FR2369610A1 - Mecanisme pour positionner et maintenir un objet dans une assiette choisie - Google Patents
Mecanisme pour positionner et maintenir un objet dans une assiette choisieInfo
- Publication number
- FR2369610A1 FR2369610A1 FR7728523A FR7728523A FR2369610A1 FR 2369610 A1 FR2369610 A1 FR 2369610A1 FR 7728523 A FR7728523 A FR 7728523A FR 7728523 A FR7728523 A FR 7728523A FR 2369610 A1 FR2369610 A1 FR 2369610A1
- Authority
- FR
- France
- Prior art keywords
- positioning
- holding
- photomask
- support
- patch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Appareil de positionnement Il permet le positionnement et l'alignement d'une pastille semi-conductrice 30 par rapport à un photomasque. La pastille est placée sur un support à dépression 23 et le support est poussé d'un côté par le ressort diaphragme 21 et de l'autre par les doigts 16 s'appuyant sur les éléments 32. Un détecteur à pression 17a place sur l'anneau de raccordement 11 permet de déterminer la position de la pastille par rapport au plan de référence et de commander l'ajustement par les circuits 39 à l'aide des translateurs 14 commandant les bras 15. Evite les contacts de la pastille revêtue de photorésistant avec des dispositifs et peut être utilisé pour l'exposition des pastilles à l'aide d'un photomasque.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/737,819 US4093378A (en) | 1976-11-01 | 1976-11-01 | Alignment apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2369610A1 true FR2369610A1 (fr) | 1978-05-26 |
FR2369610B1 FR2369610B1 (fr) | 1980-01-04 |
Family
ID=24965450
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7728523A Granted FR2369610A1 (fr) | 1976-11-01 | 1977-09-14 | Mecanisme pour positionner et maintenir un objet dans une assiette choisie |
Country Status (6)
Country | Link |
---|---|
US (1) | US4093378A (fr) |
JP (1) | JPS5356974A (fr) |
BR (1) | BR7707305A (fr) |
DE (1) | DE2748101C3 (fr) |
FR (1) | FR2369610A1 (fr) |
GB (1) | GB1583970A (fr) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0077559A2 (fr) * | 1981-10-19 | 1983-04-27 | Hitachi, Ltd. | Dispositif pour profiler la surface des plaquettes semi-conductrices |
EP0100526A2 (fr) * | 1982-08-04 | 1984-02-15 | The Perkin-Elmer Corporation | Appareil pour l'alignement et le contrôle de la distance entre un masque et un disque utilisés en lithographie à rayon-X |
EP0150074A2 (fr) * | 1984-01-23 | 1985-07-31 | Disco Abrasive Systems, Ltd. | Procédé et dispositif pour meuler la surface d'une plaquette d'un semi-conducteur |
EP0188045A1 (fr) * | 1984-01-10 | 1986-07-23 | Hewlett-Packard Company | Mandrin déformable |
CN104772722A (zh) * | 2014-12-31 | 2015-07-15 | 苏州市博奥塑胶电子有限公司 | 一种新型下模具 |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4189230A (en) * | 1977-10-26 | 1980-02-19 | Fujitsu Limited | Wafer holder with spring-loaded wafer-holding means |
GB2063524B (en) * | 1978-10-20 | 1982-12-22 | Hitachi Ltd | Method of positioning a wafer in a projection aligner |
JPS562630A (en) * | 1979-06-22 | 1981-01-12 | Hitachi Ltd | Installing of wafer position in projection aligner |
US4198159A (en) * | 1978-12-29 | 1980-04-15 | International Business Machines Corporation | Optical alignment system in projection printing |
US4344160A (en) * | 1980-05-02 | 1982-08-10 | The Perkin-Elmer Corporation | Automatic wafer focusing and flattening system |
JPS59154023A (ja) * | 1983-02-22 | 1984-09-03 | Nippon Kogaku Kk <Nikon> | 板状体の姿勢制御装置 |
KR900001241B1 (ko) * | 1985-04-17 | 1990-03-05 | 가부시기가이샤 히다찌세이사꾸쇼 | 광 노출 장치 |
US4749867A (en) * | 1985-04-30 | 1988-06-07 | Canon Kabushiki Kaisha | Exposure apparatus |
JPS611021A (ja) * | 1985-05-13 | 1986-01-07 | Hitachi Ltd | 露光装置における位置設定方法 |
US4637713A (en) * | 1985-09-27 | 1987-01-20 | Scss Instruments, Inc. | Pellicle mounting apparatus |
US4791458A (en) * | 1986-11-13 | 1988-12-13 | Masi Amerigo De | Multi-purpose apparatus for the imaging of printed wired boards |
DE3725188A1 (de) * | 1987-07-29 | 1989-02-09 | Siemens Ag | Halbautomatischer substrathalter fuer waermeprozesse |
JP2601834B2 (ja) * | 1987-08-26 | 1997-04-16 | 株式会社東芝 | テーブル装置 |
JPH03142828A (ja) * | 1989-10-27 | 1991-06-18 | Tokyo Electron Ltd | 処理装置 |
DE4114284C2 (de) * | 1991-05-02 | 1993-10-07 | Juergen Dipl Ing Pickenhan | Vorrichtung zum Behandeln oder Bearbeiten eines Werkstückes, insbesondere einer Schaltkarte |
DE4116392C2 (de) * | 1991-05-18 | 2001-05-03 | Micronas Gmbh | Halterung zur einseitigen Naßätzung von Halbleiterscheiben |
