FR2003573A1 - - Google Patents
Info
- Publication number
- FR2003573A1 FR2003573A1 FR6906435A FR6906435A FR2003573A1 FR 2003573 A1 FR2003573 A1 FR 2003573A1 FR 6906435 A FR6906435 A FR 6906435A FR 6906435 A FR6906435 A FR 6906435A FR 2003573 A1 FR2003573 A1 FR 2003573A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1526268 | 1968-03-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR2003573A1 true FR2003573A1 (de) | 1969-11-07 |
Family
ID=11883923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR6906435A Pending FR2003573A1 (de) | 1968-03-09 | 1969-03-07 |
Country Status (3)
| Country | Link |
|---|---|
| CH (1) | CH487504A (de) |
| DE (1) | DE1912041A1 (de) |
| FR (1) | FR2003573A1 (de) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4151548A (en) * | 1976-09-04 | 1979-04-24 | Bbc Brown, Boveri & Company, Limited | Cooling container for cooling a semiconductor element |
| US4392153A (en) * | 1978-05-01 | 1983-07-05 | General Electric Company | Cooled semiconductor power module including structured strain buffers without dry interfaces |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3763402A (en) * | 1970-11-09 | 1973-10-02 | Gen Electric | Fluid cooled rectifier holding assembly |
| US4008486A (en) * | 1975-06-02 | 1977-02-15 | International Rectifier Corporation | Compression-assembled semiconductor device with nesting circular flanges and flexible locating ring |
| CS190866B1 (en) * | 1977-02-18 | 1979-06-29 | Petr Novak | High-capacity semiconductor detail |
| US4274106A (en) * | 1977-11-07 | 1981-06-16 | Mitsubishi Denki Kabushiki Kaisha | Explosion proof vibration resistant flat package semiconductor device |
| DE4103486A1 (de) * | 1991-02-06 | 1992-08-20 | Abb Patent Gmbh | Anordnung zur kuehlung waermeerzeugender bauelemente |
| DE4302816C2 (de) * | 1993-01-28 | 1996-08-08 | Aeg Westinghouse Transport | Anordnung zur Kühlung von druckkontaktierbaren Leistungs-Scheibenhalbleitern |
| DE102004057497B4 (de) * | 2004-11-29 | 2012-01-12 | Siemens Ag | Wärmeaustauschvorrichtung und Verfahren zum Herstellen der Wärmeaustauschvorrichtung sowie Anordnung eines Bauelements und der Wärmeaustauschvorrichtung und Verfahren zum Herstellen der Anordnung |
| CN115863269B (zh) * | 2022-10-27 | 2024-02-13 | 遵义筑芯威半导体技术有限公司 | 一种高散热封装结构及其封装工艺 |
-
1969
- 1969-03-07 FR FR6906435A patent/FR2003573A1/fr active Pending
- 1969-03-07 CH CH345869A patent/CH487504A/de not_active IP Right Cessation
- 1969-03-10 DE DE19691912041 patent/DE1912041A1/de active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4151548A (en) * | 1976-09-04 | 1979-04-24 | Bbc Brown, Boveri & Company, Limited | Cooling container for cooling a semiconductor element |
| US4392153A (en) * | 1978-05-01 | 1983-07-05 | General Electric Company | Cooled semiconductor power module including structured strain buffers without dry interfaces |
Also Published As
| Publication number | Publication date |
|---|---|
| DE1912041A1 (de) | 1969-09-18 |
| CH487504A (de) | 1970-03-15 |