FR2311482A1 - Soldering machine for hybrid circuit components - has support surface for hybrid circuit heated via Joule effect - Google Patents

Soldering machine for hybrid circuit components - has support surface for hybrid circuit heated via Joule effect

Info

Publication number
FR2311482A1
FR2311482A1 FR7515017A FR7515017A FR2311482A1 FR 2311482 A1 FR2311482 A1 FR 2311482A1 FR 7515017 A FR7515017 A FR 7515017A FR 7515017 A FR7515017 A FR 7515017A FR 2311482 A1 FR2311482 A1 FR 2311482A1
Authority
FR
France
Prior art keywords
hybrid circuit
support surface
heated via
joule effect
soldering machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7515017A
Other languages
French (fr)
Other versions
FR2311482B1 (en
Inventor
Jean-Pierre Ruelle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Radiotechnique SA
Original Assignee
Radiotechnique SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Radiotechnique SA filed Critical Radiotechnique SA
Priority to FR7515017A priority Critical patent/FR2311482A1/en
Publication of FR2311482A1 publication Critical patent/FR2311482A1/en
Application granted granted Critical
Publication of FR2311482B1 publication Critical patent/FR2311482B1/fr
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B23K3/047—Heating appliances electric
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

The soldering machine is used for mounting active and passive components (16) on a hybrid circuit, comprising a ceramic chip (15) with metallised circuit paths. The machine has the support surface for the hybrid circuit formed by a metal sheet (1) which is heated via the Joule effect ot a predetermined temperature. The metal sheet (1) can be made from inoxidisable steel and is held between two grooved blocks (2, 3) by two retaining bars (4, 5), which fit into respective slots in each block (2, 3). An apertured plate (6, 7) is fixed to the end of each retaining bar (4, 5), for forming the connection terminals for the two current conductors, providing the heating current.
FR7515017A 1975-05-14 1975-05-14 Soldering machine for hybrid circuit components - has support surface for hybrid circuit heated via Joule effect Granted FR2311482A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7515017A FR2311482A1 (en) 1975-05-14 1975-05-14 Soldering machine for hybrid circuit components - has support surface for hybrid circuit heated via Joule effect

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7515017A FR2311482A1 (en) 1975-05-14 1975-05-14 Soldering machine for hybrid circuit components - has support surface for hybrid circuit heated via Joule effect

Publications (2)

Publication Number Publication Date
FR2311482A1 true FR2311482A1 (en) 1976-12-10
FR2311482B1 FR2311482B1 (en) 1977-12-09

Family

ID=9155226

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7515017A Granted FR2311482A1 (en) 1975-05-14 1975-05-14 Soldering machine for hybrid circuit components - has support surface for hybrid circuit heated via Joule effect

Country Status (1)

Country Link
FR (1) FR2311482A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5130509A (en) * 1990-11-19 1992-07-14 Simpson Jr Raymond G Apparatus for reflow soldering

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NEANT *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5130509A (en) * 1990-11-19 1992-07-14 Simpson Jr Raymond G Apparatus for reflow soldering

Also Published As

Publication number Publication date
FR2311482B1 (en) 1977-12-09

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Legal Events

Date Code Title Description
ST Notification of lapse