FR2008771B1 - - Google Patents
Info
- Publication number
- FR2008771B1 FR2008771B1 FR6915846A FR6915846A FR2008771B1 FR 2008771 B1 FR2008771 B1 FR 2008771B1 FR 6915846 A FR6915846 A FR 6915846A FR 6915846 A FR6915846 A FR 6915846A FR 2008771 B1 FR2008771 B1 FR 2008771B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electrodes Of Semiconductors (AREA)
- Bipolar Transistors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US72998568A | 1968-05-17 | 1968-05-17 | |
US73004768A | 1968-05-17 | 1968-05-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2008771A1 FR2008771A1 (en) | 1970-01-23 |
FR2008771B1 true FR2008771B1 (en) | 1973-08-10 |
Family
ID=27111970
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR6915846A Expired FR2008771B1 (en) | 1968-05-17 | 1969-05-16 | |
FR6915845A Expired FR2011844B1 (en) | 1968-05-17 | 1969-05-16 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR6915845A Expired FR2011844B1 (en) | 1968-05-17 | 1969-05-16 |
Country Status (4)
Country | Link |
---|---|
DE (2) | DE1923253A1 (en) |
FR (2) | FR2008771B1 (en) |
GB (2) | GB1263381A (en) |
NL (2) | NL6907539A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE763522A (en) * | 1970-03-03 | 1971-07-16 | Licentia Gmbh | SERIES OF CONTACT LAYERS FOR SEMICONDUCTOR CONSTRUCTION ELEMENTS |
US4166279A (en) * | 1977-12-30 | 1979-08-28 | International Business Machines Corporation | Electromigration resistance in gold thin film conductors |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL134170C (en) * | 1963-12-17 | 1900-01-01 | ||
US3368113A (en) * | 1965-06-28 | 1968-02-06 | Westinghouse Electric Corp | Integrated circuit structures, and method of making same, including a dielectric medium for internal isolation |
DE1283970B (en) * | 1966-03-19 | 1968-11-28 | Siemens Ag | Metallic contact on a semiconductor component |
NL6706641A (en) * | 1966-11-07 | 1968-11-13 |
-
1969
- 1969-05-01 GB GB2223569A patent/GB1263381A/en not_active Expired
- 1969-05-07 DE DE19691923253 patent/DE1923253A1/en active Pending
- 1969-05-08 GB GB1265896D patent/GB1265896A/en not_active Expired
- 1969-05-16 FR FR6915846A patent/FR2008771B1/fr not_active Expired
- 1969-05-16 NL NL6907539A patent/NL6907539A/xx unknown
- 1969-05-16 DE DE19691924845 patent/DE1924845C3/en not_active Expired
- 1969-05-16 NL NL6907540A patent/NL163065C/en not_active IP Right Cessation
- 1969-05-16 FR FR6915845A patent/FR2011844B1/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
NL6907540A (en) | 1969-11-19 |
FR2008771A1 (en) | 1970-01-23 |
FR2011844B1 (en) | 1973-07-13 |
GB1263381A (en) | 1972-02-09 |
GB1265896A (en) | 1972-03-08 |
NL163065B (en) | 1980-02-15 |
DE1924845B2 (en) | 1978-03-09 |
FR2011844A1 (en) | 1970-03-13 |
DE1924845A1 (en) | 1969-11-27 |
NL6907539A (en) | 1969-11-19 |
DE1923253A1 (en) | 1969-12-11 |
DE1924845C3 (en) | 1978-11-16 |
NL163065C (en) | 1980-07-15 |