FR2436498B1 - Boitier plat entierement metallique pour des micro-circuits - Google Patents

Boitier plat entierement metallique pour des micro-circuits

Info

Publication number
FR2436498B1
FR2436498B1 FR7922964A FR7922964A FR2436498B1 FR 2436498 B1 FR2436498 B1 FR 2436498B1 FR 7922964 A FR7922964 A FR 7922964A FR 7922964 A FR7922964 A FR 7922964A FR 2436498 B1 FR2436498 B1 FR 2436498B1
Authority
FR
France
Prior art keywords
micro
circuits
metal flat
flat housing
fully metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7922964A
Other languages
English (en)
Other versions
FR2436498A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Isotronics Inc
Original Assignee
Isotronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Isotronics Inc filed Critical Isotronics Inc
Publication of FR2436498A1 publication Critical patent/FR2436498A1/fr
Application granted granted Critical
Publication of FR2436498B1 publication Critical patent/FR2436498B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
    • Y10T29/49211—Contact or terminal manufacturing by assembling plural parts with bonding of fused material

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Casings For Electric Apparatus (AREA)
  • Lead Frames For Integrated Circuits (AREA)
FR7922964A 1978-09-14 1979-09-14 Boitier plat entierement metallique pour des micro-circuits Expired FR2436498B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/942,334 US4266090A (en) 1978-09-14 1978-09-14 All metal flat package

Publications (2)

Publication Number Publication Date
FR2436498A1 FR2436498A1 (fr) 1980-04-11
FR2436498B1 true FR2436498B1 (fr) 1985-06-21

Family

ID=25477941

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7922964A Expired FR2436498B1 (fr) 1978-09-14 1979-09-14 Boitier plat entierement metallique pour des micro-circuits

Country Status (5)

Country Link
US (1) US4266090A (fr)
CA (1) CA1114936A (fr)
DE (1) DE2937050A1 (fr)
FR (1) FR2436498B1 (fr)
GB (1) GB2032189B (fr)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58140156A (ja) * 1982-02-16 1983-08-19 Canon Inc 固体撮像装置
JPS58190046A (ja) * 1982-04-30 1983-11-05 Fujitsu Ltd 半導体装置
US4451540A (en) * 1982-08-30 1984-05-29 Isotronics, Inc. System for packaging of electronic circuits
EP0131004A1 (fr) * 1982-12-24 1985-01-16 Plessey Overseas Limited Emballages a micro-ondes
FR2539249B1 (fr) * 1983-01-07 1986-08-22 Europ Composants Electron Boitier a dissipation thermique elevee notamment pour microelectronique
US4547624A (en) * 1983-12-02 1985-10-15 Isotronics, Inc. Method and apparatus for reducing package height for microcircuit packages
US4614836A (en) * 1984-03-19 1986-09-30 Axia Incorporated Ground connector for microelectronic circuit case
IL74296A0 (en) * 1984-03-20 1985-05-31 Isotronics Inc Corrosion resistant microcircuit package
FR2564243B1 (fr) * 1984-05-11 1987-02-20 Europ Composants Electron Boitier a dissipation thermique d'encapsulation de circuits electriques
US4649229A (en) * 1985-08-12 1987-03-10 Aegis, Inc. All metal flat package for microcircuitry
EP0233824A3 (fr) * 1986-02-19 1989-06-14 Isotronics, Inc. Boítiers pour micro-circuits
US4950503A (en) * 1989-01-23 1990-08-21 Olin Corporation Process for the coating of a molybdenum base
US5008492A (en) * 1989-10-20 1991-04-16 Hughes Aircraft Company High current feedthrough package
US5051869A (en) * 1990-05-10 1991-09-24 Rockwell International Corporation Advanced co-fired multichip/hybrid package
US5058265A (en) * 1990-05-10 1991-10-22 Rockwell International Corporation Method for packaging a board of electronic components
US5138114A (en) * 1990-09-27 1992-08-11 Texas Instruments Incorporated Hybrid/microwave enclosures and method of making same
US5093989A (en) * 1990-11-13 1992-03-10 Frenchtown Ceramics Co. Method of making heat-resistant hermetic packages for electronic components
US5489803A (en) * 1991-03-22 1996-02-06 Kabushiki Kaisha Tokai Rika Denki Seisakusho Solder-bonded structure
US5361966A (en) * 1992-03-17 1994-11-08 Kabushiki Kaisha Tokai Rika Denki Seisakusho Solder-bonded structure
US5792984A (en) * 1996-07-01 1998-08-11 Cts Corporation Molded aluminum nitride packages
US6400015B1 (en) * 2000-03-31 2002-06-04 Intel Corporation Method of creating shielded structures to protect semiconductor devices
JP2003115565A (ja) * 2001-10-05 2003-04-18 Nec Yamagata Ltd 半導体パッケージ及びその製造方法
CN100337788C (zh) * 2005-05-25 2007-09-19 马军 金属封装外壳壳体的榫接钎焊加工方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2880383A (en) * 1956-10-05 1959-03-31 Motorola Inc High frequency transistor package
US3381080A (en) * 1962-07-02 1968-04-30 Westinghouse Electric Corp Hermetically sealed semiconductor device
US3190952A (en) * 1963-02-21 1965-06-22 Bitko Sheldon Welded hermetic seal
US3310858A (en) * 1963-12-12 1967-03-28 Bell Telephone Labor Inc Semiconductor diode and method of making
DE1614858C3 (de) * 1967-08-30 1975-09-18 Telefunken Patentverwertungsgesellschaft Mbh., 7900 Ulm Halbleiteranordnung
US3733691A (en) * 1968-10-07 1973-05-22 Kabel Metallwerke Ghh Process for making semiconductor devices
GB1207728A (en) * 1968-11-27 1970-10-07 Standard Telephones Cables Ltd Housing assembly for an electric circuit
US3646405A (en) * 1969-01-08 1972-02-29 Mallory & Co Inc P R Hermetic seal
GB1259804A (en) * 1969-02-28 1972-01-12 Hawker Siddeley Dynamics Ltd Improvements in or relating to the manufacture of electrical circuit assemblies
BE760031A (fr) * 1969-12-11 1971-05-17 Rca Corp Boitier pour module de puissance hybride a semiconducteurs
FR2098404A1 (fr) * 1970-07-15 1972-03-10 Trw Inc
FR2110575A5 (fr) * 1970-10-22 1972-06-02 Radiotechnique Compelec
FR2121454B1 (fr) * 1971-01-14 1977-01-28 Materiel Telephonique
DE2158188A1 (de) * 1971-11-24 1973-06-07 Jenaer Glaswerk Schott & Gen Kaltpresschweissbare und kaltpressloetbare druckglasdurchfuehrungen
US3801938A (en) * 1972-05-31 1974-04-02 Trw Inc Package for microwave semiconductor device
FR2216751B1 (fr) * 1973-02-01 1976-05-14 Expansion Produits Tech
US3936864A (en) * 1973-05-18 1976-02-03 Raytheon Company Microwave transistor package
US4063348A (en) * 1975-02-27 1977-12-20 The Bendix Corporation Unique packaging method for use on large semiconductor devices

Also Published As

Publication number Publication date
US4266090A (en) 1981-05-05
GB2032189B (en) 1983-03-30
CA1114936A (fr) 1981-12-22
DE2937050C2 (fr) 1988-05-11
GB2032189A (en) 1980-04-30
FR2436498A1 (fr) 1980-04-11
DE2937050A1 (de) 1980-03-27

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Legal Events

Date Code Title Description
ST Notification of lapse