FR1497294A - Process for the metallization of semiconductors and semiconductors formed by this process - Google Patents
Process for the metallization of semiconductors and semiconductors formed by this processInfo
- Publication number
- FR1497294A FR1497294A FR81155A FR81155A FR1497294A FR 1497294 A FR1497294 A FR 1497294A FR 81155 A FR81155 A FR 81155A FR 81155 A FR81155 A FR 81155A FR 1497294 A FR1497294 A FR 1497294A
- Authority
- FR
- France
- Prior art keywords
- semiconductors
- metallization
- semiconductors formed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
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- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/03—Manufacturing methods
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- H01L2224/051—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/05117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR81155A FR1497294A (en) | 1965-10-22 | 1966-10-21 | Process for the metallization of semiconductors and semiconductors formed by this process |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US50251865A | 1965-10-22 | 1965-10-22 | |
FR81155A FR1497294A (en) | 1965-10-22 | 1966-10-21 | Process for the metallization of semiconductors and semiconductors formed by this process |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1497294A true FR1497294A (en) | 1967-10-06 |
Family
ID=26173862
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR81155A Expired FR1497294A (en) | 1965-10-22 | 1966-10-21 | Process for the metallization of semiconductors and semiconductors formed by this process |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR1497294A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2001819A1 (en) * | 1968-02-13 | 1969-10-03 | Philips Nv | PROCESS AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICES |
-
1966
- 1966-10-21 FR FR81155A patent/FR1497294A/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2001819A1 (en) * | 1968-02-13 | 1969-10-03 | Philips Nv | PROCESS AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICES |
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