FR1560694A - - Google Patents

Info

Publication number
FR1560694A
FR1560694A FR1560694DA FR1560694A FR 1560694 A FR1560694 A FR 1560694A FR 1560694D A FR1560694D A FR 1560694DA FR 1560694 A FR1560694 A FR 1560694A
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of FR1560694A publication Critical patent/FR1560694A/fr
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Coating By Spraying Or Casting (AREA)
  • Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
FR1560694D 1967-04-10 1968-02-23 Expired FR1560694A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US62966067A 1967-04-10 1967-04-10

Publications (1)

Publication Number Publication Date
FR1560694A true FR1560694A (fr) 1969-03-21

Family

ID=24523936

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1560694D Expired FR1560694A (fr) 1967-04-10 1968-02-23

Country Status (4)

Country Link
US (1) US3471396A (fr)
DE (1) DE1765127B2 (fr)
FR (1) FR1560694A (fr)
GB (1) GB1149370A (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3860507A (en) * 1972-11-29 1975-01-14 Rca Corp Rf sputtering apparatus and method
US4076575A (en) * 1976-06-30 1978-02-28 International Business Machines Corporation Integrated fabrication method of forming connectors through insulative layers
EP0032788B2 (fr) * 1980-01-16 1989-12-06 National Research Development Corporation Procédé pour le dépôt de revêtements par décharge lumineuse
US4374391A (en) * 1980-09-24 1983-02-15 Bell Telephone Laboratories, Incorporated Device fabrication procedure
JPS5842126B2 (ja) * 1980-10-31 1983-09-17 鐘淵化学工業株式会社 アモルファスシリコンの製造方法
JPS5816078A (ja) * 1981-07-17 1983-01-29 Toshiba Corp プラズマエツチング装置
JPS5957416A (ja) * 1982-09-27 1984-04-03 Konishiroku Photo Ind Co Ltd 化合物半導体層の形成方法
CA1269950C (fr) * 1984-06-22 1990-06-05 Dispositif de decomposition par decharge incandescente
DE3512196A1 (de) * 1985-04-03 1986-10-16 Hartmann & Braun Ag, 6000 Frankfurt Verfahren zum aufbringen duenner schichten auf einem substrat
US4915917A (en) * 1987-02-19 1990-04-10 The Johns Hopkins University Glow discharge unit
AU2003195A (en) * 1994-06-21 1996-01-04 Boc Group, Inc., The Improved power distribution for multiple electrode plasma systems using quarter wavelength transmission lines
EP1812949B1 (fr) * 2004-11-12 2010-07-07 Oerlikon Trading AG, Trübbach Reacteur a plasma rf a couplage capacitif
AT13602U3 (de) * 2013-10-29 2014-08-15 Plansee Se Sputtering Target und Verfahren zur Herstellung
US9677008B2 (en) 2014-12-04 2017-06-13 Harris Corporation Hydrocarbon emulsion separator system and related methods

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA596342A (en) * 1960-04-19 Megatron Limited Production of thin layers by cathode sputtering
US3391071A (en) * 1963-07-22 1968-07-02 Bell Telephone Labor Inc Method of sputtering highly pure refractory metals in an anodically biased chamber

Also Published As

Publication number Publication date
US3471396A (en) 1969-10-07
GB1149370A (en) 1969-04-23
DE1765127A1 (de) 1972-04-06
DE1765127B2 (de) 1979-01-18

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Legal Events

Date Code Title Description
ST Notification of lapse