FR2081053A1 - - Google Patents
Info
- Publication number
- FR2081053A1 FR2081053A1 FR7107040A FR7107040A FR2081053A1 FR 2081053 A1 FR2081053 A1 FR 2081053A1 FR 7107040 A FR7107040 A FR 7107040A FR 7107040 A FR7107040 A FR 7107040A FR 2081053 A1 FR2081053 A1 FR 2081053A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0585—Second resist used as mask for selective stripping of first resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Structural Engineering (AREA)
- Architecture (AREA)
- Metallurgy (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- ing And Chemical Polishing (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19702008886 DE2008886B2 (en) | 1970-02-26 | 1970-02-26 | PLASTIC SUPPORT PLATE FOR THE PRODUCTION OF PRINTED CIRCUITS |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2081053A1 true FR2081053A1 (en) | 1971-11-26 |
FR2081053B1 FR2081053B1 (en) | 1973-06-08 |
Family
ID=5763360
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR717107040A Expired FR2081053B1 (en) | 1970-02-26 | 1971-02-23 |
Country Status (11)
Country | Link |
---|---|
AT (1) | AT304680B (en) |
AU (1) | AU2575271A (en) |
BE (1) | BE762480A (en) |
CH (1) | CH513567A (en) |
DE (1) | DE2008886B2 (en) |
ES (1) | ES195455Y (en) |
FR (1) | FR2081053B1 (en) |
GB (1) | GB1335612A (en) |
LU (1) | LU62650A1 (en) |
NL (1) | NL7102229A (en) |
ZA (1) | ZA711265B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3113855A1 (en) * | 1981-04-06 | 1982-10-21 | Fritz Wittig Herstellung gedruckter Schaltungen, 8000 München | METHOD FOR PRODUCING PCBS |
DE10106399C1 (en) * | 2001-02-12 | 2002-09-05 | Siemens Ag | Process for the production of circuit carriers with coarse conductor structures and at least one area with fine conductor structures |
US7947207B2 (en) | 2005-04-12 | 2011-05-24 | Abbott Cardiovascular Systems Inc. | Method for retaining a vascular stent on a catheter |
-
1970
- 1970-02-26 DE DE19702008886 patent/DE2008886B2/en active Pending
-
1971
- 1971-01-25 AT AT60071A patent/AT304680B/en not_active IP Right Cessation
- 1971-01-26 CH CH114071A patent/CH513567A/en not_active IP Right Cessation
- 1971-02-03 BE BE762480A patent/BE762480A/en unknown
- 1971-02-19 NL NL7102229A patent/NL7102229A/xx unknown
- 1971-02-22 AU AU25752/71A patent/AU2575271A/en not_active Expired
- 1971-02-23 FR FR717107040A patent/FR2081053B1/fr not_active Expired
- 1971-02-24 LU LU62650D patent/LU62650A1/xx unknown
- 1971-02-25 ES ES1971195455U patent/ES195455Y/en not_active Expired
- 1971-02-26 ZA ZA711265A patent/ZA711265B/en unknown
- 1971-04-19 GB GB2221671A patent/GB1335612A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
NL7102229A (en) | 1971-08-30 |
ES195455Y (en) | 1975-07-16 |
CH513567A (en) | 1971-09-30 |
AT304680B (en) | 1973-01-25 |
FR2081053B1 (en) | 1973-06-08 |
ES195455U (en) | 1975-02-16 |
BE762480A (en) | 1971-07-16 |
AU2575271A (en) | 1972-08-24 |
DE2008886A1 (en) | 1971-09-09 |
LU62650A1 (en) | 1971-08-18 |
DE2008886B2 (en) | 1972-05-10 |
GB1335612A (en) | 1973-10-31 |
ZA711265B (en) | 1971-11-24 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |