FR2454699A2 - Power diode for alternator bridge rectifier - uses encapsulated semiconductor element fitted onto metal base - Google Patents
Power diode for alternator bridge rectifier - uses encapsulated semiconductor element fitted onto metal baseInfo
- Publication number
- FR2454699A2 FR2454699A2 FR7910042A FR7910042A FR2454699A2 FR 2454699 A2 FR2454699 A2 FR 2454699A2 FR 7910042 A FR7910042 A FR 7910042A FR 7910042 A FR7910042 A FR 7910042A FR 2454699 A2 FR2454699 A2 FR 2454699A2
- Authority
- FR
- France
- Prior art keywords
- metal base
- semiconductor element
- base
- bridge rectifier
- fitted onto
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Synchronous Machinery (AREA)
Abstract
The diode consists of a semi-conductor element (4) inside a sealed case. The semiconductor is welded to the shaped metal sole of the case and to a wire (5) thus forming the two connections. The case is part filled with nonconductive resin (11). The side walls of the case are made of a sleeve (1) fixed onto the metal base (3). The base is produced from a metal blank with only two stamping and one cutting operations, the latter to form a lip (10). The sleeve is pressed onto the base and held in place by the rim (8) and the lip of the base. The sleeve is formed in a single operation being pressed into place, shaped and cut off. The rim is formed as a supplementary operation.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7910042A FR2454699A2 (en) | 1979-01-12 | 1979-04-20 | Power diode for alternator bridge rectifier - uses encapsulated semiconductor element fitted onto metal base |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7900748A FR2446541A1 (en) | 1979-01-12 | 1979-01-12 | Power diode for vehicle alternator bridge rectifier - comprises semiconductor element mounted inside cylindrical casing sealed with resin |
FR7910042A FR2454699A2 (en) | 1979-01-12 | 1979-04-20 | Power diode for alternator bridge rectifier - uses encapsulated semiconductor element fitted onto metal base |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2454699A2 true FR2454699A2 (en) | 1980-11-14 |
FR2454699B2 FR2454699B2 (en) | 1983-05-13 |
Family
ID=26220954
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7910042A Granted FR2454699A2 (en) | 1979-01-12 | 1979-04-20 | Power diode for alternator bridge rectifier - uses encapsulated semiconductor element fitted onto metal base |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2454699A2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES2187365A1 (en) * | 2000-08-31 | 2003-06-01 | Valeo Equip Electr Moteur | Power diode for use in rectifier bridge of rotary electric machine such as alternator for automobile vehicles |
WO2005048344A2 (en) * | 2003-11-10 | 2005-05-26 | Robert Bosch Gmbh | Diode |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB975573A (en) * | 1961-05-26 | 1964-11-18 | Standard Telephones Cables Ltd | Improvements in or relating to semiconductor devices |
DE1564749A1 (en) * | 1966-10-27 | 1970-01-08 | Semikron Gleichrichterbau | Semiconductor device |
FR1587284A (en) * | 1967-10-31 | 1970-03-13 | ||
FR2283552A1 (en) * | 1973-07-25 | 1976-03-26 | Semikron Gleichrichterbau | FLUID-COOLED SEMICONDUCTOR RECTIFIER DEVICE |
-
1979
- 1979-04-20 FR FR7910042A patent/FR2454699A2/en active Granted
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB975573A (en) * | 1961-05-26 | 1964-11-18 | Standard Telephones Cables Ltd | Improvements in or relating to semiconductor devices |
DE1564749A1 (en) * | 1966-10-27 | 1970-01-08 | Semikron Gleichrichterbau | Semiconductor device |
FR1587284A (en) * | 1967-10-31 | 1970-03-13 | ||
FR2283552A1 (en) * | 1973-07-25 | 1976-03-26 | Semikron Gleichrichterbau | FLUID-COOLED SEMICONDUCTOR RECTIFIER DEVICE |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES2187365A1 (en) * | 2000-08-31 | 2003-06-01 | Valeo Equip Electr Moteur | Power diode for use in rectifier bridge of rotary electric machine such as alternator for automobile vehicles |
WO2005048344A2 (en) * | 2003-11-10 | 2005-05-26 | Robert Bosch Gmbh | Diode |
WO2005048344A3 (en) * | 2003-11-10 | 2005-07-14 | Bosch Gmbh Robert | Diode |
JP2007511080A (en) * | 2003-11-10 | 2007-04-26 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | diode |
JP4805837B2 (en) * | 2003-11-10 | 2011-11-02 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Press-in diode and method of manufacturing press-in diode |
Also Published As
Publication number | Publication date |
---|---|
FR2454699B2 (en) | 1983-05-13 |
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