FR2070621A5 - - Google Patents

Info

Publication number
FR2070621A5
FR2070621A5 FR6942835A FR6942835A FR2070621A5 FR 2070621 A5 FR2070621 A5 FR 2070621A5 FR 6942835 A FR6942835 A FR 6942835A FR 6942835 A FR6942835 A FR 6942835A FR 2070621 A5 FR2070621 A5 FR 2070621A5
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR6942835A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Priority to FR6942835A priority Critical patent/FR2070621A5/fr
Application granted granted Critical
Publication of FR2070621A5 publication Critical patent/FR2070621A5/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B23/00—Portable grinding machines, e.g. hand-guided; Accessories therefor
    • B24B23/08—Portable grinding machines designed for fastening on workpieces or other parts of particular section, e.g. for grinding commutators

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
FR6942835A 1969-12-11 1969-12-11 Expired FR2070621A5 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR6942835A FR2070621A5 (en) 1969-12-11 1969-12-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR6942835A FR2070621A5 (en) 1969-12-11 1969-12-11

Publications (1)

Publication Number Publication Date
FR2070621A5 true FR2070621A5 (en) 1971-09-10

Family

ID=9044410

Family Applications (1)

Application Number Title Priority Date Filing Date
FR6942835A Expired FR2070621A5 (en) 1969-12-11 1969-12-11

Country Status (1)

Country Link
FR (1) FR2070621A5 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0039209A1 (en) * 1980-04-24 1981-11-04 Fujitsu Limited Machine for grinding thin plates such as semiconductor wafers

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0039209A1 (en) * 1980-04-24 1981-11-04 Fujitsu Limited Machine for grinding thin plates such as semiconductor wafers
US4481738A (en) * 1980-04-24 1984-11-13 Fujitsu Limited Grinding machine
US4583325A (en) * 1980-04-24 1986-04-22 Fujitsu Limited Grinding machine

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Legal Events

Date Code Title Description
ST Notification of lapse