FR2442570A1 - Procede d'insertion d'une plaque portant des plages de contact metallisees dans un substrat de circuits imprimes et dispositif obtenu - Google Patents
Procede d'insertion d'une plaque portant des plages de contact metallisees dans un substrat de circuits imprimes et dispositif obtenuInfo
- Publication number
- FR2442570A1 FR2442570A1 FR7833431A FR7833431A FR2442570A1 FR 2442570 A1 FR2442570 A1 FR 2442570A1 FR 7833431 A FR7833431 A FR 7833431A FR 7833431 A FR7833431 A FR 7833431A FR 2442570 A1 FR2442570 A1 FR 2442570A1
- Authority
- FR
- France
- Prior art keywords
- board
- tracks
- tracked
- pcb
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/048—Second PCB mounted on first PCB by inserting in window or holes of the first PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09172—Notches between edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09645—Patterning on via walls; Plural lands around one hole
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multi-Conductor Connections (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Procédé d'insertion d'une plaque isolante portant un réseau de plages de contact dans un substrat portant des circuits imprimés. Procédé caractérisé en ce que l'on incise une fente dans ledit substrat, fente dans laquelle est introduit un côté de la plaque isolante selon une direction perpendiculaire à la surface dudit substrat Application au raccordement électrique de circuits hybrides sur un réseau de connexions de circuits imprimés.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7833431A FR2442570A1 (fr) | 1978-11-27 | 1978-11-27 | Procede d'insertion d'une plaque portant des plages de contact metallisees dans un substrat de circuits imprimes et dispositif obtenu |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7833431A FR2442570A1 (fr) | 1978-11-27 | 1978-11-27 | Procede d'insertion d'une plaque portant des plages de contact metallisees dans un substrat de circuits imprimes et dispositif obtenu |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2442570A1 true FR2442570A1 (fr) | 1980-06-20 |
FR2442570B1 FR2442570B1 (fr) | 1983-06-03 |
Family
ID=9215391
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7833431A Granted FR2442570A1 (fr) | 1978-11-27 | 1978-11-27 | Procede d'insertion d'une plaque portant des plages de contact metallisees dans un substrat de circuits imprimes et dispositif obtenu |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2442570A1 (fr) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0065425A2 (fr) * | 1981-05-18 | 1982-11-24 | Matsushita Electric Industrial Co., Ltd. | Composant à circuit intégré hybride et panneau à circuit imprimé pour le montage de ce composant |
EP0089452A1 (fr) * | 1982-03-18 | 1983-09-28 | Robert Bosch Gmbh | Dispositif aide ouie avec circuit d'amplification |
FR2591054A1 (fr) * | 1985-08-29 | 1987-06-05 | Merlin Gerin | Montage de cartes de circuit imprime |
FR2608328A1 (fr) * | 1986-12-10 | 1988-06-17 | Ducellier & Cie | Procede de connexion d'un premier circuit imprime a un deuxieme circuit imprime et circuits imprimes permettant la mise en oeuvre d'un tel procede et ainsi interconnectes |
EP0303975A2 (fr) * | 1987-08-21 | 1989-02-22 | Nokia Mobile Phones Ltd. | Dispositif pour connecter un circuit hybride sur une carte mère |
DE4302196A1 (de) * | 1993-01-27 | 1994-07-28 | Telefunken Microelectron | Verfahren zum Ändern einer Teilfunktion einer elektrischen Baugruppe |
EP0766507A1 (fr) * | 1995-09-12 | 1997-04-02 | Allen-Bradley Company, Inc. | Panneau à circuit avec une ouverture adaptée à recevoir un module d'empaquetage single-in-line |
EP0766504A2 (fr) * | 1995-09-29 | 1997-04-02 | Allen-Bradley Company, Inc. | Système de panneaux à circuit sans fil pour un régulateur de moteur |
US5629839A (en) * | 1995-09-12 | 1997-05-13 | Allen-Bradley Company, Inc. | Module interconnect adapter for reduced parasitic inductance |
US5644475A (en) * | 1994-09-30 | 1997-07-01 | Allen-Bradley Company, Inc. | Solder mask for a finger connector on a single in-line package module |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1054515B (de) * | 1956-04-26 | 1959-04-09 | Fuba Fabrikation Funktechnisch | Gedruckte Verdrahtung oder gedruckte Schaltung mit Leitungskreuzungen |
GB953141A (en) * | 1960-11-23 | 1964-03-25 | Siemens Ag | Improvements in or relating to electrical unit assemblies |
FR2009482A1 (fr) * | 1968-05-28 | 1970-02-06 | Stackpole Carbon Co |
-
1978
- 1978-11-27 FR FR7833431A patent/FR2442570A1/fr active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1054515B (de) * | 1956-04-26 | 1959-04-09 | Fuba Fabrikation Funktechnisch | Gedruckte Verdrahtung oder gedruckte Schaltung mit Leitungskreuzungen |
GB953141A (en) * | 1960-11-23 | 1964-03-25 | Siemens Ag | Improvements in or relating to electrical unit assemblies |
FR2009482A1 (fr) * | 1968-05-28 | 1970-02-06 | Stackpole Carbon Co |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0065425A2 (fr) * | 1981-05-18 | 1982-11-24 | Matsushita Electric Industrial Co., Ltd. | Composant à circuit intégré hybride et panneau à circuit imprimé pour le montage de ce composant |
EP0065425A3 (en) * | 1981-05-18 | 1985-01-09 | Matsushita Electric Industrial Co., Ltd. | Hybrid integrated circuit component and printed circuit board mounting said component |
EP0089452A1 (fr) * | 1982-03-18 | 1983-09-28 | Robert Bosch Gmbh | Dispositif aide ouie avec circuit d'amplification |
FR2591054A1 (fr) * | 1985-08-29 | 1987-06-05 | Merlin Gerin | Montage de cartes de circuit imprime |
FR2608328A1 (fr) * | 1986-12-10 | 1988-06-17 | Ducellier & Cie | Procede de connexion d'un premier circuit imprime a un deuxieme circuit imprime et circuits imprimes permettant la mise en oeuvre d'un tel procede et ainsi interconnectes |
EP0303975A3 (en) * | 1987-08-21 | 1990-07-18 | Nokia-Mobira Oy | An arrangement for connecting a hybrid circuit to a mother board |
EP0303975A2 (fr) * | 1987-08-21 | 1989-02-22 | Nokia Mobile Phones Ltd. | Dispositif pour connecter un circuit hybride sur une carte mère |
DE4302196A1 (de) * | 1993-01-27 | 1994-07-28 | Telefunken Microelectron | Verfahren zum Ändern einer Teilfunktion einer elektrischen Baugruppe |
US5644475A (en) * | 1994-09-30 | 1997-07-01 | Allen-Bradley Company, Inc. | Solder mask for a finger connector on a single in-line package module |
EP0766507A1 (fr) * | 1995-09-12 | 1997-04-02 | Allen-Bradley Company, Inc. | Panneau à circuit avec une ouverture adaptée à recevoir un module d'empaquetage single-in-line |
US5629839A (en) * | 1995-09-12 | 1997-05-13 | Allen-Bradley Company, Inc. | Module interconnect adapter for reduced parasitic inductance |
US5754411A (en) * | 1995-09-12 | 1998-05-19 | Allen-Bradley Company, Inc. | Circuit board having a window adapted to receive a single in-line package module |
EP0766504A2 (fr) * | 1995-09-29 | 1997-04-02 | Allen-Bradley Company, Inc. | Système de panneaux à circuit sans fil pour un régulateur de moteur |
US5648892A (en) * | 1995-09-29 | 1997-07-15 | Allen-Bradley Company, Inc. | Wireless circuit board system for a motor controller |
EP0766504A3 (fr) * | 1995-09-29 | 1999-06-09 | Allen-Bradley Company, Inc. | Système de panneaux à circuit sans fil pour un régulateur de moteur |
Also Published As
Publication number | Publication date |
---|---|
FR2442570B1 (fr) | 1983-06-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |