FR2635612B1 - DYNAMIC ADJUSTMENT METHOD AND AUXILIARY FOR HYBRID ELECTRONIC CIRCUIT - Google Patents

DYNAMIC ADJUSTMENT METHOD AND AUXILIARY FOR HYBRID ELECTRONIC CIRCUIT

Info

Publication number
FR2635612B1
FR2635612B1 FR8811012A FR8811012A FR2635612B1 FR 2635612 B1 FR2635612 B1 FR 2635612B1 FR 8811012 A FR8811012 A FR 8811012A FR 8811012 A FR8811012 A FR 8811012A FR 2635612 B1 FR2635612 B1 FR 2635612B1
Authority
FR
France
Prior art keywords
auxiliary
electronic circuit
adjustment method
dynamic adjustment
hybrid electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR8811012A
Other languages
French (fr)
Other versions
FR2635612A1 (en
Inventor
Claude Gelin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cegelec SA
Original Assignee
Cegelec SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cegelec SA filed Critical Cegelec SA
Priority to FR8811012A priority Critical patent/FR2635612B1/en
Publication of FR2635612A1 publication Critical patent/FR2635612A1/en
Application granted granted Critical
Publication of FR2635612B1 publication Critical patent/FR2635612B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
FR8811012A 1988-08-18 1988-08-18 DYNAMIC ADJUSTMENT METHOD AND AUXILIARY FOR HYBRID ELECTRONIC CIRCUIT Expired - Fee Related FR2635612B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8811012A FR2635612B1 (en) 1988-08-18 1988-08-18 DYNAMIC ADJUSTMENT METHOD AND AUXILIARY FOR HYBRID ELECTRONIC CIRCUIT

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8811012A FR2635612B1 (en) 1988-08-18 1988-08-18 DYNAMIC ADJUSTMENT METHOD AND AUXILIARY FOR HYBRID ELECTRONIC CIRCUIT

Publications (2)

Publication Number Publication Date
FR2635612A1 FR2635612A1 (en) 1990-02-23
FR2635612B1 true FR2635612B1 (en) 1992-02-21

Family

ID=9369403

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8811012A Expired - Fee Related FR2635612B1 (en) 1988-08-18 1988-08-18 DYNAMIC ADJUSTMENT METHOD AND AUXILIARY FOR HYBRID ELECTRONIC CIRCUIT

Country Status (1)

Country Link
FR (1) FR2635612B1 (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5635383A (en) * 1979-08-29 1981-04-08 Kyoto Ceramic Semiconductor integrated circuit support with heating mechanism
DE2943675C2 (en) * 1979-10-29 1986-01-16 Burr-Brown Research Corp., Tucson, Ariz. Method for trimming a functional element of an integrated circuit arrangement
US4506139A (en) * 1983-04-04 1985-03-19 Honeywell Inc. Circuit chip
US4626822A (en) * 1985-05-02 1986-12-02 Motorola, Inc. Thick film resistor element with coarse and fine adjustment provision
US4778559A (en) * 1986-10-15 1988-10-18 Advantage Production Technology Semiconductor substrate heater and reactor process and apparatus
US4841170A (en) * 1986-12-08 1989-06-20 John Fluke Mfg. Co., Inc. Temperature controlled hybrid assembly

Also Published As

Publication number Publication date
FR2635612A1 (en) 1990-02-23

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Legal Events

Date Code Title Description
ST Notification of lapse