FR1259407A - Electrolytic bath for thick deposit of gold-copper alloy - Google Patents

Electrolytic bath for thick deposit of gold-copper alloy

Info

Publication number
FR1259407A
FR1259407A FR820914A FR820914A FR1259407A FR 1259407 A FR1259407 A FR 1259407A FR 820914 A FR820914 A FR 820914A FR 820914 A FR820914 A FR 820914A FR 1259407 A FR1259407 A FR 1259407A
Authority
FR
France
Prior art keywords
gold
copper alloy
electrolytic bath
thick deposit
deposit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR820914A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MAISON MURAT
Original Assignee
MAISON MURAT
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MAISON MURAT filed Critical MAISON MURAT
Priority to FR820914A priority Critical patent/FR1259407A/en
Priority to CH246461A priority patent/CH390024A/en
Application granted granted Critical
Publication of FR1259407A publication Critical patent/FR1259407A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/62Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
FR820914A 1960-03-10 1960-03-10 Electrolytic bath for thick deposit of gold-copper alloy Expired FR1259407A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR820914A FR1259407A (en) 1960-03-10 1960-03-10 Electrolytic bath for thick deposit of gold-copper alloy
CH246461A CH390024A (en) 1960-03-10 1961-03-01 Electrolytic bath for thick and shiny gold-copper alloy deposit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR820914A FR1259407A (en) 1960-03-10 1960-03-10 Electrolytic bath for thick deposit of gold-copper alloy

Publications (1)

Publication Number Publication Date
FR1259407A true FR1259407A (en) 1961-04-28

Family

ID=8726782

Family Applications (1)

Application Number Title Priority Date Filing Date
FR820914A Expired FR1259407A (en) 1960-03-10 1960-03-10 Electrolytic bath for thick deposit of gold-copper alloy

Country Status (2)

Country Link
CH (1) CH390024A (en)
FR (1) FR1259407A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH710184B1 (en) 2007-09-21 2016-03-31 Aliprandini Laboratoires G Process for obtaining a yellow gold alloy deposit by electroplating without the use of toxic metals or metalloids.
EP2312021B1 (en) 2009-10-15 2020-03-18 The Swatch Group Research and Development Ltd. Method for obtaining a deposit of a yellow gold alloy by galvanoplasty without using toxic metals

Also Published As

Publication number Publication date
CH390024A (en) 1965-03-31

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