FR1535282A - Corps de refroidissement pour éléments de construction semi-conducteurs - Google Patents
Corps de refroidissement pour éléments de construction semi-conducteursInfo
- Publication number
- FR1535282A FR1535282A FR119340A FR119340A FR1535282A FR 1535282 A FR1535282 A FR 1535282A FR 119340 A FR119340 A FR 119340A FR 119340 A FR119340 A FR 119340A FR 1535282 A FR1535282 A FR 1535282A
- Authority
- FR
- France
- Prior art keywords
- cooling body
- building elements
- semiconductor building
- semiconductor
- elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR119340A FR1535282A (fr) | 1966-08-29 | 1967-08-29 | Corps de refroidissement pour éléments de construction semi-conducteurs |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CS560566 | 1966-08-29 | ||
| FR119340A FR1535282A (fr) | 1966-08-29 | 1967-08-29 | Corps de refroidissement pour éléments de construction semi-conducteurs |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR1535282A true FR1535282A (fr) | 1968-08-02 |
Family
ID=25746210
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR119340A Expired FR1535282A (fr) | 1966-08-29 | 1967-08-29 | Corps de refroidissement pour éléments de construction semi-conducteurs |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR1535282A (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2479564A1 (fr) * | 1980-03-26 | 1981-10-02 | Thomson Csf | Boitier d'encapsulation pour module de puissance en circuit hybride |
-
1967
- 1967-08-29 FR FR119340A patent/FR1535282A/fr not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2479564A1 (fr) * | 1980-03-26 | 1981-10-02 | Thomson Csf | Boitier d'encapsulation pour module de puissance en circuit hybride |
| EP0037301A2 (fr) * | 1980-03-26 | 1981-10-07 | Thomson-Csf | Boîtier d'encapsulation pour module de puissance en circuit hybride |
| EP0037301A3 (en) * | 1980-03-26 | 1981-10-14 | Thomson-Csf | Encapsulating housing for hybrid circuit power module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| AT268814B (de) | Korrosionsschutzmittel | |
| FR1507469A (fr) | Corps poreux réfractaires | |
| FR1514520A (fr) | Convertisseur basculant | |
| AT260368B (de) | Umkehrstromrichter | |
| FR1344269A (fr) | Construction par éléments de paroi préfabriqués | |
| FR1535282A (fr) | Corps de refroidissement pour éléments de construction semi-conducteurs | |
| FR1532954A (fr) | éléments de construction | |
| FR1469605A (fr) | Panneau pour construction | |
| AT282165B (de) | Großflächenschalung | |
| FR1501402A (fr) | éléments préfabriqués pour la construction | |
| BE753308A (fr) | Corps de refroidissement pour elements a semi-conducteur | |
| FR1463363A (fr) | éléments de couverture pour toiture | |
| FR1493036A (fr) | Raccord pour éléments de construction tubulaires | |
| FR1493051A (fr) | Perfectionnement apporté aux charpentes | |
| AT271546B (de) | Betonstein | |
| FR1502064A (fr) | Ossature pour bâtiments | |
| FR1508699A (fr) | Evier | |
| FR1530299A (fr) | éléments préfabriqués pour ossature de bâtiment | |
| FR1513236A (fr) | Perfectionnement apporté aux dalles de revêtement | |
| FR1361406A (fr) | éléments préfabriqués pour la construction | |
| FR1500972A (fr) | Panneaux préfabriqués pour constructions économiques | |
| FR1475488A (fr) | Raccord pour éléments de tuyauterie | |
| FR1474911A (fr) | Cordeau de délimitation de chantier | |
| FR1475505A (fr) | Dispositif pour la fabrication de corps céramiques | |
| GB1182697A (en) | Manufacture of Hydraulic Cement |