FR2150214A1 - - Google Patents
Info
- Publication number
- FR2150214A1 FR2150214A1 FR7130428A FR7130428A FR2150214A1 FR 2150214 A1 FR2150214 A1 FR 2150214A1 FR 7130428 A FR7130428 A FR 7130428A FR 7130428 A FR7130428 A FR 7130428A FR 2150214 A1 FR2150214 A1 FR 2150214A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01032—Germanium [Ge]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01049—Indium [In]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7130428A FR2150214A1 (fr) | 1971-08-20 | 1971-08-20 | |
US00271354A US3806776A (en) | 1971-08-20 | 1972-07-13 | Improvement for connecting a two terminal electronical device to a case |
JP47082202A JPS4830871A (fr) | 1971-08-20 | 1972-08-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7130428A FR2150214A1 (fr) | 1971-08-20 | 1971-08-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR2150214A1 true FR2150214A1 (fr) | 1973-04-06 |
Family
ID=9082092
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7130428A Withdrawn FR2150214A1 (fr) | 1971-08-20 | 1971-08-20 |
Country Status (3)
Country | Link |
---|---|
US (1) | US3806776A (fr) |
JP (1) | JPS4830871A (fr) |
FR (1) | FR2150214A1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015143409A (ja) * | 2015-03-06 | 2015-08-06 | シバタ工業株式会社 | 貯蔵倉庫用シート及び貯蔵倉庫 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2572801A (en) * | 1943-06-23 | 1951-10-23 | Sylvania Electric Prod | Electrical rectifier |
BE523682A (fr) * | 1952-10-22 | |||
US2903628A (en) * | 1955-07-25 | 1959-09-08 | Rca Corp | Semiconductor rectifier devices |
US2930948A (en) * | 1956-03-09 | 1960-03-29 | Sarkes Tarzian | Semiconductor device |
US3257588A (en) * | 1959-04-27 | 1966-06-21 | Rca Corp | Semiconductor device enclosures |
US3202489A (en) * | 1959-12-01 | 1965-08-24 | Hughes Aircraft Co | Gold-aluminum alloy bond electrode attachment |
DE1123406B (de) * | 1960-09-27 | 1962-02-08 | Telefunken Patent | Verfahren zur Herstellung von legierten Halbleiteranordnungen |
US3245847A (en) * | 1962-11-19 | 1966-04-12 | Hughes Aircraft Co | Method of producing stable gallium arsenide and semiconductor diodes made therefrom |
US3298093A (en) * | 1963-04-30 | 1967-01-17 | Hughes Aircraft Co | Bonding process |
US3614832A (en) * | 1966-03-09 | 1971-10-26 | Ibm | Decal connectors and methods of forming decal connections to solid state devices |
US3621442A (en) * | 1968-11-07 | 1971-11-16 | Allen Bradley Co | Terminal connection of electronic devices |
US3665589A (en) * | 1969-10-23 | 1972-05-30 | Nasa | Lead attachment to high temperature devices |
US3673478A (en) * | 1969-10-31 | 1972-06-27 | Hitachi Ltd | A semiconductor pellet fitted on a metal body |
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1971
- 1971-08-20 FR FR7130428A patent/FR2150214A1/fr not_active Withdrawn
-
1972
- 1972-07-13 US US00271354A patent/US3806776A/en not_active Expired - Lifetime
- 1972-08-18 JP JP47082202A patent/JPS4830871A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
US3806776A (en) | 1974-04-23 |
JPS4830871A (fr) | 1973-04-23 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |