent/FR2640430B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
FR8816222A 1988-12-09 1988-12-09 Composant opto-electronique comprenant, notamment un boitier dans lequel est decoupee une fenetre Expired - Fee Related FR2640430B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8816222A FR2640430B1 (fr) 1988-12-09 1988-12-09 Composant opto-electronique comprenant, notamment un boitier dans lequel est decoupee une fenetre

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8816222A FR2640430B1 (fr) 1988-12-09 1988-12-09 Composant opto-electronique comprenant, notamment un boitier dans lequel est decoupee une fenetre

Publications (2)

Publication Number Publication Date
FR2640430A1 FR2640430A1 (fr) 1990-06-15
FR2640430B1 true FR2640430B1 (fr) 1992-07-31

Family

ID=9372775

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8816222A Expired - Fee Related FR2640430B1 (fr) 1988-12-09 1988-12-09 Composant opto-electronique comprenant, notamment un boitier dans lequel est decoupee une fenetre

Country Status (1)

Country Link
FR (1) FR2640430B1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4210331A1 (de) * 1992-03-30 1993-10-07 Bodenseewerk Geraetetech Verbindung einer Fotodiode mit einem Lichtwellenleiter
US6130448A (en) * 1998-08-21 2000-10-10 Gentex Corporation Optical sensor package and method of making same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1581436A (en) * 1977-05-30 1980-12-17 Emi Ltd Semiconductor device encapsulation
US4268113A (en) * 1979-04-16 1981-05-19 International Business Machines Corporation Signal coupling element for substrate-mounted optical transducers
US4355321A (en) * 1981-02-02 1982-10-19 Varian Associates, Inc. Optoelectronic assembly including light transmissive single crystal semiconductor window
JPS59220982A (ja) * 1983-05-31 1984-12-12 Sumitomo Electric Ind Ltd 光素子用パッケ−ジ
EP0175936B1 (fr) * 1984-09-24 1988-11-09 Siemens Aktiengesellschaft Appareil opto-électronique
FR2586825B1 (fr) * 1985-08-28 1987-10-23 Comp Generale Electricite Dispositif de couplage d'une fibre optique a une diode photosensible a eclairement arriere.

Also Published As

Publication number Publication date
FR2640430A1 (fr) 1990-06-15

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Legal Events

Date Code Title Description
ST Notification of lapse