FI920733A - Laitteisto substraatin päällystämiseksi - Google Patents
Laitteisto substraatin päällystämiseksi Download PDFInfo
- Publication number
- FI920733A FI920733A FI920733A FI920733A FI920733A FI 920733 A FI920733 A FI 920733A FI 920733 A FI920733 A FI 920733A FI 920733 A FI920733 A FI 920733A FI 920733 A FI920733 A FI 920733A
- Authority
- FI
- Finland
- Prior art keywords
- coating
- substrate
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3441—Dark space shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4109018A DE4109018C2 (de) | 1991-03-20 | 1991-03-20 | Vorrichtung zum Beschichten eines Substrats |
DE4109018 | 1991-03-20 |
Publications (4)
Publication Number | Publication Date |
---|---|
FI920733A0 FI920733A0 (fi) | 1992-02-20 |
FI920733A true FI920733A (fi) | 1992-09-21 |
FI99030B FI99030B (fi) | 1997-06-13 |
FI99030C FI99030C (fi) | 1997-09-25 |
Family
ID=6427707
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI920733A FI99030C (fi) | 1991-03-20 | 1992-02-20 | Laitteisto substraatin päällystämiseksi |
Country Status (6)
Country | Link |
---|---|
US (1) | US5167789A (fi) |
EP (1) | EP0504477B1 (fi) |
JP (1) | JP3397801B2 (fi) |
KR (1) | KR100245297B1 (fi) |
DE (2) | DE4109018C2 (fi) |
FI (1) | FI99030C (fi) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4237517A1 (de) * | 1992-11-06 | 1994-05-11 | Leybold Ag | Vorrichtung zum Beschichten eines Substrats, insbesondere mit elektrisch nichtleitenden Schichten |
DE4304581A1 (de) * | 1993-02-16 | 1994-08-18 | Leybold Ag | Vorrichtung zum Beschichten eines Substrats |
IL108677A (en) * | 1994-02-17 | 1997-11-20 | Thin Films Ltd | Sputtering method and apparatus for depositing a coating onto a substrate |
DE4413378A1 (de) * | 1994-04-19 | 1995-10-26 | Leybold Ag | Einrichtung zum Beschichten eines Substrats |
US5527439A (en) * | 1995-01-23 | 1996-06-18 | The Boc Group, Inc. | Cylindrical magnetron shield structure |
DE19506513C2 (de) * | 1995-02-24 | 1996-12-05 | Fraunhofer Ges Forschung | Einrichtung zur reaktiven Beschichtung |
DE19540543A1 (de) * | 1995-10-31 | 1997-05-07 | Leybold Ag | Vorrichtung zum Beschichten eines Substrats mit Hilfe des Chemical-Vapor-Deposition-Verfahrens |
DE19747923C2 (de) * | 1997-10-30 | 2002-09-12 | Leybold Systems Gmbh | Sputterkathode |
US6499425B1 (en) * | 1999-01-22 | 2002-12-31 | Micron Technology, Inc. | Quasi-remote plasma processing method and apparatus |
JP4656697B2 (ja) * | 2000-06-16 | 2011-03-23 | キヤノンアネルバ株式会社 | 高周波スパッタリング装置 |
US7001491B2 (en) * | 2003-06-26 | 2006-02-21 | Tokyo Electron Limited | Vacuum-processing chamber-shield and multi-chamber pumping method |
DE102004014855A1 (de) * | 2004-03-26 | 2004-10-21 | Applied Films Gmbh & Co. Kg | Einrichtung zum reaktiven Sputtern |
US8480381B2 (en) * | 2005-08-17 | 2013-07-09 | Ceto Ip Pty Ltd. | Wave energy conversion |
WO2014024406A1 (ja) * | 2012-08-09 | 2014-02-13 | 株式会社アルバック | 成膜方法および成膜装置 |
US10431440B2 (en) * | 2015-12-20 | 2019-10-01 | Applied Materials, Inc. | Methods and apparatus for processing a substrate |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2707144A1 (de) * | 1976-02-19 | 1977-08-25 | Sloan Technology Corp | Kathodenzerstaeubungsvorrichtung |
DE3624150C2 (de) * | 1986-07-17 | 1994-02-24 | Leybold Ag | Zerstäubungskatode nach dem Magnetronprinzip |
DE3624480A1 (de) * | 1986-07-19 | 1988-01-28 | Leybold Heraeus Gmbh & Co Kg | Zerstaeubungskatode fuer vakuum-beschichtungsanlagen |
DE3800449A1 (de) * | 1988-01-09 | 1989-07-20 | Leybold Ag | Verfahren und einrichtung zur herstellung magnetooptischer, speicher- und loeschfaehiger datentraeger |
DE3821207A1 (de) * | 1988-06-23 | 1989-12-28 | Leybold Ag | Anordnung zum beschichten eines substrats mit dielektrika |
JPH0219461A (ja) * | 1988-07-07 | 1990-01-23 | Matsushita Electric Ind Co Ltd | スパッタ装置 |
DE3929695C2 (de) * | 1989-09-07 | 1996-12-19 | Leybold Ag | Vorrichtung zum Beschichten eines Substrats |
-
1991
- 1991-03-20 DE DE4109018A patent/DE4109018C2/de not_active Expired - Fee Related
- 1991-05-09 US US07/697,707 patent/US5167789A/en not_active Expired - Lifetime
- 1991-10-28 EP EP91118309A patent/EP0504477B1/de not_active Expired - Lifetime
- 1991-10-28 DE DE59108911T patent/DE59108911D1/de not_active Expired - Lifetime
-
1992
- 1992-01-08 KR KR1019920000135A patent/KR100245297B1/ko not_active IP Right Cessation
- 1992-02-20 FI FI920733A patent/FI99030C/fi active
- 1992-03-19 JP JP06349492A patent/JP3397801B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5167789A (en) | 1992-12-01 |
FI99030C (fi) | 1997-09-25 |
EP0504477A1 (de) | 1992-09-23 |
FI99030B (fi) | 1997-06-13 |
DE4109018C2 (de) | 2002-02-28 |
DE59108911D1 (de) | 1998-02-05 |
KR920018237A (ko) | 1992-10-21 |
FI920733A0 (fi) | 1992-02-20 |
EP0504477B1 (de) | 1997-12-29 |
JPH0598437A (ja) | 1993-04-20 |
KR100245297B1 (ko) | 2000-03-02 |
JP3397801B2 (ja) | 2003-04-21 |
DE4109018A1 (de) | 1992-09-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
BB | Publication of examined application |