FR2277433A1 - Liquid cooled semiconductor - particularly applicable to thyristors. coolant temperature is raised by two degrees for 200 watt dissipation - Google Patents

Liquid cooled semiconductor - particularly applicable to thyristors. coolant temperature is raised by two degrees for 200 watt dissipation

Info

Publication number
FR2277433A1
FR2277433A1 FR7423411A FR7423411A FR2277433A1 FR 2277433 A1 FR2277433 A1 FR 2277433A1 FR 7423411 A FR7423411 A FR 7423411A FR 7423411 A FR7423411 A FR 7423411A FR 2277433 A1 FR2277433 A1 FR 2277433A1
Authority
FR
France
Prior art keywords
thyristors
oil
raised
degrees
coolant temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7423411A
Other languages
French (fr)
Other versions
FR2277433B1 (en
Inventor
Pierre Pelissier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Auxilec SA
Original Assignee
Auxilec SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Auxilec SA filed Critical Auxilec SA
Priority to FR7423411A priority Critical patent/FR2277433A1/en
Publication of FR2277433A1 publication Critical patent/FR2277433A1/en
Application granted granted Critical
Publication of FR2277433B1 publication Critical patent/FR2277433B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/074—Stacked arrangements of non-apertured devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Rectifiers (AREA)

Abstract

A thyristor group supplying about 100 watts requires a flow of coolant, which is necessarily some electrically insulating oil, of two litres per minute giving a 4 to 5 metres per second flow, the temperature difference between the thyristor surface and the oil being about 20 deg.C. Entry and exit of the oil from such a group of thyristors is via single ports leading to channels in the overall thyristor group casing. A nut ring on a cylindrical body exerts through an elastic washer and an insulating sheet a pressure on a connexion plate. This plate transmits the pressure to the end of a semiconductor element bearing on the base of the body through other connexion plates and semiconductor elements.
FR7423411A 1974-07-05 1974-07-05 Liquid cooled semiconductor - particularly applicable to thyristors. coolant temperature is raised by two degrees for 200 watt dissipation Granted FR2277433A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7423411A FR2277433A1 (en) 1974-07-05 1974-07-05 Liquid cooled semiconductor - particularly applicable to thyristors. coolant temperature is raised by two degrees for 200 watt dissipation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7423411A FR2277433A1 (en) 1974-07-05 1974-07-05 Liquid cooled semiconductor - particularly applicable to thyristors. coolant temperature is raised by two degrees for 200 watt dissipation

Publications (2)

Publication Number Publication Date
FR2277433A1 true FR2277433A1 (en) 1976-01-30
FR2277433B1 FR2277433B1 (en) 1976-12-24

Family

ID=9140932

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7423411A Granted FR2277433A1 (en) 1974-07-05 1974-07-05 Liquid cooled semiconductor - particularly applicable to thyristors. coolant temperature is raised by two degrees for 200 watt dissipation

Country Status (1)

Country Link
FR (1) FR2277433A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0067575A2 (en) * 1981-05-28 1982-12-22 Kabushiki Kaisha Toshiba Power semiconductor device
FR2524760A1 (en) * 1982-03-30 1983-10-07 Auxilec HOLDING PART FOR SEMICONDUCTOR, AND SEMICONDUCTOR POWER DEVICE COMPRISING SUCH A PART
FR2672432A1 (en) * 1991-02-06 1992-08-07 Alcatel Cable HIGH VOLTAGE WAVE LOCK DIODE.

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0067575A2 (en) * 1981-05-28 1982-12-22 Kabushiki Kaisha Toshiba Power semiconductor device
EP0067575A3 (en) * 1981-05-28 1984-02-08 Tokyo Shibaura Denki Kabushiki Kaisha Power semiconductor device
FR2524760A1 (en) * 1982-03-30 1983-10-07 Auxilec HOLDING PART FOR SEMICONDUCTOR, AND SEMICONDUCTOR POWER DEVICE COMPRISING SUCH A PART
FR2672432A1 (en) * 1991-02-06 1992-08-07 Alcatel Cable HIGH VOLTAGE WAVE LOCK DIODE.
EP0498329A1 (en) * 1991-02-06 1992-08-12 Alcatel Cable High tension wave-trap diode

Also Published As

Publication number Publication date
FR2277433B1 (en) 1976-12-24

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Legal Events

Date Code Title Description
ST Notification of lapse