FR2539915B3 - - Google Patents

Info

Publication number
FR2539915B3
FR2539915B3 FR8400795A FR8400795A FR2539915B3 FR 2539915 B3 FR2539915 B3 FR 2539915B3 FR 8400795 A FR8400795 A FR 8400795A FR 8400795 A FR8400795 A FR 8400795A FR 2539915 B3 FR2539915 B3 FR 2539915B3
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8400795A
Other languages
French (fr)
Other versions
FR2539915A1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri AG Switzerland
BBC Brown Boveri AG Germany
Original Assignee
BBC Brown Boveri AG Switzerland
BBC Brown Boveri AG Germany
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC Brown Boveri AG Switzerland, BBC Brown Boveri AG Germany filed Critical BBC Brown Boveri AG Switzerland
Publication of FR2539915A1 publication Critical patent/FR2539915A1/en
Application granted granted Critical
Publication of FR2539915B3 publication Critical patent/FR2539915B3/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10045—Mounted network component having plural terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/171—Tuning, e.g. by trimming of printed components or high frequency circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
FR8400795A 1983-01-20 1984-01-19 MULTI-LAYER ELECTRIC OR ELECTRONIC COMPONENT Granted FR2539915A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19833301673 DE3301673A1 (en) 1983-01-20 1983-01-20 ELECTRICAL OR ELECTRONIC MULTILAYER COMPONENT

Publications (2)

Publication Number Publication Date
FR2539915A1 FR2539915A1 (en) 1984-07-27
FR2539915B3 true FR2539915B3 (en) 1985-05-17

Family

ID=6188658

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8400795A Granted FR2539915A1 (en) 1983-01-20 1984-01-19 MULTI-LAYER ELECTRIC OR ELECTRONIC COMPONENT

Country Status (4)

Country Link
JP (1) JPS59138359A (en)
DE (1) DE3301673A1 (en)
FR (1) FR2539915A1 (en)
GB (1) GB2133933B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2231728A (en) * 1989-05-16 1990-11-21 Lucas Ind Plc Trimming a variable resistor
DE4031289A1 (en) * 1990-10-04 1992-04-09 Telefunken Electronic Gmbh Oscillator with amplifier, and feedback elements - has flat capacitor as frequency determining and equalising element
DE4304437A1 (en) * 1993-02-13 1994-08-18 Ego Elektro Blanc & Fischer Integrated circuit, in particular for contact switches, and method for producing an integrated circuit
EP0725981B1 (en) * 1994-08-25 2002-01-02 National Semiconductor Corporation Component stacking in multi-chip semiconductor packages
RU2190284C2 (en) 1998-07-07 2002-09-27 Закрытое акционерное общество "Техно-ТМ" Two-sided electronic device
SE516152C2 (en) 1999-03-17 2001-11-26 Ericsson Telefon Ab L M Apparatus for allowing trimming on a substrate and method for making a substrate for trimming
US6188295B1 (en) * 1999-04-13 2001-02-13 Delta Electronics, Inc. Frequency adjustments by patterning micro-strips to form serially connected capacitors or inductor-capacitor (LC) Circuit
DE10004649A1 (en) * 2000-02-03 2001-08-09 Infineon Technologies Ag Tuning method for signal delays on bus systems or networks between quick memory modules, involves selectively separating strip conductor run from certain capacitive load structures of printed circuit board
DE10310434A1 (en) * 2003-03-11 2004-09-30 Krone Gmbh Method for RF tuning of an electrical arrangement and a circuit board suitable for this
US8202128B2 (en) 2008-11-25 2012-06-19 Adc Gmbh Telecommunications jack with adjustable crosstalk compensation
CN107734848B (en) * 2017-11-16 2020-03-13 珠海市魅族科技有限公司 Printed circuit board packaging structure, manufacturing method, PCB and terminal

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3268773A (en) * 1963-11-21 1966-08-23 Union Carbide Corp Laminate of alternate conductive and dielectric layers
DE2222546C3 (en) * 1972-05-08 1979-10-31 Siemens Ag, 1000 Berlin Und 8000 Muenchen Electrical RC component
US3988824A (en) * 1972-05-22 1976-11-02 Hewlett-Packard Company Method for manufacturing thin film circuits
DE2247279A1 (en) * 1972-09-27 1974-04-04 Siemens Ag PROCEDURES FOR CONTACTING AND / OR WIRING ELECTRICAL COMPONENTS
CH589996A5 (en) * 1974-08-30 1977-07-29 Ebauches Sa
DE7602001U1 (en) * 1976-01-26 1978-05-24 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt COMPARABLE RESISTANCE
DE2622324C3 (en) * 1976-05-19 1980-10-02 Siemens Ag, 1000 Berlin Und 8000 Muenchen Process for the production of a precisely balanced electrical network
US4301439A (en) * 1978-12-26 1981-11-17 Electro Materials Corp. Of America Film type resistor and method of producing same
DE2903025C2 (en) * 1979-01-26 1983-05-05 Siemens AG, 1000 Berlin und 8000 München Rc network

Also Published As

Publication number Publication date
FR2539915A1 (en) 1984-07-27
GB8400678D0 (en) 1984-02-15
GB2133933B (en) 1987-01-28
DE3301673A1 (en) 1984-07-26
GB2133933A (en) 1984-08-01
JPS59138359A (en) 1984-08-08

Similar Documents

Publication Publication Date Title
BR8407173A (en)
GR79106B (en)
GR82241B (en)
FR2539915B3 (en)
FR2550951B3 (en)
AT378328B (en)
FR2546730B3 (en)
FR2541660B1 (en)
GR71349B (en)
AU9008182A (en)
GR72677B (en)
GR71409B (en)
AU1412583A (en)
GR71762B (en)
GR71833B (en)
GR72233B (en)
AU1299683A (en)
GR81995B (en)
BR6301293U (en)
GR73260B (en)
BG44974A1 (en)
BG44587A1 (en)
BG44583A1 (en)
BG44569A1 (en)
BG44981A1 (en)

Legal Events

Date Code Title Description
ST Notification of lapse