FR2025720A1 - - Google Patents

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Publication number
FR2025720A1
FR2025720A1 FR6942568A FR6942568A FR2025720A1 FR 2025720 A1 FR2025720 A1 FR 2025720A1 FR 6942568 A FR6942568 A FR 6942568A FR 6942568 A FR6942568 A FR 6942568A FR 2025720 A1 FR2025720 A1 FR 2025720A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR6942568A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of FR2025720A1 publication Critical patent/FR2025720A1/fr
Withdrawn legal-status Critical Current

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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12043—Photo diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H01L2924/13033—TRIAC - Triode for Alternating Current - A bidirectional switching device containing two thyristor structures with common gate contact
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Thyristors (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR6942568A 1968-12-09 1969-12-09 Withdrawn FR2025720A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US78208468A 1968-12-09 1968-12-09
US78208368A 1968-12-09 1968-12-09
US78218368A 1968-12-09 1968-12-09

Publications (1)

Publication Number Publication Date
FR2025720A1 true FR2025720A1 (fr) 1970-09-11

Family

ID=27419773

Family Applications (3)

Application Number Title Priority Date Filing Date
FR6942568A Withdrawn FR2025720A1 (fr) 1968-12-09 1969-12-09
FR6942567A Withdrawn FR2025719A1 (fr) 1968-12-09 1969-12-09 Nouveau systeme de contact pour composants semiconducteurs pour courants forts
FR6942565A Withdrawn FR2025717A1 (fr) 1968-12-09 1969-12-09

Family Applications After (2)

Application Number Title Priority Date Filing Date
FR6942567A Withdrawn FR2025719A1 (fr) 1968-12-09 1969-12-09 Nouveau systeme de contact pour composants semiconducteurs pour courants forts
FR6942565A Withdrawn FR2025717A1 (fr) 1968-12-09 1969-12-09

Country Status (5)

Country Link
US (2) US3559002A (fr)
BE (3) BE742698A (fr)
DE (2) DE1961077A1 (fr)
FR (3) FR2025720A1 (fr)
GB (1) GB1292636A (fr)

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EP0023165A1 (fr) * 1979-07-17 1981-01-28 Thomson-Csf Plate-forme support de grille de connexion, notamment pour boîtier de circuits intégrés, et boîtier comportant une telle plate-forme

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US3849187A (en) * 1970-03-08 1974-11-19 Dexter Corp Encapsulant compositions for semiconductors
FR2102512A5 (fr) * 1970-08-06 1972-04-07 Liaison Electr Silec
DE2107786C3 (de) * 1971-02-18 1983-01-27 N.V. Philips' Gloeilampenfabrieken, 5621 Eindhoven Halbleiterbauelement
JPS5116264B2 (fr) * 1971-10-01 1976-05-22
SE375881B (fr) * 1972-11-17 1975-04-28 Asea Ab
US3832606A (en) * 1973-02-15 1974-08-27 Gen Motors Corp Semiconductor diode package with protection fuse
US4190735A (en) * 1978-03-08 1980-02-26 Rca Corporation Semiconductor device package
US4270138A (en) * 1979-03-02 1981-05-26 General Electric Company Enhanced thermal transfer package for a semiconductor device
DE2944180A1 (de) * 1979-11-02 1981-05-07 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zum herstellen einer einen halbleiterkoerper einseitig bedeckenden isolierschicht
JPS5778173A (en) * 1980-11-04 1982-05-15 Hitachi Ltd Semiconductor device and manufacture thereof
JPS5817626A (ja) * 1981-07-13 1983-02-01 フエアチアイルド・カメラ・アンド・インストルメント・コ−ポレ−シヨン 低温度ダイ取り付け方法
GB2102833B (en) * 1981-07-31 1984-08-01 Philips Electronic Associated Lead-indium-silver alloy for use in semiconductor devices
US4818812A (en) * 1983-08-22 1989-04-04 International Business Machines Corporation Sealant for integrated circuit modules, polyester suitable therefor and preparation of polyester
DE4143240A1 (de) * 1991-10-30 1993-05-06 Stucki Kunststoffwerk Und Werkzeugbau Gmbh, 4902 Bad Salzuflen, De Transportkasten
TW451535B (en) * 1998-09-04 2001-08-21 Sony Corp Semiconductor device and package, and fabrication method thereof
US20070039826A1 (en) * 2005-08-18 2007-02-22 Chia-Hua Chang Thickening method of an electroforming shim
US8363861B2 (en) * 2009-03-20 2013-01-29 Brian Hughes Entertainment system for use during the operation of a magnetic resonance imaging device
JP2012199436A (ja) * 2011-03-22 2012-10-18 Toshiba Corp 半導体装置及びその製造方法
US9035448B2 (en) * 2012-06-29 2015-05-19 Materion Corporation Semiconductor packages having metal composite base plates

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Publication number Priority date Publication date Assignee Title
US3283224A (en) * 1965-08-18 1966-11-01 Trw Semiconductors Inc Mold capping semiconductor device
DE1614364C3 (de) * 1966-06-01 1979-04-05 Rca Corp., New York, N.Y. (V.St.A.) Verfahren zur Montage eines Halbleiter-Kristallelementes
US3500136A (en) * 1968-01-24 1970-03-10 Int Rectifier Corp Contact structure for small area contact devices

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0023165A1 (fr) * 1979-07-17 1981-01-28 Thomson-Csf Plate-forme support de grille de connexion, notamment pour boîtier de circuits intégrés, et boîtier comportant une telle plate-forme
FR2462024A1 (fr) * 1979-07-17 1981-02-06 Thomson Csf Plate-forme support de grille de connexion, notamment pour boitier de circuits integres, et boitier comportant une telle plate-forme

Also Published As

Publication number Publication date
US3601667A (en) 1971-08-24
FR2025717A1 (fr) 1970-09-11
BE742699A (fr) 1970-06-05
BE742698A (fr) 1970-06-05
GB1292636A (en) 1972-10-11
DE1961314A1 (de) 1971-01-14
DE1961077A1 (de) 1970-06-18
US3559002A (en) 1971-01-26
FR2025719A1 (fr) 1970-09-11
BE742701A (fr) 1970-06-05

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