FI900434A0 - Anordning som aer laemplig foer ytinstallation av en halvledarkomponent och foerfarande foer komponentens ytinstallation pao en stoedskiva. - Google Patents
Anordning som aer laemplig foer ytinstallation av en halvledarkomponent och foerfarande foer komponentens ytinstallation pao en stoedskiva.Info
- Publication number
- FI900434A0 FI900434A0 FI900434A FI900434A FI900434A0 FI 900434 A0 FI900434 A0 FI 900434A0 FI 900434 A FI900434 A FI 900434A FI 900434 A FI900434 A FI 900434A FI 900434 A0 FI900434 A0 FI 900434A0
- Authority
- FI
- Finland
- Prior art keywords
- ytinstallation
- foer
- stoedskiva
- komponentens
- halvledarkomponent
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10477—Inverted
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10946—Leads attached onto leadless component after manufacturing the component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Packaging Frangible Articles (AREA)
- Wire Bonding (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP89101433A EP0379624A1 (de) | 1989-01-27 | 1989-01-27 | Anordnung eines zur Oberflächenmontage geeigneten Halbleiterbauelementes und ein Verfahren zu dessen Oberflächenmontage auf Trägerplatten |
Publications (1)
Publication Number | Publication Date |
---|---|
FI900434A0 true FI900434A0 (fi) | 1990-01-26 |
Family
ID=8200911
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI900434A FI900434A0 (fi) | 1989-01-27 | 1990-01-26 | Anordning som aer laemplig foer ytinstallation av en halvledarkomponent och foerfarande foer komponentens ytinstallation pao en stoedskiva. |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0379624A1 (fi) |
JP (1) | JPH02238654A (fi) |
CA (1) | CA2008553A1 (fi) |
FI (1) | FI900434A0 (fi) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7292450B2 (en) | 2006-01-31 | 2007-11-06 | Microsoft Corporation | High density surface mount part array layout and assembly technique |
EP2638804A1 (en) | 2009-09-30 | 2013-09-18 | Basf Se | Low volatile amine salts of anionic pesticides |
EP2460404A1 (en) | 2010-12-01 | 2012-06-06 | Basf Se | Compositions containing identical polyamine salts of mixed anionic pesticides |
US11109591B2 (en) | 2017-04-24 | 2021-09-07 | Taminco Bvba | Single phase liquids of alkanolamine salts of dicamba |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3123198C2 (de) * | 1980-12-08 | 1993-10-07 | Gao Ges Automation Org | Trägerelemente für einen IC-Baustein |
GB2103418B (en) * | 1981-06-18 | 1986-10-08 | Stanley Bracey | Packaging of electronics components |
EP0077276A3 (en) * | 1981-10-13 | 1986-03-26 | FAIRCHILD CAMERA & INSTRUMENT CORPORATION | Method for fabricating a hybrid circuit module |
-
1989
- 1989-01-27 EP EP89101433A patent/EP0379624A1/de not_active Withdrawn
-
1990
- 1990-01-25 JP JP2017661A patent/JPH02238654A/ja active Pending
- 1990-01-25 CA CA002008553A patent/CA2008553A1/en not_active Abandoned
- 1990-01-26 FI FI900434A patent/FI900434A0/fi not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0379624A1 (de) | 1990-08-01 |
JPH02238654A (ja) | 1990-09-20 |
CA2008553A1 (en) | 1990-07-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FD | Application lapsed | ||
MM | Patent lapsed |
Owner name: SIEMENS AKTIENGESELLSCHAFT |