FR2027546B1 - - Google Patents

Info

Publication number
FR2027546B1
FR2027546B1 FR6940231A FR6940231A FR2027546B1 FR 2027546 B1 FR2027546 B1 FR 2027546B1 FR 6940231 A FR6940231 A FR 6940231A FR 6940231 A FR6940231 A FR 6940231A FR 2027546 B1 FR2027546 B1 FR 2027546B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR6940231A
Other versions
FR2027546A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Publication of FR2027546A1 publication Critical patent/FR2027546A1/fr
Application granted granted Critical
Publication of FR2027546B1 publication Critical patent/FR2027546B1/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/914Doping
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/942Masking
    • Y10S438/944Shadow

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Bipolar Transistors (AREA)
  • Electrodes Of Semiconductors (AREA)
FR6940231A 1968-11-22 1969-11-21 Expired FR2027546B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8519968 1968-11-22

Publications (2)

Publication Number Publication Date
FR2027546A1 FR2027546A1 (fr) 1970-10-02
FR2027546B1 true FR2027546B1 (fr) 1976-03-19

Family

ID=13851950

Family Applications (1)

Application Number Title Priority Date Filing Date
FR6940231A Expired FR2027546B1 (fr) 1968-11-22 1969-11-21

Country Status (4)

Country Link
US (1) US3758943A (fr)
DE (1) DE1958542A1 (fr)
FR (1) FR2027546B1 (fr)
GB (1) GB1262000A (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU461334B2 (en) * 1971-04-05 1975-05-22 Rca Ogrforaxicn Radiofrequency transistor structure and method for making
US3964156A (en) * 1973-02-24 1976-06-22 Plessey Handel Und Investments A.G. Electrical solid-state devices
US3915769A (en) * 1973-07-02 1975-10-28 Western Electric Co Protected crossover circuits and method of protecting the circuits
US3866310A (en) * 1973-09-07 1975-02-18 Westinghouse Electric Corp Method for making the self-aligned gate contact of a semiconductor device
US3962779A (en) * 1974-01-14 1976-06-15 Bell Telephone Laboratories, Incorporated Method for fabricating oxide isolated integrated circuits
IT1041193B (it) * 1975-08-08 1980-01-10 Selenia Ind Elettroniche Perfezionamenti nei procedimenti per la fabbricazione di dispositivi a semiconduttor
GB1545208A (en) * 1975-09-27 1979-05-02 Plessey Co Ltd Electrical solid state devices
US4197630A (en) * 1978-08-25 1980-04-15 Rca Corporation Method of fabricating MNOS transistors having implanted channels
US4196507A (en) * 1978-08-25 1980-04-08 Rca Corporation Method of fabricating MNOS transistors having implanted channels
US4262399A (en) * 1978-11-08 1981-04-21 General Electric Co. Ultrasonic transducer fabricated as an integral park of a monolithic integrated circuit
US4808552A (en) * 1985-09-11 1989-02-28 Texas Instruments Incorporated Process for making vertically-oriented interconnections for VLSI devices
DE4403228C1 (de) * 1994-02-03 1995-05-11 Hebel Ag Verfahren und Vorrichtung zum reihenweisen Auseinanderrücken von quaderförmigen, plastischen Porenbetonkörpern
US5864158A (en) * 1997-04-04 1999-01-26 Advanced Micro Devices, Inc. Trench-gated vertical CMOS device
JP6895834B2 (ja) * 2017-07-21 2021-06-30 三菱電機株式会社 パワーデバイス

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3237271A (en) * 1963-08-07 1966-03-01 Bell Telephone Labor Inc Method of fabricating semiconductor devices
US3303071A (en) * 1964-10-27 1967-02-07 Bell Telephone Labor Inc Fabrication of a semiconductive device with closely spaced electrodes
FR1546423A (fr) * 1966-12-09 1968-11-15 Kobe Ind Corp Dispositif à semi-conducteur
US3567506A (en) * 1968-03-22 1971-03-02 Hughes Aircraft Co Method for providing a planar transistor with heat-dissipating top base and emitter contacts
JPS4812394B1 (fr) * 1968-09-30 1973-04-20

Also Published As

Publication number Publication date
GB1262000A (en) 1972-02-02
FR2027546A1 (fr) 1970-10-02
DE1958542A1 (de) 1970-07-09
US3758943A (en) 1973-09-18

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Legal Events

Date Code Title Description
ST Notification of lapse