FR2268089A1 - - Google Patents

Info

Publication number
FR2268089A1
FR2268089A1 FR7512460A FR7512460A FR2268089A1 FR 2268089 A1 FR2268089 A1 FR 2268089A1 FR 7512460 A FR7512460 A FR 7512460A FR 7512460 A FR7512460 A FR 7512460A FR 2268089 A1 FR2268089 A1 FR 2268089A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7512460A
Other languages
French (fr)
Other versions
FR2268089B1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Aeronautics and Space Administration NASA
Original Assignee
National Aeronautics and Space Administration NASA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Aeronautics and Space Administration NASA filed Critical National Aeronautics and Space Administration NASA
Publication of FR2268089A1 publication Critical patent/FR2268089A1/fr
Application granted granted Critical
Publication of FR2268089B1 publication Critical patent/FR2268089B1/fr
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3464—Sputtering using more than one target

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
FR7512460A 1974-04-22 1975-04-22 Expired FR2268089B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US462705A US3864239A (en) 1974-04-22 1974-04-22 Multitarget sequential sputtering apparatus

Publications (2)

Publication Number Publication Date
FR2268089A1 true FR2268089A1 (en) 1975-11-14
FR2268089B1 FR2268089B1 (en) 1978-06-23

Family

ID=23837464

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7512460A Expired FR2268089B1 (en) 1974-04-22 1975-04-22

Country Status (6)

Country Link
US (1) US3864239A (en)
JP (1) JPS5830389B2 (en)
CA (1) CA1045582A (en)
DE (1) DE2517554A1 (en)
FR (1) FR2268089B1 (en)
GB (1) GB1485331A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2559507A1 (en) * 1984-02-11 1985-08-16 Glyco Metall Werke PROCESS FOR PRODUCING LAMINATED MATERIAL OR LAMINATED PIECES