DE4120497C2 (de) * | 1991-06-21 | 1994-05-26 | Zeiss Carl Jena Gmbh | Ausrichtevorrichtung zur Justierung von im funktionellen und geometrischen Zusammenhang stehenden Objekten |
AT405224B (de) * | 1992-06-05 | 1999-06-25 | Thallner Erich | Vorrichtung zum ausrichten, zusammenführen und festhalten von scheibenförmigen bauteilen |
JPH06268051A (ja) * | 1993-03-10 | 1994-09-22 | Mitsubishi Electric Corp | ウエハ剥し装置 |
JP3445374B2 (ja) * | 1994-09-06 | 2003-09-08 | 富士写真フイルム株式会社 | 写真プリンタの可変マスク機構および可変マスク機構のマスク位置決め方法 |
US5563684A (en) * | 1994-11-30 | 1996-10-08 | Sgs-Thomson Microelectronics, Inc. | Adaptive wafer modulator for placing a selected pattern on a semiconductor wafer |
US5773951A (en) * | 1996-03-25 | 1998-06-30 | Digital Test Corporation | Wafer prober having sub-micron alignment accuracy |
US6113165A (en) * | 1998-10-02 | 2000-09-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Self-sensing wafer holder and method of using |
US7530271B2 (en) * | 2003-03-13 | 2009-05-12 | Sonix, Inc. | Method and apparatus for coupling ultrasound between an integral ultrasonic transducer assembly and an object |
JP4067511B2 (ja) * | 2004-04-07 | 2008-03-26 | アイシン化工株式会社 | セグメント摩擦材の製造方法 |
US7661315B2 (en) * | 2004-05-24 | 2010-02-16 | Sonix, Inc. | Method and apparatus for ultrasonic scanning of a fabrication wafer |
US7917317B2 (en) * | 2006-07-07 | 2011-03-29 | Sonix, Inc. | Ultrasonic inspection using acoustic modeling |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2170279A1 (fr) * | 1972-02-02 | 1973-09-14 | Ibm |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3674368A (en) * | 1970-05-11 | 1972-07-04 | Johannsmeier Karl Heinz | Out of contact optical alignment and exposure apparatus |
US3722996A (en) * | 1971-01-04 | 1973-03-27 | Electromask Inc | Optical pattern generator or repeating projector or the like |
US3940211A (en) * | 1971-03-22 | 1976-02-24 | Kasper Instruments, Inc. | Step-and-repeat projection alignment and exposure system |
US3955072A (en) * | 1971-03-22 | 1976-05-04 | Kasper Instruments, Inc. | Apparatus for the automatic alignment of two superimposed objects for example a semiconductor wafer and a transparent mask |
JPS5837114B2 (ja) * | 1972-01-19 | 1983-08-13 | キヤノン株式会社 | デンキシキマニピユレ−タ |
US3858978A (en) * | 1973-08-10 | 1975-01-07 | Kasper Instruments | Chuck for use in out-of-contact optical alignment and exposure apparatus |
-
1976
- 1976-11-01 US US05/737,819 patent/US4093378A/en not_active Expired - Lifetime
-
1977
- 1977-09-14 JP JP11008677A patent/JPS5356974A/ja active Granted
- 1977-09-14 FR FR7728523A patent/FR2369610A1/fr active Granted
- 1977-10-18 GB GB43227/77A patent/GB1583970A/en not_active Expired
- 1977-10-27 DE DE2748101A patent/DE2748101C3/de not_active Expired
- 1977-10-31 BR BR7707305A patent/BR7707305A/pt unknown
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2170279A1 (fr) * | 1972-02-02 | 1973-09-14 | Ibm |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0077559A2 (fr) * | 1981-10-19 | 1983-04-27 | Hitachi, Ltd. | Dispositif pour profiler la surface des plaquettes semi-conductrices |
EP0077559A3 (en) * | 1981-10-19 | 1983-10-05 | Hitachi, Ltd. | Wafer transforming device |
EP0100526A2 (fr) * | 1982-08-04 | 1984-02-15 | The Perkin-Elmer Corporation | Appareil pour l'alignement et le contrôle de la distance entre un masque et un disque utilisés en lithographie à rayon-X |
EP0100526A3 (en) * | 1982-08-04 | 1986-03-19 | The Perkin-Elmer Corporation | Apparatus for effecting alignment and spacing control of a mask and wafer for use in x-ray lithography |
EP0188045A1 (fr) * | 1984-01-10 | 1986-07-23 | Hewlett-Packard Company | Mandrin déformable |
EP0150074A2 (fr) * | 1984-01-23 | 1985-07-31 | Disco Abrasive Systems, Ltd. | Procédé et dispositif pour meuler la surface d'une plaquette d'un semi-conducteur |
EP0150074A3 (en) * | 1984-01-23 | 1987-05-13 | Disco Abrasive Systems, Ltd. | Method and apparatus for grinding the surface of a semiconductor wafer |
CN104772722A (zh) * | 2014-12-31 | 2015-07-15 | 苏州市博奥塑胶电子有限公司 | 一种新型下模具 |
Also Published As
Publication number | Publication date |
---|---|
DE2748101B2 (de) | 1979-04-26 |
JPS5343024B2 (fr) | 1978-11-16 |
DE2748101C3 (de) | 1979-12-13 |
FR2369610B1 (fr) | 1980-01-04 |
US4093378A (en) | 1978-06-06 |
GB1583970A (en) | 1981-02-04 |
BR7707305A (pt) | 1978-07-25 |
JPS5356974A (en) | 1978-05-23 |
DE2748101A1 (de) | 1978-05-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |