FR2003163A1 - SEMICONDUCTOR DEVICE AND ITS MANUFACTURING PROCESS - Google Patents

SEMICONDUCTOR DEVICE AND ITS MANUFACTURING PROCESS

Info

Publication number
FR2003163A1
FR2003163A1 FR6905711A FR6905711A FR2003163A1 FR 2003163 A1 FR2003163 A1 FR 2003163A1 FR 6905711 A FR6905711 A FR 6905711A FR 6905711 A FR6905711 A FR 6905711A FR 2003163 A1 FR2003163 A1 FR 2003163A1
Authority
FR
France
Prior art keywords
semiconductor device
manufacturing process
manufacturing
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR6905711A
Other languages
French (fr)
Other versions
FR2003163B1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1362768A external-priority patent/JPS5510976B1/ja
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of FR2003163A1 publication Critical patent/FR2003163A1/en
Application granted granted Critical
Publication of FR2003163B1 publication Critical patent/FR2003163B1/fr
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291Oxides or nitrides or carbides, e.g. ceramics, glass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157Partial encapsulation or coating
    • H01L23/3171Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157Partial encapsulation or coating
    • H01L23/3192Multilayer coating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3025Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Formation Of Insulating Films (AREA)
FR6905711A 1968-03-04 1969-03-03 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING PROCESS Granted FR2003163A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1362768A JPS5510976B1 (en) 1968-03-04 1968-03-04
JP2518168 1968-04-17

Publications (2)

Publication Number Publication Date
FR2003163A1 true FR2003163A1 (en) 1969-11-07
FR2003163B1 FR2003163B1 (en) 1974-06-14

Family

ID=26349441

Family Applications (1)

Application Number Title Priority Date Filing Date
FR6905711A Granted FR2003163A1 (en) 1968-03-04 1969-03-03 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING PROCESS

Country Status (4)

Country Link
DE (1) DE1910746A1 (en)
FR (1) FR2003163A1 (en)
GB (1) GB1255995A (en)
NL (1) NL6903255A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2494499A1 (en) * 1980-11-17 1982-05-21 Int Rectifier Corp FLAT STRUCTURE FOR HIGH VOLTAGE SEMICONDUCTOR DEVICES

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4002511A (en) * 1975-04-16 1977-01-11 Ibm Corporation Method for forming masks comprising silicon nitride and novel mask structures produced thereby
JPS5627935A (en) * 1979-08-15 1981-03-18 Toshiba Corp Semiconductor device
DE4109533C2 (en) * 1990-09-13 1994-06-23 Eupec Gmbh & Co Kg Passivated semiconductor component and method for its production
US5639325A (en) * 1995-02-01 1997-06-17 The Whitaker Corporation Process for producing a glass-coated article
US6749918B2 (en) 1997-11-18 2004-06-15 Johan Staal Hygiene mats
DE102013218494B4 (en) 2013-09-16 2021-06-02 Infineon Technologies Ag Semiconductor component with a passivation layer and manufacturing process
CN114171563B (en) * 2021-11-30 2023-07-04 武汉华星光电半导体显示技术有限公司 Display panel and display device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1390639A (en) * 1963-04-02 1965-02-26 Rca Corp Semiconductor device manufacturing process
FR1548847A (en) * 1967-01-13 1968-12-06
FR1557549A (en) * 1967-03-29 1969-02-14

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1390639A (en) * 1963-04-02 1965-02-26 Rca Corp Semiconductor device manufacturing process
FR1548847A (en) * 1967-01-13 1968-12-06
FR1557549A (en) * 1967-03-29 1969-02-14

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
*REVUE AMERICAINE "I.B.M. TECHNICAL DISCLOSURE BULLETIN" VOL. 9 AVRIL 1967 "PHOSPHOSILICATE GLASS ON SEMI-CONDUCTEUR DEVICES P.D. DAVIDSE, PAGE 1645. *
*REVUE AMERICAINE I.B.M. TECHNICAL DISCLOSURE BULLETIN, VOL. 8 AVRIL 1966 PB - SIO2 COMPOSITE LAYER AND MEFRADE OF FORMING R.P. ESCH ET AL. PAGE 1641. *
REVUE AMERICAINE" I.B.M. TECHNICAL DISCLOSURE BULLETIN" VOL. 10 JUILLET 1967 "PASSIVATION OF SILICON-DIOXIDE WITH THIN ALUMINIUM OXIDE LAYER "P.J. BURKHARDT, PAGE 160. *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2494499A1 (en) * 1980-11-17 1982-05-21 Int Rectifier Corp FLAT STRUCTURE FOR HIGH VOLTAGE SEMICONDUCTOR DEVICES

Also Published As

Publication number Publication date
DE1910746A1 (en) 1970-03-12
DE1910746B2 (en) 1970-11-19
GB1255995A (en) 1971-12-08
NL6903255A (en) 1969-09-08
FR2003163B1 (en) 1974-06-14

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Legal Events

Date Code Title Description
ST Notification of lapse
AR Application made for restoration
BR Restoration of rights
ST Notification of lapse