FI20165054A - Joustava piirilevy - Google Patents
Joustava piirilevyInfo
- Publication number
- FI20165054A FI20165054A FI20165054A FI20165054A FI20165054A FI 20165054 A FI20165054 A FI 20165054A FI 20165054 A FI20165054 A FI 20165054A FI 20165054 A FI20165054 A FI 20165054A FI 20165054 A FI20165054 A FI 20165054A
- Authority
- FI
- Finland
- Prior art keywords
- flexible pcb
- pcb
- flexible
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4694—Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20165054A FI20165054A (fi) | 2016-01-28 | 2016-01-28 | Joustava piirilevy |
PCT/FI2017/050049 WO2017129866A1 (en) | 2016-01-28 | 2017-01-27 | A flexible printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20165054A FI20165054A (fi) | 2016-01-28 | 2016-01-28 | Joustava piirilevy |
Publications (1)
Publication Number | Publication Date |
---|---|
FI20165054A true FI20165054A (fi) | 2017-07-29 |
Family
ID=59397483
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20165054A FI20165054A (fi) | 2016-01-28 | 2016-01-28 | Joustava piirilevy |
Country Status (2)
Country | Link |
---|---|
FI (1) | FI20165054A (fi) |
WO (1) | WO2017129866A1 (fi) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6930681B2 (ja) | 2019-03-25 | 2021-09-01 | 株式会社村田製作所 | 伸縮性実装基板 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001047015A2 (en) * | 1999-12-23 | 2001-06-28 | Via, Inc. | Electronic component protection devices and methods |
US6932621B2 (en) * | 2003-03-21 | 2005-08-23 | The Boeing Company | Connector interface pad for structurally integrated wiring |
JP5195422B2 (ja) * | 2006-03-31 | 2013-05-08 | 日本電気株式会社 | 配線基板、実装基板及び電子装置 |
DE102006055576A1 (de) * | 2006-11-21 | 2008-05-29 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Herstellen eines dehnbaren Schaltungsträgers und dehnbarer Schaltungsträger |
US9226402B2 (en) * | 2012-06-11 | 2015-12-29 | Mc10, Inc. | Strain isolation structures for stretchable electronics |
JP6159876B2 (ja) * | 2014-03-31 | 2017-07-05 | 株式会社フジクラ | 伸縮性基板及び回路基板 |
-
2016
- 2016-01-28 FI FI20165054A patent/FI20165054A/fi not_active Application Discontinuation
-
2017
- 2017-01-27 WO PCT/FI2017/050049 patent/WO2017129866A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2017129866A1 (en) | 2017-08-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FD | Application lapsed |