FR2032009A5 - Semiconductor component - Google Patents
Semiconductor componentInfo
- Publication number
- FR2032009A5 FR2032009A5 FR6903736A FR6903736A FR2032009A5 FR 2032009 A5 FR2032009 A5 FR 2032009A5 FR 6903736 A FR6903736 A FR 6903736A FR 6903736 A FR6903736 A FR 6903736A FR 2032009 A5 FR2032009 A5 FR 2032009A5
- Authority
- FR
- France
- Prior art keywords
- junction
- degrees
- elastomer
- semiconductor component
- flurovinylidene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
This semiconductor structure comprises at least one junction between two opposed conductivity type regions, the junction, where it reaches the surface, being coated with a fluoroelastomer, such as a copolymer of flurovinylidene and hexachloropropylene. The main advantages resulting from the coating are (a) excellent adherence of the elastomer, (b) remarkable reliability of the junction characteristics, (c) retention of electric properties between -50 degrees and + 180 degrees C owing to the behaviour of the elastomer under thermal shock, and (d) improvement of the reciprocal voltage admissible across the junction.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR6903736A FR2032009A5 (en) | 1969-02-14 | 1969-02-14 | Semiconductor component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR6903736A FR2032009A5 (en) | 1969-02-14 | 1969-02-14 | Semiconductor component |
Publications (1)
Publication Number | Publication Date |
---|---|
FR2032009A5 true FR2032009A5 (en) | 1970-11-20 |
Family
ID=9029139
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR6903736A Expired FR2032009A5 (en) | 1969-02-14 | 1969-02-14 | Semiconductor component |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2032009A5 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3978578A (en) * | 1974-08-29 | 1976-09-07 | Fairchild Camera And Instrument Corporation | Method for packaging semiconductor devices |
DE2751517A1 (en) * | 1977-11-18 | 1979-05-23 | Licentia Gmbh | Stress-resistant two-ply coating for passivated semiconductor parts - comprises etched fluorinated polymer substrate and silicone rubber or epoxy! resin top layer |
-
1969
- 1969-02-14 FR FR6903736A patent/FR2032009A5/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3978578A (en) * | 1974-08-29 | 1976-09-07 | Fairchild Camera And Instrument Corporation | Method for packaging semiconductor devices |
DE2751517A1 (en) * | 1977-11-18 | 1979-05-23 | Licentia Gmbh | Stress-resistant two-ply coating for passivated semiconductor parts - comprises etched fluorinated polymer substrate and silicone rubber or epoxy! resin top layer |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |