FR2153383A1 - - Google Patents
Info
- Publication number
- FR2153383A1 FR2153383A1 FR7233499A FR7233499A FR2153383A1 FR 2153383 A1 FR2153383 A1 FR 2153383A1 FR 7233499 A FR7233499 A FR 7233499A FR 7233499 A FR7233499 A FR 7233499A FR 2153383 A1 FR2153383 A1 FR 2153383A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0108—Male die used for patterning, punching or transferring
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US18285971A | 1971-09-22 | 1971-09-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR2153383A1 true FR2153383A1 (en) | 1973-05-04 |
Family
ID=22670358
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7233499A Withdrawn FR2153383A1 (en) | 1971-09-22 | 1972-09-21 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPS4839972A (en) |
DE (1) | DE2246208A1 (en) |
FR (1) | FR2153383A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2455422A1 (en) * | 1979-04-23 | 1980-11-21 | Castanet Raymond | DEVICE FOR OBTAINING PRINTED CIRCUITS |
US5286231A (en) * | 1992-03-26 | 1994-02-15 | Kop-Flex, Inc. | Flexible elastomer coupling element |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2556756C2 (en) * | 1975-12-17 | 1982-04-08 | Kabel- und Metallwerke Gutehoffnungshütte AG, 3000 Hannover | Base material for flexible printed circuits |
US4480150A (en) * | 1982-07-12 | 1984-10-30 | Motorola Inc. | Lead frame and method |
DE4135839A1 (en) * | 1991-10-31 | 1993-05-06 | Huels Troisdorf Ag, 5210 Troisdorf, De | METHOD FOR PRODUCING A MULTILAYER PRINTED CIRCUIT AND MULTI-LAYER PRINTED CIRCUIT |
-
1972
- 1972-09-21 DE DE19722246208 patent/DE2246208A1/en active Pending
- 1972-09-21 FR FR7233499A patent/FR2153383A1/fr not_active Withdrawn
- 1972-09-22 JP JP9470672A patent/JPS4839972A/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2455422A1 (en) * | 1979-04-23 | 1980-11-21 | Castanet Raymond | DEVICE FOR OBTAINING PRINTED CIRCUITS |
US5286231A (en) * | 1992-03-26 | 1994-02-15 | Kop-Flex, Inc. | Flexible elastomer coupling element |
Also Published As
Publication number | Publication date |
---|---|
DE2246208A1 (en) | 1973-03-29 |
JPS4839972A (en) | 1973-06-12 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |