FR2184977B1 - - Google Patents
Info
- Publication number
- FR2184977B1 FR2184977B1 FR7317919A FR7317919A FR2184977B1 FR 2184977 B1 FR2184977 B1 FR 2184977B1 FR 7317919 A FR7317919 A FR 7317919A FR 7317919 A FR7317919 A FR 7317919A FR 2184977 B1 FR2184977 B1 FR 2184977B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0029—Etching of the substrate by chemical or physical means by laser ablation of inorganic insulating material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
- H01L21/705—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thick-film circuits or parts thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
- H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Optics & Photonics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE651572 | 1972-05-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2184977A1 FR2184977A1 (en) | 1973-12-28 |
FR2184977B1 true FR2184977B1 (en) | 1977-02-11 |
Family
ID=20268883
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7317919A Expired FR2184977B1 (en) | 1972-05-18 | 1973-05-17 |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE2324006A1 (en) |
FR (1) | FR2184977B1 (en) |
GB (1) | GB1425373A (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4258468A (en) * | 1978-12-14 | 1981-03-31 | Western Electric Company, Inc. | Forming vias through multilayer circuit boards |
US4667404A (en) * | 1985-09-30 | 1987-05-26 | Microelectronics Center Of North Carolina | Method of interconnecting wiring planes |
US4764644A (en) * | 1985-09-30 | 1988-08-16 | Microelectronics Center Of North Carolina | Microelectronics apparatus |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE631489A (en) * | 1962-04-27 | |||
US3561110A (en) * | 1967-08-31 | 1971-02-09 | Ibm | Method of making connections and conductive paths |
-
1973
- 1973-05-10 DE DE19732324006 patent/DE2324006A1/en active Pending
- 1973-05-11 GB GB2267773A patent/GB1425373A/en not_active Expired
- 1973-05-17 FR FR7317919A patent/FR2184977B1/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB1425373A (en) | 1976-02-18 |
AU5523573A (en) | 1974-11-07 |
DE2324006A1 (en) | 1973-12-06 |
FR2184977A1 (en) | 1973-12-28 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |