FR2450030A1 - Flexible printed circuit board - has component mounting holes internally covered with conductive layer which extends onto circuit board face - Google Patents
Flexible printed circuit board - has component mounting holes internally covered with conductive layer which extends onto circuit board faceInfo
- Publication number
- FR2450030A1 FR2450030A1 FR7904238A FR7904238A FR2450030A1 FR 2450030 A1 FR2450030 A1 FR 2450030A1 FR 7904238 A FR7904238 A FR 7904238A FR 7904238 A FR7904238 A FR 7904238A FR 2450030 A1 FR2450030 A1 FR 2450030A1
- Authority
- FR
- France
- Prior art keywords
- circuit board
- printed circuit
- conductive layer
- flexible printed
- mounting holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09436—Pads or lands on permanent coating which covers the other conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1383—Temporary protective insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The flexible printed circuit board has a polyamide substrate (1) with printed circuit tracks (2) are formed on one or both sides of the substrate. The tracks are covered with a protective insulating layer (5) except in the region of through-holes (3) for component leads. These through-holes (3) are provided with a reinforcing electrically conductive layer (6) which may conveniently connect tracks (4a, 4b) on opposite sides of the substrate. In a modification, the whole of the board is covered with the insulating layer (5) and then a conductive disc applied over the layer at selected hole points. The holes are then drilled and coated with a conductive layer which connects with the conductor tracks.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7904238A FR2450030A1 (en) | 1979-02-20 | 1979-02-20 | Flexible printed circuit board - has component mounting holes internally covered with conductive layer which extends onto circuit board face |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7904238A FR2450030A1 (en) | 1979-02-20 | 1979-02-20 | Flexible printed circuit board - has component mounting holes internally covered with conductive layer which extends onto circuit board face |
Publications (1)
Publication Number | Publication Date |
---|---|
FR2450030A1 true FR2450030A1 (en) | 1980-09-19 |
Family
ID=9222178
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7904238A Pending FR2450030A1 (en) | 1979-02-20 | 1979-02-20 | Flexible printed circuit board - has component mounting holes internally covered with conductive layer which extends onto circuit board face |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2450030A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105945326A (en) * | 2016-07-18 | 2016-09-21 | 苏州工业园区杰智汇电子材料有限公司 | Circuit board drilling cover plate for deep drilling control and control method |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3589004A (en) * | 1968-09-13 | 1971-06-29 | North American Rockwell | Process of making reinforced flat cable terminations |
FR2307438A1 (en) * | 1975-04-10 | 1976-11-05 | Siemens Ag | Printed circuits with conducting transverse bores - starting with thin copper sheets as thin layers |
-
1979
- 1979-02-20 FR FR7904238A patent/FR2450030A1/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3589004A (en) * | 1968-09-13 | 1971-06-29 | North American Rockwell | Process of making reinforced flat cable terminations |
FR2307438A1 (en) * | 1975-04-10 | 1976-11-05 | Siemens Ag | Printed circuits with conducting transverse bores - starting with thin copper sheets as thin layers |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105945326A (en) * | 2016-07-18 | 2016-09-21 | 苏州工业园区杰智汇电子材料有限公司 | Circuit board drilling cover plate for deep drilling control and control method |
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