FR2102512A5 - - Google Patents

Info

Publication number
FR2102512A5
FR2102512A5 FR7029052A FR7029052A FR2102512A5 FR 2102512 A5 FR2102512 A5 FR 2102512A5 FR 7029052 A FR7029052 A FR 7029052A FR 7029052 A FR7029052 A FR 7029052A FR 2102512 A5 FR2102512 A5 FR 2102512A5
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7029052A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LIAISON ELECTR SILEC
Original Assignee
LIAISON ELECTR SILEC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LIAISON ELECTR SILEC filed Critical LIAISON ELECTR SILEC
Priority to FR7029052A priority Critical patent/FR2102512A5/fr
Application granted granted Critical
Publication of FR2102512A5 publication Critical patent/FR2102512A5/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01049—Indium [In]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
FR7029052A 1970-08-06 1970-08-06 Expired FR2102512A5 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7029052A FR2102512A5 (en) 1970-08-06 1970-08-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7029052A FR2102512A5 (en) 1970-08-06 1970-08-06

Publications (1)

Publication Number Publication Date
FR2102512A5 true FR2102512A5 (en) 1972-04-07

Family

ID=9059892

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7029052A Expired FR2102512A5 (en) 1970-08-06 1970-08-06

Country Status (1)

Country Link
FR (1) FR2102512A5 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1468582A (en) * 1965-02-19 1967-02-03 Philips Nv Method of enveloping an electrical component
CH471467A (en) * 1967-03-23 1969-04-15 Motorola Inc Semiconductor rectifier device
DE1439427A1 (en) * 1960-05-18 1969-06-26 Siemens Ag Semiconductor device and method for the production thereof
GB1168357A (en) * 1966-08-26 1969-10-22 Siemens Ag A process for the production of Semiconductor Devices
US3492157A (en) * 1966-06-20 1970-01-27 Tokyo Shibaura Electric Co Resin-sealed semiconductor device and manufacturing method for the same
FR2025719A1 (en) * 1968-12-09 1970-09-11 Gen Electric NEW CONTACT SYSTEM FOR SEMICONDUCTOR COMPONENTS FOR HIGH CURRENTS

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1439427A1 (en) * 1960-05-18 1969-06-26 Siemens Ag Semiconductor device and method for the production thereof
FR1468582A (en) * 1965-02-19 1967-02-03 Philips Nv Method of enveloping an electrical component
US3492157A (en) * 1966-06-20 1970-01-27 Tokyo Shibaura Electric Co Resin-sealed semiconductor device and manufacturing method for the same
GB1168357A (en) * 1966-08-26 1969-10-22 Siemens Ag A process for the production of Semiconductor Devices
CH471467A (en) * 1967-03-23 1969-04-15 Motorola Inc Semiconductor rectifier device
FR2025719A1 (en) * 1968-12-09 1970-09-11 Gen Electric NEW CONTACT SYSTEM FOR SEMICONDUCTOR COMPONENTS FOR HIGH CURRENTS

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Legal Events

Date Code Title Description
ST Notification of lapse