FR2169222A1 - - Google Patents

Info

Publication number
FR2169222A1
FR2169222A1 FR7302563A FR7302563A FR2169222A1 FR 2169222 A1 FR2169222 A1 FR 2169222A1 FR 7302563 A FR7302563 A FR 7302563A FR 7302563 A FR7302563 A FR 7302563A FR 2169222 A1 FR2169222 A1 FR 2169222A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7302563A
Other languages
French (fr)
Other versions
FR2169222B1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering AG filed Critical Schering AG
Publication of FR2169222A1 publication Critical patent/FR2169222A1/fr
Application granted granted Critical
Publication of FR2169222B1 publication Critical patent/FR2169222B1/fr
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
FR7302563A 1972-01-26 1973-01-25 Expired FR2169222B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2204326A DE2204326C3 (en) 1972-01-26 1972-01-26 Aqueous acid bath for the galvanic deposition of shiny and ductile copper coatings

Publications (2)

Publication Number Publication Date
FR2169222A1 true FR2169222A1 (en) 1973-09-07
FR2169222B1 FR2169222B1 (en) 1976-05-14

Family

ID=5834477

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7302563A Expired FR2169222B1 (en) 1972-01-26 1973-01-25

Country Status (7)

Country Link
US (1) US3778357A (en)
JP (1) JPS5625517B2 (en)
DE (1) DE2204326C3 (en)
FR (1) FR2169222B1 (en)
GB (1) GB1423530A (en)
IE (1) IE37141B1 (en)
IT (1) IT973212B (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4076600A (en) * 1976-12-20 1978-02-28 R. O. Hull & Company, Inc. Leveling agent for acid zinc electroplating baths and method
JPH0762021B2 (en) * 1986-11-05 1995-07-05 第一工業製薬株式会社 Method for producing fourth phosphonium compound
JPH0720978B2 (en) * 1987-06-24 1995-03-08 株式会社クラレ Phosphonium salt and method for producing the same
US5849171A (en) * 1990-10-13 1998-12-15 Atotech Deutschland Gmbh Acid bath for copper plating and process with the use of this combination
DE4211140A1 (en) * 1992-04-03 1993-10-07 Basf Ag Phosphonium salts and their use as brighteners for aqueous acidic galvanic nickel baths
US20060183328A1 (en) * 1999-05-17 2006-08-17 Barstad Leon R Electrolytic copper plating solutions
US6444110B2 (en) * 1999-05-17 2002-09-03 Shipley Company, L.L.C. Electrolytic copper plating method
US20040045832A1 (en) * 1999-10-14 2004-03-11 Nicholas Martyak Electrolytic copper plating solutions
DE10261852B3 (en) 2002-12-20 2004-06-03 Atotech Deutschland Gmbh Mixture of di-, tri- and other oligomeric phenazinium compounds, used in copper electroplating bath for decorative plating or plating circuit board or semiconductor substrate, is prepared from monomer by diazotization and boiling
US9399618B2 (en) * 2003-05-12 2016-07-26 Arkema Inc. High purity electrolytic sulfonic acid solutions
US9243339B2 (en) 2012-05-25 2016-01-26 Trevor Pearson Additives for producing copper electrodeposits having low oxygen content
US9809891B2 (en) 2014-06-30 2017-11-07 Rohm And Haas Electronic Materials Llc Plating method
JP6631348B2 (en) * 2015-03-26 2020-01-15 三菱マテリアル株式会社 Plating solution using phosphonium salt
WO2016152983A1 (en) * 2015-03-26 2016-09-29 三菱マテリアル株式会社 Plating solution using phosphonium salt
US10988852B2 (en) 2015-10-27 2021-04-27 Rohm And Haas Electronic Materials Llc Method of electroplating copper into a via on a substrate from an acid copper electroplating bath

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NEANT *

Also Published As

Publication number Publication date
IE37141B1 (en) 1977-05-11
DE2204326A1 (en) 1973-08-02
IE37141L (en) 1973-07-26
FR2169222B1 (en) 1976-05-14
IT973212B (en) 1974-06-10
DE2204326C3 (en) 1981-07-09
DE2204326B2 (en) 1980-08-21
US3778357A (en) 1973-12-11
GB1423530A (en) 1976-02-04
JPS4886741A (en) 1973-11-15
JPS5625517B2 (en) 1981-06-12

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Legal Events

Date Code Title Description
ST Notification of lapse