FR2516703B1 - Procede de fixation et d'isolation d'un dispositif semi-conducteur sur une plaque de refroidissement - Google Patents
Procede de fixation et d'isolation d'un dispositif semi-conducteur sur une plaque de refroidissementInfo
- Publication number
- FR2516703B1 FR2516703B1 FR8219301A FR8219301A FR2516703B1 FR 2516703 B1 FR2516703 B1 FR 2516703B1 FR 8219301 A FR8219301 A FR 8219301A FR 8219301 A FR8219301 A FR 8219301A FR 2516703 B1 FR2516703 B1 FR 2516703B1
- Authority
- FR
- France
- Prior art keywords
- isolating
- fixing
- semiconductor device
- cooling plate
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3731—Ceramic materials or glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/142—Metallic substrates having insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45147—Copper (Cu) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
- H01L2224/48139—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous wire daisy chain
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8134693 | 1981-11-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2516703A1 FR2516703A1 (fr) | 1983-05-20 |
FR2516703B1 true FR2516703B1 (fr) | 1986-02-07 |
Family
ID=10525963
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8219301A Expired FR2516703B1 (fr) | 1981-11-18 | 1982-11-18 | Procede de fixation et d'isolation d'un dispositif semi-conducteur sur une plaque de refroidissement |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2516703B1 (fr) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH382297A (de) * | 1959-02-27 | 1964-09-30 | Siemens Ag | Trockengleichrichteranordnung |
DE1242758B (de) * | 1961-04-07 | 1967-06-22 | Siemens Ag | Halbleiteranordnung, insbesondere fuer grosse Leistungen, bei der ein duenner, scheibenfoermiger Halbleiterkoerper auf einer Traegerplatte befestigt ist |
US3526814A (en) * | 1968-04-03 | 1970-09-01 | Itt | Heat sink arrangement for a semiconductor device |
DE2837300A1 (de) * | 1978-08-26 | 1980-03-06 | Bbc Brown Boveri & Cie | Halbleiteranordnung |
JPS5550646A (en) * | 1978-10-06 | 1980-04-12 | Hitachi Ltd | Integrated circuit device |
JPS5837713B2 (ja) * | 1978-12-01 | 1983-08-18 | 富士通株式会社 | 半導体レ−ザ−装置の製造方法 |
JPS5662349A (en) * | 1979-10-26 | 1981-05-28 | Hitachi Ltd | Semiconductor device |
-
1982
- 1982-11-18 FR FR8219301A patent/FR2516703B1/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
FR2516703A1 (fr) | 1983-05-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |