FI890791A - Avkylningssystem foer transistor. - Google Patents

Avkylningssystem foer transistor. Download PDF

Info

Publication number
FI890791A
FI890791A FI890791A FI890791A FI890791A FI 890791 A FI890791 A FI 890791A FI 890791 A FI890791 A FI 890791A FI 890791 A FI890791 A FI 890791A FI 890791 A FI890791 A FI 890791A
Authority
FI
Finland
Prior art keywords
transistor
collector conductor
metal piece
avkylningssystem
foer
Prior art date
Application number
FI890791A
Other languages
English (en)
Other versions
FI890791A0 (fi
FI85783C (fi
FI85783B (fi
Inventor
Timo Saarnimo
Original Assignee
Nokia Mobira Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Mobira Oy filed Critical Nokia Mobira Oy
Priority to FI890791A priority Critical patent/FI85783C/fi
Publication of FI890791A0 publication Critical patent/FI890791A0/fi
Priority to US07/473,920 priority patent/US5214309A/en
Priority to EP90102984A priority patent/EP0384301B1/en
Priority to AT90102984T priority patent/ATE137065T1/de
Priority to DE69026523T priority patent/DE69026523T2/de
Publication of FI890791A publication Critical patent/FI890791A/fi
Application granted granted Critical
Publication of FI85783B publication Critical patent/FI85783B/fi
Publication of FI85783C publication Critical patent/FI85783C/fi

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Amplifiers (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Bipolar Transistors (AREA)
FI890791A 1989-02-17 1989-02-17 Kylningskonstruktion foer transistor. FI85783C (fi)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FI890791A FI85783C (fi) 1989-02-17 1989-02-17 Kylningskonstruktion foer transistor.
US07/473,920 US5214309A (en) 1989-02-17 1990-01-31 Thermally conductive bar cooling arrangement for a transistor
EP90102984A EP0384301B1 (en) 1989-02-17 1990-02-15 Cooling arrangement for a transistor
AT90102984T ATE137065T1 (de) 1989-02-17 1990-02-15 Kühlungsanordnung für einen transistor
DE69026523T DE69026523T2 (de) 1989-02-17 1990-02-15 Kühlungsanordnung für einen Transistor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI890791 1989-02-17
FI890791A FI85783C (fi) 1989-02-17 1989-02-17 Kylningskonstruktion foer transistor.

Publications (4)

Publication Number Publication Date
FI890791A0 FI890791A0 (fi) 1989-02-17
FI890791A true FI890791A (fi) 1990-08-18
FI85783B FI85783B (fi) 1992-02-14
FI85783C FI85783C (fi) 1992-05-25

Family

ID=8527924

Family Applications (1)

Application Number Title Priority Date Filing Date
FI890791A FI85783C (fi) 1989-02-17 1989-02-17 Kylningskonstruktion foer transistor.

Country Status (5)

Country Link
US (1) US5214309A (fi)
EP (1) EP0384301B1 (fi)
AT (1) ATE137065T1 (fi)
DE (1) DE69026523T2 (fi)
FI (1) FI85783C (fi)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI88452C (fi) * 1990-03-29 1993-05-10 Nokia Mobile Phones Ltd Konstruktion foer att foerbaettra avkylning av en effekttransistor
GB2297436B (en) * 1995-01-28 1999-06-09 Nokia Mobile Phones Ltd Mobile telephone apparatus
FI107849B (fi) * 1995-06-30 2001-10-15 Nokia Mobile Phones Ltd Soviteosa matkaviestimessä sen kiinnityslaitetta varten
FI953249A (fi) 1995-06-30 1996-12-31 Nokia Mobile Phones Ltd Puhelin ja sen teline
FI107850B (fi) * 1995-06-30 2001-10-15 Nokia Mobile Phones Ltd Kantoväline matkaviestimen kiinnityslaitetta varten
US6798882B2 (en) 1995-09-28 2004-09-28 Nokia Mobile Phones Limited Mobile station
DE19620834C1 (de) * 1996-05-23 1997-06-19 Nokia Mobile Phones Ltd Einrichtung für Schnurlostelefone
GB2317300B (en) 1996-09-12 2000-08-16 Nokia Mobile Phones Ltd A handset
ES2123435B1 (es) * 1996-10-29 1999-09-16 Mecanismos Aux Ind Sistema de disipacion termica en circuito impreso de 800 micras.
FI104927B (fi) 1997-10-02 2000-04-28 Nokia Mobile Phones Ltd Matkaviestin
GB2331866B (en) 1997-11-28 2001-08-29 Nokia Mobile Phones Ltd Radiotelephone
FI980303A (fi) * 1998-02-10 1999-08-11 Nokia Mobile Phones Ltd Pakkaus
GB9811381D0 (en) 1998-05-27 1998-07-22 Nokia Mobile Phones Ltd Predistortion control for power reduction
GB9811382D0 (en) 1998-05-27 1998-07-22 Nokia Mobile Phones Ltd A transmitter
GB2339113B (en) 1998-06-30 2003-05-21 Nokia Mobile Phones Ltd Data transmission in tdma system
EP2276329A1 (en) 2009-07-16 2011-01-19 ABB Research Ltd. Electronic circuit board with a thermal capacitor
US8383946B2 (en) * 2010-05-18 2013-02-26 Joinset, Co., Ltd. Heat sink
EP2868167B1 (en) * 2012-06-28 2022-09-28 Aktiebolaget Electrolux Printed circuit board and electric filter
DE102018109920A1 (de) 2018-04-25 2019-10-31 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Kühlung von leistungselektronischen Schaltungen
IT202100003965A1 (it) 2021-02-22 2022-08-22 Riccardo Carotenuto “circuito per ridurre il riscaldamento e aumentare l’efficienza di rettificatori a semiconduttore”

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3192307A (en) * 1964-05-29 1965-06-29 Burndy Corp Connector for component and printed circuit board
US3479570A (en) * 1966-06-14 1969-11-18 Rca Corp Encapsulation and connection structure for high power and high frequency semiconductor devices
US3517272A (en) * 1968-12-24 1970-06-23 Rca Corp Microwave circuit with coaxial package semiconductor device
US3962719A (en) * 1974-12-05 1976-06-08 Plastronics, Inc. Mounting pad and semiconductor encapsulation device combination
US3982271A (en) * 1975-02-07 1976-09-21 Rca Corporation Heat spreader and low parasitic transistor mounting
US4030001A (en) * 1975-11-19 1977-06-14 E-Systems, Inc. Co-planar lead connections to microstrip switching devices
DE2801875A1 (de) * 1978-01-17 1979-07-19 Siemens Ag Kuehlkoerper fuer hochfrequenz-bauelemente
JPS56105668A (en) * 1980-01-28 1981-08-22 Hitachi Ltd Thick film hybrid ic
JPH0135482Y2 (fi) * 1985-03-26 1989-10-30
NL8601743A (nl) * 1985-07-05 1987-02-02 Acrian Inc Transistorpakket.
JPS63104360A (ja) * 1986-10-20 1988-05-09 Mitsubishi Electric Corp 半導体装置
US5012322A (en) * 1987-05-18 1991-04-30 Allegro Microsystems, Inc. Semiconductor die and mounting assembly
JPH0750753B2 (ja) * 1987-08-21 1995-05-31 株式会社東芝 トランジスタ装置

Also Published As

Publication number Publication date
ATE137065T1 (de) 1996-05-15
FI890791A0 (fi) 1989-02-17
DE69026523T2 (de) 1996-09-12
US5214309A (en) 1993-05-25
EP0384301B1 (en) 1996-04-17
EP0384301A3 (en) 1993-01-07
FI85783C (fi) 1992-05-25
EP0384301A2 (en) 1990-08-29
FI85783B (fi) 1992-02-14
DE69026523D1 (de) 1996-05-23

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Legal Events

Date Code Title Description
MM Patent lapsed

Owner name: NOKIA-MOBIRA OY