FR2609820B1 - Dispositif de protection electromagnetique et electrostatique pour cartes electroniques et procede de realisation de ce dispositif - Google Patents

Dispositif de protection electromagnetique et electrostatique pour cartes electroniques et procede de realisation de ce dispositif

Info

Publication number
FR2609820B1
FR2609820B1 FR8700578A FR8700578A FR2609820B1 FR 2609820 B1 FR2609820 B1 FR 2609820B1 FR 8700578 A FR8700578 A FR 8700578A FR 8700578 A FR8700578 A FR 8700578A FR 2609820 B1 FR2609820 B1 FR 2609820B1
Authority
FR
France
Prior art keywords
electromagnetic
producing
electrostatic protection
electronic boards
protection device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR8700578A
Other languages
English (en)
Other versions
FR2609820A1 (fr
Inventor
Francis Steffen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thomson Semiconducteurs SA
Original Assignee
Thomson Semiconducteurs SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson Semiconducteurs SA filed Critical Thomson Semiconducteurs SA
Priority to FR8700578A priority Critical patent/FR2609820B1/fr
Publication of FR2609820A1 publication Critical patent/FR2609820A1/fr
Application granted granted Critical
Publication of FR2609820B1 publication Critical patent/FR2609820B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/16153—Cap enclosing a plurality of side-by-side cavities [e.g. E-shaped cap]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/1617—Cavity coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Credit Cards Or The Like (AREA)
FR8700578A 1987-01-20 1987-01-20 Dispositif de protection electromagnetique et electrostatique pour cartes electroniques et procede de realisation de ce dispositif Expired - Fee Related FR2609820B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8700578A FR2609820B1 (fr) 1987-01-20 1987-01-20 Dispositif de protection electromagnetique et electrostatique pour cartes electroniques et procede de realisation de ce dispositif

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8700578A FR2609820B1 (fr) 1987-01-20 1987-01-20 Dispositif de protection electromagnetique et electrostatique pour cartes electroniques et procede de realisation de ce dispositif

Publications (2)

Publication Number Publication Date
FR2609820A1 FR2609820A1 (fr) 1988-07-22
FR2609820B1 true FR2609820B1 (fr) 1991-04-19

Family

ID=9347057

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8700578A Expired - Fee Related FR2609820B1 (fr) 1987-01-20 1987-01-20 Dispositif de protection electromagnetique et electrostatique pour cartes electroniques et procede de realisation de ce dispositif

Country Status (1)

Country Link
FR (1) FR2609820B1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2559849B2 (ja) * 1989-05-23 1996-12-04 三菱電機株式会社 Ｉｃカード
US5244840A (en) * 1989-05-23 1993-09-14 Mitsubishi Denki Kabushiki Kaisha Method for manufacturing an encapsulated IC card having a molded frame and a circuit board
JPH04153096A (ja) * 1990-10-18 1992-05-26 Mitsubishi Electric Corp 携帯用記憶装置
CA2290184A1 (fr) * 1999-11-22 2001-05-22 David Perron Ameliorations de cartes d'authentification
DE10003112C1 (de) * 2000-01-13 2001-07-26 Infineon Technologies Ag Chip mit allseitigem Schutz sensitiver Schaltungsteile vor Zugriff durch Nichtberechtigte durch Abschirmanordnungen (Shields) unter Verwendung eines Hilfschips
GB2382469A (en) * 2001-11-23 2003-05-28 Marconi Optical Components Ltd Shielding for electromagnetic interference

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2480008A1 (fr) * 1980-04-04 1981-10-09 Flonic Sa Perfectionnements aux cartes a memoire
JPS5785866A (en) * 1980-11-18 1982-05-28 Mitsubishi Metal Corp Antistatic transparent paint
DE3118298A1 (de) * 1981-05-08 1982-12-02 Gao Ges Automation Org Ausweiskarte mit eingelagertem ic-baustein
FR2512990B1 (fr) * 1981-09-11 1987-06-19 Radiotechnique Compelec Procede pour fabriquer une carte de paiement electronique, et carte realisee selon ce procede
FR2517165A1 (fr) * 1981-11-20 1983-05-27 Radiotechnique Compelec Procede pour munir d'un ecran un circuit electronique, et carte de paiement munie d'un ecran
US4409471A (en) * 1981-12-17 1983-10-11 Seiichiro Aigo Information card

Also Published As

Publication number Publication date
FR2609820A1 (fr) 1988-07-22

Similar Documents

Publication Publication Date Title
FR2648667B1 (fr) Procede et dispositif pour la realisation de pieces de cablage
FR2486685B1 (fr) Carte de paiement electronique et procede de realisation
FR2610214B1 (fr) Procede et dispositif de filtration
DE69227066D1 (de) Elektronische Vorrichtung
FR2535498B1 (fr) Procede et dispositif d'affichage par plasma
NO180095C (no) Elektronisk overvåkningssystem for gjenstander
DE69333123D1 (de) Elektronische Vorrichtung
PT78815B (fr) Dispositif et procede de refroidissement de feuilles
DE3152626D2 (de) Electronic device for the energization of an electromagnetic element
DE69027359T2 (de) Elektronische Vorrichtung
DE3475125D1 (en) Electronic identification device
FR2622596B1 (fr) Procede et dispositif de decokage
FR2589278B1 (fr) Dispositif electronique pour proteger des circuits integres des charges electrostatiques et procede pour le fabriquer
FR2609820B1 (fr) Dispositif de protection electromagnetique et electrostatique pour cartes electroniques et procede de realisation de ce dispositif
DE69132791T2 (de) Elektronische Vorrichtung
EP0406895A3 (en) An electronic apparatus
FR2496328B1 (fr) Procede et dispositif pour la realisation de surfaces exterieures d'isolateurs
FR2555336B1 (fr) Dispositif d'agenda electronique et procede de fonctionnement
BR8403774A (pt) Sistema eletronico de vigilancia sobre artigos
FR2529911B1 (fr) Procede et dispositif pour la realisation de revetements protecteurs metalliques
FR2619943B1 (fr) Procede et dispositif d'encaissement
FR2725032B1 (fr) Procede et dispositif de contre-mesure remorque pour aeronef
FR2540441B1 (fr) Procede et dispositif pour la pose d'elements decoratifs adhesifs
FR2524825B1 (fr) Procede et dispositif de tamisage
EP0319827A3 (en) Wiring method and apparatus for electronic circuit boards or the like

Legal Events

Date Code Title Description
ST Notification of lapse