FR2579371B1 - Procede et dispositif de refroidissement pour diodes et thyristors de puissance, mettant en oeuvre le principe du thermosiphon biphase - Google Patents
Procede et dispositif de refroidissement pour diodes et thyristors de puissance, mettant en oeuvre le principe du thermosiphon biphaseInfo
- Publication number
- FR2579371B1 FR2579371B1 FR8504027A FR8504027A FR2579371B1 FR 2579371 B1 FR2579371 B1 FR 2579371B1 FR 8504027 A FR8504027 A FR 8504027A FR 8504027 A FR8504027 A FR 8504027A FR 2579371 B1 FR2579371 B1 FR 2579371B1
- Authority
- FR
- France
- Prior art keywords
- thyristors
- principle
- cooling method
- power diodes
- phase thermosiphon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8504027A FR2579371B1 (fr) | 1985-03-19 | 1985-03-19 | Procede et dispositif de refroidissement pour diodes et thyristors de puissance, mettant en oeuvre le principe du thermosiphon biphase |
ES543609A ES8702082A1 (es) | 1985-03-19 | 1985-05-29 | Perfeccionamientos en los sistemas de enfriaiento de dispositivos electronicos de potencia. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8504027A FR2579371B1 (fr) | 1985-03-19 | 1985-03-19 | Procede et dispositif de refroidissement pour diodes et thyristors de puissance, mettant en oeuvre le principe du thermosiphon biphase |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2579371A1 FR2579371A1 (fr) | 1986-09-26 |
FR2579371B1 true FR2579371B1 (fr) | 1987-09-11 |
Family
ID=9317330
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8504027A Expired FR2579371B1 (fr) | 1985-03-19 | 1985-03-19 | Procede et dispositif de refroidissement pour diodes et thyristors de puissance, mettant en oeuvre le principe du thermosiphon biphase |
Country Status (2)
Country | Link |
---|---|
ES (1) | ES8702082A1 (fr) |
FR (1) | FR2579371B1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6896039B2 (en) | 1999-05-12 | 2005-05-24 | Thermal Corp. | Integrated circuit heat pipe heat spreader with through mounting holes |
US6302192B1 (en) * | 1999-05-12 | 2001-10-16 | Thermal Corp. | Integrated circuit heat pipe heat spreader with through mounting holes |
WO2010050129A1 (fr) * | 2008-10-29 | 2010-05-06 | 日本電気株式会社 | Structure de refroidissement, dispositif électronique et procédé de refroidissement |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2102254B2 (de) * | 1971-01-19 | 1973-05-30 | Robert Bosch Gmbh, 7000 Stuttgart | Kuehlvorrichtung fuer leistungshalbleiterbauelemente |
-
1985
- 1985-03-19 FR FR8504027A patent/FR2579371B1/fr not_active Expired
- 1985-05-29 ES ES543609A patent/ES8702082A1/es not_active Expired
Also Published As
Publication number | Publication date |
---|---|
ES8702082A1 (es) | 1987-01-01 |
ES543609A0 (es) | 1987-01-01 |
FR2579371A1 (fr) | 1986-09-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |