FR2256539B1 - - Google Patents
Info
- Publication number
- FR2256539B1 FR2256539B1 FR7441907A FR7441907A FR2256539B1 FR 2256539 B1 FR2256539 B1 FR 2256539B1 FR 7441907 A FR7441907 A FR 7441907A FR 7441907 A FR7441907 A FR 7441907A FR 2256539 B1 FR2256539 B1 FR 2256539B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
- H01L23/53214—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being aluminium
- H01L23/53223—Additional layers associated with aluminium layers, e.g. adhesion, barrier, cladding layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US42941673A | 1973-12-28 | 1973-12-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2256539A1 FR2256539A1 (en) | 1975-07-25 |
| FR2256539B1 true FR2256539B1 (en) | 1976-10-22 |
Family
ID=23703151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7441907A Granted FR2256539A1 (en) | 1973-12-28 | 1974-11-22 | Ohmic contact for semiconductors with hafnium silicide zone - between (doped) semiconductor zone and metal, giving high temp. stability |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPS5099266A (en) |
| DE (1) | DE2457484A1 (en) |
| FR (1) | FR2256539A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4316209A (en) * | 1979-08-31 | 1982-02-16 | International Business Machines Corporation | Metal/silicon contact and methods of fabrication thereof |
| US4399605A (en) * | 1982-02-26 | 1983-08-23 | International Business Machines Corporation | Method of making dense complementary transistors |
| JPH0779136B2 (en) * | 1986-06-06 | 1995-08-23 | 株式会社日立製作所 | Semiconductor device |
| US5136363A (en) * | 1987-10-21 | 1992-08-04 | Kabushiki Kaisha Toshiba | Semiconductor device with bump electrode |
-
1974
- 1974-11-22 FR FR7441907A patent/FR2256539A1/en active Granted
- 1974-11-27 JP JP13564874A patent/JPS5099266A/ja active Pending
- 1974-12-05 DE DE19742457484 patent/DE2457484A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE2457484A1 (en) | 1975-07-10 |
| JPS5099266A (en) | 1975-08-06 |
| FR2256539A1 (en) | 1975-07-25 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |