FR2458203A1 - Plaquette de circuit imprime, broche de soudage electrique pour cette plaquette, systeme et procede de fabrication correspondants - Google Patents

Plaquette de circuit imprime, broche de soudage electrique pour cette plaquette, systeme et procede de fabrication correspondants

Info

Publication number
FR2458203A1
FR2458203A1 FR8012157A FR8012157A FR2458203A1 FR 2458203 A1 FR2458203 A1 FR 2458203A1 FR 8012157 A FR8012157 A FR 8012157A FR 8012157 A FR8012157 A FR 8012157A FR 2458203 A1 FR2458203 A1 FR 2458203A1
Authority
FR
France
Prior art keywords
board
electric welding
printed circuit
circuit board
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
FR8012157A
Other languages
English (en)
Inventor
Larry R Conley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Interconnection Tech Inc
Original Assignee
Interconnection Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Interconnection Tech Inc filed Critical Interconnection Tech Inc
Publication of FR2458203A1 publication Critical patent/FR2458203A1/fr
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007Surface contacts, e.g. bumps
    • H05K3/4015Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/55Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0286Programmable, customizable or modifiable circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0286Programmable, customizable or modifiable circuits
    • H05K1/0287Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10287Metal wires as connectors or conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10295Metallic connector elements partly mounted in a hole of the PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954Other details of electrical connections
    • H05K2201/10962Component not directly connected to the PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/222Completing of printed circuits by adding non-printed jumper connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3468Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

UNE PLAQUETTE DE CIRCUIT IMPRIME COMPORTE DES REGIONS DE CONNEXION 16 ET CHACUNE D'ELLES COMPORTE AU MOINS DEUX TROUS METALLISES. L'UN DES TROUS RECOIT UN CONDUCTEUR 22 D'UN COMPOSANT QUI EST SOUDE PAR DE LA SOUDURE 42 TANDIS QU'UNE BROCHE DE SOUDAGE ELECTRIQUE 44 EST EMMANCHEE DANS L'AUTRE TROU POUR PERMETTRE LE SOUDAGE ELECTRIQUE D'UN FIL 24.
FR8012157A 1979-06-01 1980-05-30 Plaquette de circuit imprime, broche de soudage electrique pour cette plaquette, systeme et procede de fabrication correspondants Pending FR2458203A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/044,404 US4242719A (en) 1979-06-01 1979-06-01 Solder-weld P.C. board apparatus

Publications (1)

Publication Number Publication Date
FR2458203A1 true FR2458203A1 (fr) 1980-12-26

Family

ID=21932205

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8012157A Pending FR2458203A1 (fr) 1979-06-01 1980-05-30 Plaquette de circuit imprime, broche de soudage electrique pour cette plaquette, systeme et procede de fabrication correspondants

Country Status (5)

