FR1077695A - Procédé de soudage de circuits imprimés - Google Patents
Procédé de soudage de circuits imprimésInfo
- Publication number
- FR1077695A FR1077695A FR1077695DA FR1077695A FR 1077695 A FR1077695 A FR 1077695A FR 1077695D A FR1077695D A FR 1077695DA FR 1077695 A FR1077695 A FR 1077695A
- Authority
- FR
- France
- Prior art keywords
- soldering process
- pcb soldering
- pcb
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J9/00—Hammer-impression mechanisms
- B41J9/02—Hammers; Arrangements thereof
- B41J9/04—Hammers; Arrangements thereof of single hammers, e.g. travelling along printing line
- B41J9/06—Hammers; Arrangements thereof of single hammers, e.g. travelling along printing line of stationary hammers, e.g. engaging a single type-carrier
- B41J9/08—Hammers; Arrangements thereof of single hammers, e.g. travelling along printing line of stationary hammers, e.g. engaging a single type-carrier engaging more than one type-carrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0669—Solder baths with dipping means
- B23K3/0684—Solder baths with dipping means with means for oscillating the workpiece
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Accessory Devices And Overall Control Thereof (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US320965XA | 1952-05-24 | 1952-05-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1077695A true FR1077695A (fr) | 1954-11-10 |
Family
ID=21863082
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1077695D Expired FR1077695A (fr) | 1952-05-24 | 1953-04-09 | Procédé de soudage de circuits imprimés |
Country Status (3)
Country | Link |
---|---|
CH (1) | CH320965A (fr) |
FR (1) | FR1077695A (fr) |
GB (1) | GB783874A (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1276766C2 (de) * | 1962-07-03 | 1973-10-18 | Siemens Ag | Baugruppeneinheit fuer eine Anlage der elektrischen Nachrichtentechnik |
-
1953
- 1953-04-09 FR FR1077695D patent/FR1077695A/fr not_active Expired
- 1953-05-23 CH CH320965D patent/CH320965A/de unknown
-
1954
- 1954-10-01 GB GB16499/55A patent/GB783874A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB783874A (en) | 1957-10-02 |
CH320965A (de) | 1957-04-15 |
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