FI20165054A - Joustava piirilevy - Google Patents

Joustava piirilevy

Info

Publication number
FI20165054A
FI20165054A FI20165054A FI20165054A FI20165054A FI 20165054 A FI20165054 A FI 20165054A FI 20165054 A FI20165054 A FI 20165054A FI 20165054 A FI20165054 A FI 20165054A FI 20165054 A FI20165054 A FI 20165054A
Authority
FI
Finland
Prior art keywords
flexible pcb
pcb
flexible
Prior art date
Application number
FI20165054A
Other languages
English (en)
Swedish (sv)
Inventor
Manu Myry
Aino-Maria Ilkko
Anni Varis
Anne Koskela
Original Assignee
Clothing Plus Mbu Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Clothing Plus Mbu Oy filed Critical Clothing Plus Mbu Oy
Priority to FI20165054A priority Critical patent/FI20165054A/fi
Priority to PCT/FI2017/050049 priority patent/WO2017129866A1/en
Publication of FI20165054A publication Critical patent/FI20165054A/fi

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4694—Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
FI20165054A 2016-01-28 2016-01-28 Joustava piirilevy FI20165054A (fi)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FI20165054A FI20165054A (fi) 2016-01-28 2016-01-28 Joustava piirilevy
PCT/FI2017/050049 WO2017129866A1 (en) 2016-01-28 2017-01-27 A flexible printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20165054A FI20165054A (fi) 2016-01-28 2016-01-28 Joustava piirilevy

Publications (1)

Publication Number Publication Date
FI20165054A true FI20165054A (fi) 2017-07-29

Family

ID=59397483

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20165054A FI20165054A (fi) 2016-01-28 2016-01-28 Joustava piirilevy

Country Status (2)

Country Link
FI (1) FI20165054A (fi)
WO (1) WO2017129866A1 (fi)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6930681B2 (ja) 2019-03-25 2021-09-01 株式会社村田製作所 伸縮性実装基板

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001047015A2 (en) * 1999-12-23 2001-06-28 Via, Inc. Electronic component protection devices and methods
US6932621B2 (en) * 2003-03-21 2005-08-23 The Boeing Company Connector interface pad for structurally integrated wiring
JP5195422B2 (ja) * 2006-03-31 2013-05-08 日本電気株式会社 配線基板、実装基板及び電子装置
DE102006055576A1 (de) * 2006-11-21 2008-05-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Herstellen eines dehnbaren Schaltungsträgers und dehnbarer Schaltungsträger
US9226402B2 (en) * 2012-06-11 2015-12-29 Mc10, Inc. Strain isolation structures for stretchable electronics
JP6159876B2 (ja) * 2014-03-31 2017-07-05 株式会社フジクラ 伸縮性基板及び回路基板

Also Published As

Publication number Publication date
WO2017129866A1 (en) 2017-08-03

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Legal Events

Date Code Title Description
FD Application lapsed