Country Link
US (1) US4242719A (fr)
JP (1) JPS5645097A (fr)
DE (1) DE3020640A1 (fr)
FR (1) FR2458203A1 (fr)
GB (1) GB2050067B (fr)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2479638A1 (fr) * 1980-03-25 1981-10-02 Thomson Csf Support de composant electronique pour carte de cablage
JPS5842262A (ja) * 1981-09-07 1983-03-11 Toshiba Corp 混成集積回路のリ−ド線接続方法
US4639566A (en) * 1981-12-16 1987-01-27 Abbott-Interfast Corporation DIP switch assembly having side extending leads
US4484170A (en) * 1983-02-25 1984-11-20 Ncr Corporation Dot matrix print head solenoid assembly
US4924353A (en) * 1985-12-20 1990-05-08 Hughes Aircraft Company Connector system for coupling to an integrated circuit chip
US4902606A (en) * 1985-12-20 1990-02-20 Hughes Aircraft Company Compressive pedestal for microminiature connections
FR2594262B1 (fr) * 1986-02-13 1988-10-28 Thomas & Betts Corp Ensemble de connexion a une carte de circuit imprime par douilles de contact.
EP0355273B1 (fr) * 1988-05-18 1994-08-03 Canon Kabushiki Kaisha Carte de sondes de mesure, méthode pour mesurer un élément à être mesuré utilisant celle-ci et part de circuit électrique
US4965700A (en) * 1988-05-26 1990-10-23 International Business Machines Corporation Thin film package for mixed bonding of chips
US5073118A (en) * 1988-12-08 1991-12-17 Amp Incorporated Surface mounting an electronic component
US4982376A (en) * 1989-04-20 1991-01-01 U.S. Philips Corporation Method of mounting electrical and/or electronic components on a single-sided printed board
US5144535A (en) * 1989-04-20 1992-09-01 U.S. Philips Corporation Method of mounting electrical and/or electronic components of a printed circuit board
JP3290041B2 (ja) * 1995-02-17 2002-06-10 インターナショナル・ビジネス・マシーンズ・コーポレーション 多層プリント基板、多層プリント基板の製造方法
US6299055B1 (en) * 1997-05-09 2001-10-09 Lear Automotive Dearborn, Inc. Manufacturing processes of service boxes and their parts
JP3351410B2 (ja) * 1999-12-20 2002-11-25 株式会社村田製作所 インバータ用コンデンサモジュール、インバータ及びコンデンサモジュール
WO2001069990A1 (fr) * 2000-03-15 2001-09-20 Matsushita Electric Industrial Co., Ltd. Structure liee et carte a circuit imprime electronique
US6739881B2 (en) * 2001-05-31 2004-05-25 Trw Inc. High integration electronic assembly and method
US20030205059A1 (en) * 2002-05-02 2003-11-06 Hussmann Corporation Merchandisers having anti-fog coatings and methods for making the same
US20080144299A1 (en) * 2004-07-15 2008-06-19 Redmond Frank E Systems for and methods of circuit construction
US9406817B2 (en) * 2012-09-13 2016-08-02 International Business Machines Corporation Lead frame package for solar concentrators
CN208490858U (zh) * 2018-07-11 2019-02-15 深圳市艾维普思科技有限公司 雾化器及电子烟

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3469019A (en) * 1963-03-14 1969-09-23 Litton Systems Inc Weldable printed circuit board
US3566005A (en) * 1969-03-04 1971-02-23 North American Rockwell Circuit board with weld locations and process for producing the circuit board
FR2210078A1 (fr) * 1972-12-07 1974-07-05 Accra Point Arrays
US3880486A (en) * 1973-03-05 1975-04-29 Epis Corp Apparatus and system for interconnecting circuits and electronic components

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3256465A (en) * 1962-06-08 1966-06-14 Signetics Corp Semiconductor device assembly with true metallurgical bonds
DE1230869B (de) * 1965-08-30 1966-12-22 Siemens Ag Fertigungsverfahren und Vorrichtung zur Durchfuehrung des Verfahrens fuer mit verdrahteten Anschlusselementen bestueckte Platten, fuer Fernmelde-, insbesondere Fernsprechanlagen
US3674914A (en) * 1968-02-09 1972-07-04 Photocircuits Corp Wire scribed circuit boards and method of manufacture
US3626086A (en) * 1970-04-28 1971-12-07 Computer Ind Inc Wire-routing system
US4097684A (en) * 1971-12-20 1978-06-27 Kollmorgen Technologies Inc. Electric wiring assemblies
US3777220A (en) * 1972-06-30 1973-12-04 Ibm Circuit panel and method of construction
US4028798A (en) * 1976-04-09 1977-06-14 General Electric Company Method of making electrical connections
US4097101A (en) * 1976-11-22 1978-06-27 Augat Inc. Electrical interconnection boards with lead sockets mounted therein and method for making same
JPS5376372A (en) * 1976-12-17 1978-07-06 Matsushita Electric Ind Co Ltd Device for attaching chip circuit parts
US4110904A (en) * 1977-05-19 1978-09-05 Allen-Bradley Company Substrate with terminal connections and method of making the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3469019A (en) * 1963-03-14 1969-09-23 Litton Systems Inc Weldable printed circuit board
US3566005A (en) * 1969-03-04 1971-02-23 North American Rockwell Circuit board with weld locations and process for producing the circuit board
FR2210078A1 (fr) * 1972-12-07 1974-07-05 Accra Point Arrays
US3880486A (en) * 1973-03-05 1975-04-29 Epis Corp Apparatus and system for interconnecting circuits and electronic components

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
ELECTRONICS, vol. 51, no. 11, 25 mai 1978, New York (US) *

Also Published As

Publication number Publication date
GB2050067B (en) 1984-02-01
JPS5645097A (en) 1981-04-24
GB2050067A (en) 1980-12-31
DE3020640A1 (de) 1980-12-11
US4242719A (en) 1980-12-30

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