FR2307375A1 - Dispositif semi-conducteur enrobe de verre - Google Patents
Dispositif semi-conducteur enrobe de verreInfo
- Publication number
- FR2307375A1 FR2307375A1 FR7610131A FR7610131A FR2307375A1 FR 2307375 A1 FR2307375 A1 FR 2307375A1 FR 7610131 A FR7610131 A FR 7610131A FR 7610131 A FR7610131 A FR 7610131A FR 2307375 A1 FR2307375 A1 FR 2307375A1
- Authority
- FR
- France
- Prior art keywords
- semiconductor device
- glass coated
- coated semiconductor
- glass
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011521 glass Substances 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H01L2924/01005—Boron [B]
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Die Bonding (AREA)
- Wire Bonding (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50041293A JPS51122376A (en) | 1975-04-07 | 1975-04-07 | Method of manufacture of glass sealed semiconductor |
JP4129475A JPS51122377A (en) | 1975-04-07 | 1975-04-07 | Manufacturing method of glass sealed semiconductor |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2307375A1 true FR2307375A1 (fr) | 1976-11-05 |
FR2307375B1 FR2307375B1 (fr) | 1978-10-13 |
Family
ID=26380864
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7610131A Granted FR2307375A1 (fr) | 1975-04-07 | 1976-04-07 | Dispositif semi-conducteur enrobe de verre |
Country Status (5)
Country | Link |
---|---|
US (1) | US4059837A (fr) |
DE (1) | DE2614851A1 (fr) |
FR (1) | FR2307375A1 (fr) |
GB (1) | GB1506125A (fr) |
NL (1) | NL163674C (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2387498A1 (fr) * | 1977-04-15 | 1978-11-10 | Hitachi Ltd | Dispositif de jonction composite comportant une structure composite de fibres de carbone noyees dans une matrice de cuivre |
DE3122387A1 (de) * | 1981-06-05 | 1982-12-23 | Deutsche Itt Industries Gmbh, 7800 Freiburg | "glasumhuellte halbleiterdiode und verfahren zur herstellung" |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS531469A (en) * | 1976-06-26 | 1978-01-09 | Hitachi Ltd | Glass seal type semiconductor device |
JPS54978A (en) * | 1977-06-06 | 1979-01-06 | Hitachi Ltd | Semiconductor device of glass seal type |
DE3005301C2 (de) * | 1980-02-13 | 1985-11-21 | Telefunken electronic GmbH, 7100 Heilbronn | Varaktor- oder Mischerdiode |
DE3005302C2 (de) * | 1980-02-13 | 1985-12-12 | Telefunken electronic GmbH, 7100 Heilbronn | Varaktor- oder Mischerdiode |
US4987476A (en) * | 1988-02-01 | 1991-01-22 | General Instrument Corporation | Brazed glass pre-passivated chip rectifier |
US5248902A (en) * | 1991-08-30 | 1993-09-28 | General Instrument Corporation | Surface mounting diode |
US6111316A (en) * | 1997-08-29 | 2000-08-29 | Motorola, Inc. | Electronic component encapsulated in a glass tube |
US20060038302A1 (en) * | 2004-08-19 | 2006-02-23 | Kejun Zeng | Thermal fatigue resistant tin-lead-silver solder |
DE102010062346A1 (de) * | 2010-12-02 | 2012-06-06 | Robert Bosch Gmbh | Elektronische Baugruppe sowie Verfahren zu deren Herstellung |
WO2019027893A1 (fr) * | 2017-07-31 | 2019-02-07 | Corning Incorporated | Article stratifié possédant une partie centrale non en verre et une enveloppe en verre et procédés associés |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3032695A (en) * | 1957-03-20 | 1962-05-01 | Bosch Gmbh Robert | Alloyed junction semiconductive device |
US3237272A (en) * | 1965-07-06 | 1966-03-01 | Motorola Inc | Method of making semiconductor device |
US3365628A (en) * | 1965-09-16 | 1968-01-23 | Texas Instruments Inc | Metallic contacts for semiconductor devices |
US3913127A (en) * | 1971-10-01 | 1975-10-14 | Hitachi Ltd | Glass encapsulated semiconductor device containing cylindrical stack of semiconductor pellets |
US3930306A (en) * | 1974-04-24 | 1976-01-06 | General Instrument Corporation | Process for attaching a lead member to a semiconductor device |
-
1976
- 1976-04-05 GB GB13768/76A patent/GB1506125A/en not_active Expired
- 1976-04-05 US US05/673,530 patent/US4059837A/en not_active Expired - Lifetime
- 1976-04-06 NL NL7603580.A patent/NL163674C/xx not_active IP Right Cessation
- 1976-04-06 DE DE19762614851 patent/DE2614851A1/de active Pending
- 1976-04-07 FR FR7610131A patent/FR2307375A1/fr active Granted
Non-Patent Citations (1)
Title |
---|
NEANT * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2387498A1 (fr) * | 1977-04-15 | 1978-11-10 | Hitachi Ltd | Dispositif de jonction composite comportant une structure composite de fibres de carbone noyees dans une matrice de cuivre |
DE3122387A1 (de) * | 1981-06-05 | 1982-12-23 | Deutsche Itt Industries Gmbh, 7800 Freiburg | "glasumhuellte halbleiterdiode und verfahren zur herstellung" |
Also Published As
Publication number | Publication date |
---|---|
NL163674C (nl) | 1980-09-15 |
NL163674B (nl) | 1980-04-15 |
NL7603580A (nl) | 1976-10-11 |
GB1506125A (en) | 1978-04-05 |
US4059837A (en) | 1977-11-22 |
DE2614851A1 (de) | 1976-10-21 |
FR2307375B1 (fr) | 1978-10-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |