FR1441218A - Procédé d'enlèvement de matières, en particulier pour la perforation des matières plastiques - Google Patents
Procédé d'enlèvement de matières, en particulier pour la perforation des matières plastiquesInfo
- Publication number
- FR1441218A FR1441218A FR25923A FR25923A FR1441218A FR 1441218 A FR1441218 A FR 1441218A FR 25923 A FR25923 A FR 25923A FR 25923 A FR25923 A FR 25923A FR 1441218 A FR1441218 A FR 1441218A
- Authority
- FR
- France
- Prior art keywords
- perforating
- plastics
- removing materials
- materials
- perforating plastics
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K15/00—Electron-beam welding or cutting
- B23K15/08—Removing material, e.g. by cutting, by hole drilling
- B23K15/085—Boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K15/00—Electron-beam welding or cutting
- B23K15/08—Removing material, e.g. by cutting, by hole drilling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/26—Perforating by non-mechanical means, e.g. by fluid jet
- B26F1/31—Perforating by non-mechanical means, e.g. by fluid jet by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/302—Controlling tubes by external information, e.g. programme control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/31—Electron-beam or ion-beam tubes for localised treatment of objects for cutting or drilling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/092—Particle beam, e.g. using an electron beam or an ion beam
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Plasma & Fusion (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Welding Or Cutting Using Electron Beams (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
- Laser Beam Processing (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEST22452A DE1301209B (de) | 1964-07-24 | 1964-07-24 | Verfahren zum Abtragen, insbesondere zum Perforieren von flexiblen Kunststoffen |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1441218A true FR1441218A (fr) | 1966-06-03 |
Family
ID=7459388
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR25923A Expired FR1441218A (fr) | 1964-07-24 | 1965-07-24 | Procédé d'enlèvement de matières, en particulier pour la perforation des matières plastiques |
Country Status (7)
Country | Link |
---|---|
US (1) | US3371190A (fr) |
AT (1) | AT261767B (fr) |
CH (1) | CH426036A (fr) |
DE (1) | DE1301209B (fr) |
FR (1) | FR1441218A (fr) |
GB (1) | GB1089285A (fr) |
NL (1) | NL6509427A (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2556607A1 (fr) * | 1983-12-20 | 1985-06-21 | Medizin Labortechnik Veb K | Procede de fabrication d'un separateur |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL6807439A (fr) * | 1968-05-27 | 1969-12-01 | ||
US3622751A (en) * | 1969-06-12 | 1971-11-23 | Cons Paper Bahamas Ltd | Method and apparatus for electrically perforating sheet or web material |
US3696742A (en) * | 1969-10-06 | 1972-10-10 | Monsanto Res Corp | Method of making a stencil for screen-printing using a laser beam |
US3846521A (en) * | 1971-02-03 | 1974-11-05 | Union Carbide Corp | Low energy electron beam treatment of polymeric films, and apparatus therefore |
DE2449264A1 (de) * | 1974-10-16 | 1976-04-22 | Steigerwald Strahltech | Verfahren zum energiestrahl-perforieren, insbesondere elektronenstrahl-perforieren, von mehrschichtigem kunstleder |
US4032743A (en) * | 1975-06-27 | 1977-06-28 | Marvel Engineering Company | Laser microperforator |
JPS57209786A (en) * | 1981-06-17 | 1982-12-23 | Hitachi Ltd | Electron beam machining device |
US4879451A (en) * | 1988-07-14 | 1989-11-07 | Sun-Flex Company, Inc. | Laser cut video display terminal filter screen |
DE4031546A1 (de) * | 1990-10-05 | 1992-04-09 | Hell Rudolf Dr Ing Gmbh | Verfahren und vorrichtung zur herstellung einer texturwalze |
DE4031547A1 (de) * | 1990-10-05 | 1992-04-09 | Hell Rudolf Dr Ing Gmbh | Verfahren und vorrichtung zur herstellung von texturwalzen |
DE4031545A1 (de) * | 1990-10-05 | 1992-04-09 | Hell Rudolf Dr Ing Gmbh | Verfahren und vorrichtung zur herstellung einer texturwalze |
US5330908A (en) * | 1992-12-23 | 1994-07-19 | The United States Of America As Represented By The Administrator, National Aeronautics And Space Administration | High density cell culture system |
CN103448096B (zh) * | 2013-08-27 | 2015-06-17 | 北京科电微波电子有限公司 | 高压电子束透气皮革微孔加工*** |
DE102014004035A1 (de) * | 2014-03-21 | 2015-10-08 | Probeam Ag & Co. Kgaa | Verfahren zum Erzeugen kleiner Bohrungen in Werkstücken |
US9890310B2 (en) * | 2014-08-15 | 2018-02-13 | Douglas Dynamics, Llc | Material mixing system |
CN106564093B (zh) * | 2016-06-15 | 2018-10-19 | 王小六 | 一种皮革电弧穿透***的使用方法 |
EP3884124A4 (fr) * | 2018-11-20 | 2022-08-10 | Micon Technology, Inc. | Produit exposé au rayonnement d'un faisceau d'électrons et procédés |
US11440151B2 (en) * | 2019-06-07 | 2022-09-13 | Applied Materials Israel Ltd. | Milling a multi-layered object |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1033816B (de) * | 1952-07-25 | 1958-07-10 | Zeiss Carl Fa | Verfahren zum Bohren feiner Loecher |
US2668133A (en) * | 1953-04-13 | 1954-02-02 | United Shoe Machinery Corp | Adhesive bonding processes |
US2861166A (en) * | 1955-03-14 | 1958-11-18 | Jr William W Cargill | Method and apparatus for hot machining |
IT559958A (fr) * | 1955-07-06 | 1900-01-01 | ||
NL240710A (fr) * | 1958-07-01 | |||
US2978569A (en) * | 1958-11-07 | 1961-04-04 | Gen Motors Corp | Method and apparatus for forming holes in sheet metal |
FR1353054A (fr) * | 1963-01-12 | 1964-02-21 | Alsacienne D Electronique Et D | Procédé de soudage par bombardement électronique |
US3293587A (en) * | 1965-10-20 | 1966-12-20 | Sprague Electric Co | Electrical resistor and the like |
-
1964
- 1964-07-24 DE DEST22452A patent/DE1301209B/de active Pending
-
1965
- 1965-07-16 GB GB30289/65A patent/GB1089285A/en not_active Expired
- 1965-07-21 NL NL6509427A patent/NL6509427A/xx unknown
- 1965-07-22 CH CH1055065A patent/CH426036A/de unknown
- 1965-07-23 AT AT677765A patent/AT261767B/de active
- 1965-07-24 FR FR25923A patent/FR1441218A/fr not_active Expired
- 1965-07-26 US US474672A patent/US3371190A/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2556607A1 (fr) * | 1983-12-20 | 1985-06-21 | Medizin Labortechnik Veb K | Procede de fabrication d'un separateur |
Also Published As
Publication number | Publication date |
---|---|
DE1301209B (de) | 1969-08-14 |
CH426036A (de) | 1966-12-15 |
AT261767B (de) | 1968-05-10 |
NL6509427A (fr) | 1966-01-25 |
US3371190A (en) | 1968-02-27 |
GB1089285A (en) | 1967-11-01 |
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