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3904503A (en) * 1974-05-31 1975-09-09 Western Electric Co Depositing material on a substrate using a shield
US3932232A (en) * 1974-11-29 1976-01-13 Bell Telephone Laboratories, Incorporated Suppression of X-ray radiation during sputter-etching
US4060471A (en) * 1975-05-19 1977-11-29 Rca Corporation Composite sputtering method
US4051010A (en) * 1975-12-18 1977-09-27 Western Electric Company, Inc. Sputtering apparatus
US4239611A (en) * 1979-06-11 1980-12-16 Vac-Tec Systems, Inc. Magnetron sputtering devices
US4333814A (en) * 1979-12-26 1982-06-08 Western Electric Company, Inc. Methods and apparatus for improving an RF excited reactive gas plasma
US4362611A (en) * 1981-07-27 1982-12-07 International Business Machines Corporation Quadrupole R.F. sputtering system having an anode/cathode shield and a floating target shield
US4448149A (en) * 1982-10-12 1984-05-15 International Business Machines Corporation Apparatus for removably mounting and supplying mechanical and electrical energy to a vacuum chamber substrate holder
US4885074A (en) * 1987-02-24 1989-12-05 International Business Machines Corporation Plasma reactor having segmented electrodes
GB8718916D0 (en) * 1987-08-10 1987-09-16 Ion Tech Ltd Thin film alloying apparatus
JPH01127674A (en) * 1987-11-11 1989-05-19 Matsushita Electric Ind Co Ltd Magnetron sputtering device
GB2228948A (en) * 1989-02-28 1990-09-12 British Aerospace Fabrication of thin films from a composite target
US5391275A (en) * 1990-03-02 1995-02-21 Applied Materials, Inc. Method for preparing a shield to reduce particles in a physical vapor deposition chamber
US5202008A (en) * 1990-03-02 1993-04-13 Applied Materials, Inc. Method for preparing a shield to reduce particles in a physical vapor deposition chamber
NL9002176A (en) * 1990-10-08 1992-05-06 Philips Nv METHOD FOR REDUCING PARTICLE CONTAMINATION DURING SPUTTERING AND A SPUTTERING DEVICE FOR USE OF SUCH A METHOD
US5223108A (en) * 1991-12-30 1993-06-29 Materials Research Corporation Extended lifetime collimator
EP0837491A3 (en) * 1996-10-21 2000-11-15 Nihon Shinku Gijutsu Kabushiki Kaisha Composite sputtering cathode assembly and sputtering apparatus with such composite sputtering cathode assembly
JP4137277B2 (en) * 1999-04-15 2008-08-20 株式会社アルバック Sputtering equipment
US6328856B1 (en) 1999-08-04 2001-12-11 Seagate Technology Llc Method and apparatus for multilayer film deposition utilizing rotating multiple magnetron cathode device
US6451176B1 (en) * 2000-11-03 2002-09-17 The Regents Of The University Of California Electrostatic particle trap for ion beam sputter deposition
SE521095C2 (en) * 2001-06-08 2003-09-30 Cardinal Cg Co Reactive sputtering process
US6635154B2 (en) * 2001-11-03 2003-10-21 Intevac, Inc. Method and apparatus for multi-target sputtering
US20040086639A1 (en) * 2002-09-24 2004-05-06 Grantham Daniel Harrison Patterned thin-film deposition using collimating heated mask asembly
JP4494047B2 (en) 2004-03-12 2010-06-30 キヤノンアネルバ株式会社 Double shutter control method for multi-source sputtering deposition system
KR20050093230A (en) * 2004-03-18 2005-09-23 엘지.필립스 엘시디 주식회사 Sputtering apparatus
US7479210B2 (en) * 2005-04-14 2009-01-20 Tango Systems, Inc. Temperature control of pallet in sputtering system
US7794574B2 (en) * 2005-04-14 2010-09-14 Tango Systems, Inc. Top shield for sputtering system
WO2007053586A2 (en) * 2005-11-01 2007-05-10 Cardinal Cg Company Reactive sputter deposition processes and equipment
JP4142706B2 (en) * 2006-09-28 2008-09-03 富士フイルム株式会社 Film forming apparatus, film forming method, insulating film, dielectric film, piezoelectric film, ferroelectric film, piezoelectric element, and liquid discharge apparatus
JP4993294B2 (en) * 2007-09-05 2012-08-08 富士フイルム株式会社 Perovskite oxide, ferroelectric film and manufacturing method thereof, ferroelectric element, and liquid ejection device
JP5047087B2 (en) * 2008-07-31 2012-10-10 富士フイルム株式会社 Film forming apparatus, film forming method, piezoelectric film, and liquid discharge apparatus
JP5415979B2 (en) * 2009-02-16 2014-02-12 キヤノンアネルバ株式会社 Sputtering apparatus, double rotary shutter unit, and sputtering method
CN105420679B (en) * 2015-11-16 2018-04-03 江苏中腾石英材料科技有限公司 A kind of facing targets magnetron sputtering prepares the device and method for covering copper ceramic substrate
US10431440B2 (en) * 2015-12-20 2019-10-01 Applied Materials, Inc. Methods and apparatus for processing a substrate
US11361950B2 (en) 2020-04-15 2022-06-14 Applied Materials, Inc. Multi-cathode processing chamber with dual rotatable shields

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3528906A (en) * 1967-06-05 1970-09-15 Texas Instruments Inc Rf sputtering method and system
US3803019A (en) * 1971-10-07 1974-04-09 Hewlett Packard Co Sputtering system
US3796649A (en) * 1971-12-13 1974-03-12 Varian Associates Coaxial sputtering apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2559507A1 (en) * 1984-02-11 1985-08-16 Glyco Metall Werke PROCESS FOR PRODUCING LAMINATED MATERIAL OR LAMINATED PIECES

Also Published As

Publication number Publication date
GB1485331A (en) 1977-09-08
JPS5830389B2 (en) 1983-06-29
US3864239A (en) 1975-02-04
JPS50148286A (en) 1975-11-27
CA1045582A (en) 1979-01-02
DE2517554A1 (en) 1975-10-30
FR2268089B1 (en) 1978-06-23

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Legal Events

Date Code Title Description
ST Notification of lapse