FR2204895A1 - - Google Patents
Info
- Publication number
- FR2204895A1 FR2204895A1 FR7338611A FR7338611A FR2204895A1 FR 2204895 A1 FR2204895 A1 FR 2204895A1 FR 7338611 A FR7338611 A FR 7338611A FR 7338611 A FR7338611 A FR 7338611A FR 2204895 A1 FR2204895 A1 FR 2204895A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/0601—Structure
- H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/4901—Structure
- H01L2224/4903—Connectors having different sizes, e.g. different diameters
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/01082—Lead [Pb]
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- H—ELECTRICITY
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- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Thyristors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19722253489 DE2253489C3 (de) | 1972-10-31 | Thyristor und Verfahren zu seiner Herstellung |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2204895A1 true FR2204895A1 (de) | 1974-05-24 |
FR2204895B1 FR2204895B1 (de) | 1978-02-10 |
Family
ID=5860568
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7338611A Expired FR2204895B1 (de) | 1972-10-31 | 1973-10-30 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS5547469B2 (de) |
BE (1) | BE806821A (de) |
CH (1) | CH553480A (de) |
FR (1) | FR2204895B1 (de) |
IT (1) | IT998994B (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2382100A1 (fr) * | 1977-02-25 | 1978-09-22 | Nippon Electric Co | Structure de brasage d'un conducteur sur un dispositif semi-conducteur |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1445855A (fr) * | 1964-08-12 | 1966-07-15 | Siemens Schcukertwerke Ag | élément redresseur commandé à semiconducteur pour courants forts |
FR1551485A (de) * | 1967-01-25 | 1968-12-27 | ||
DE1917013A1 (de) * | 1968-04-11 | 1969-10-23 | Westinghouse Electric Corp | Halbleitervierschichttriode |
GB1199266A (en) * | 1968-05-06 | 1970-07-22 | Rca Corp Formerly Radio Corp O | Power Transistor |
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1973
- 1973-08-07 CH CH1139073A patent/CH553480A/de not_active IP Right Cessation
- 1973-09-28 JP JP11008773A patent/JPS5547469B2/ja not_active Expired
- 1973-10-26 IT IT3061773A patent/IT998994B/it active
- 1973-10-30 FR FR7338611A patent/FR2204895B1/fr not_active Expired
- 1973-10-31 BE BE137328A patent/BE806821A/xx unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1445855A (fr) * | 1964-08-12 | 1966-07-15 | Siemens Schcukertwerke Ag | élément redresseur commandé à semiconducteur pour courants forts |
FR1551485A (de) * | 1967-01-25 | 1968-12-27 | ||
DE1917013A1 (de) * | 1968-04-11 | 1969-10-23 | Westinghouse Electric Corp | Halbleitervierschichttriode |
GB1199266A (en) * | 1968-05-06 | 1970-07-22 | Rca Corp Formerly Radio Corp O | Power Transistor |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2382100A1 (fr) * | 1977-02-25 | 1978-09-22 | Nippon Electric Co | Structure de brasage d'un conducteur sur un dispositif semi-conducteur |
Also Published As
Publication number | Publication date |
---|---|
JPS4978489A (de) | 1974-07-29 |
BE806821A (fr) | 1974-02-15 |
DE2253489A1 (de) | 1974-05-02 |
JPS5547469B2 (de) | 1980-11-29 |
DE2253489B2 (de) | 1977-04-28 |
CH553480A (de) | 1974-08-30 |
FR2204895B1 (de) | 1978-02-10 |
IT998994B (it) | 1976-02-20 |
Similar Documents
Legal Events
Date | Code | Title | Description |
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ST | Notification of lapse |