FI20106065L - Menetelmä ja mitta-anturi lämpötilan mittaamiseksi - Google Patents
Menetelmä ja mitta-anturi lämpötilan mittaamiseksi Download PDFInfo
- Publication number
- FI20106065L FI20106065L FI20106065A FI20106065A FI20106065L FI 20106065 L FI20106065 L FI 20106065L FI 20106065 A FI20106065 A FI 20106065A FI 20106065 A FI20106065 A FI 20106065A FI 20106065 L FI20106065 L FI 20106065L
- Authority
- FI
- Finland
- Prior art keywords
- measuring
- measurement
- measuring element
- detector
- temperature
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
- G01K13/02—Thermometers specially adapted for specific purposes for measuring temperature of moving fluids or granular materials capable of flow
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
Keksinnön kohteena on menetelmä mitta-anturi lämpötilan mittaamiseksi, jossa menetelmässä mitta-anturin mittaelementti (1) sovitetaan mitattavan prosessin (4) kanssa lämpökosketukseen ja jossa mittaelementiltä saatava mittasignaali johdetaan mittaelementtiin (1) yhdistettyjen mittajohdinten (2) avulla eteenpäin. Mittaelementin (1) läheisyyteen sovitetaan välineet (3), joiden avulla muodostetaan liitäntäalueet, jotka sovitetaan olemaan esteettä lämpökosketuksessa mitattavan prosessin (4) kanssa ja että mittajohtimet (2) yhdistetään mittaelementtiin liitäntäalueiden kautta.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20106065A FI126956B (fi) | 2010-10-14 | 2010-10-14 | Menetelmä ja mitta-anturi lämpötilan mittaamiseksi |
DE102011084387A DE102011084387A1 (de) | 2010-10-14 | 2011-10-13 | Verfahren und Sensor zur Messung der Temperatur |
US13/273,907 US9063020B2 (en) | 2010-10-14 | 2011-10-14 | Method and device for measuring temperature having a separate structure for terminal areas arranged in unrestricted thermal contact with a process liquid |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20106065A FI126956B (fi) | 2010-10-14 | 2010-10-14 | Menetelmä ja mitta-anturi lämpötilan mittaamiseksi |
Publications (4)
Publication Number | Publication Date |
---|---|
FI20106065A0 FI20106065A0 (fi) | 2010-10-14 |
FI20106065L true FI20106065L (fi) | 2012-04-15 |
FI20106065A FI20106065A (fi) | 2012-04-15 |
FI126956B FI126956B (fi) | 2017-08-31 |
Family
ID=43064223
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20106065A FI126956B (fi) | 2010-10-14 | 2010-10-14 | Menetelmä ja mitta-anturi lämpötilan mittaamiseksi |
Country Status (3)
Country | Link |
---|---|
US (1) | US9063020B2 (fi) |
DE (1) | DE102011084387A1 (fi) |
FI (1) | FI126956B (fi) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105067135B (zh) * | 2015-08-18 | 2017-10-24 | 四川华宇瑞得科技有限公司 | 动态物料测温仪 |
CN105067149B (zh) * | 2015-08-18 | 2017-10-24 | 四川华宇瑞得科技有限公司 | 动态物料测温装置 |
CN115516285A (zh) * | 2020-06-30 | 2022-12-23 | 阿尔卑斯阿尔派株式会社 | 传感器单元及其安装结构 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2188158A1 (fi) | 1972-06-14 | 1974-01-18 | Bailey Meter Co | |
DE2235676A1 (de) | 1972-07-20 | 1974-02-07 | Inter Control Koehler Hermann | Vorrichtung zur bestimmung der temperatur eines mediums in einem gehaeuse |
US4129848A (en) * | 1975-09-03 | 1978-12-12 | Raytheon Company | Platinum film resistor device |
US4215577A (en) | 1978-08-28 | 1980-08-05 | Purdue Research Foundation | Utilization of diodes as wide range responsive thermometers |
US4243968A (en) | 1979-04-25 | 1981-01-06 | Robertshaw Controls Company | Temperature sensing unit, parts therefor and methods of making the same |
DE3009108A1 (de) | 1980-03-10 | 1981-09-24 | Hoechst Ag, 6000 Frankfurt | Temperaturfuehler |
DE3134166A1 (de) | 1981-08-28 | 1983-03-10 | Robert Bosch Gmbh, 7000 Stuttgart | Temperaturfuehler |
IN165267B (fi) | 1984-07-31 | 1989-09-09 | Rosemount Inc | |
US4791398A (en) * | 1986-02-13 | 1988-12-13 | Rosemount Inc. | Thin film platinum resistance thermometer with high temperature diffusion barrier |
US5141334A (en) * | 1991-09-24 | 1992-08-25 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Sub-kelvin resistance thermometer |
KR100228046B1 (ko) | 1997-03-19 | 1999-11-01 | 정명세 | 고온정밀백금저항온도센서 |
DE19905384A1 (de) | 1999-02-10 | 2000-08-17 | Holzschuh Gmbh & Co Kg | Sensor und Verfahren zu dessen Herstellung |
US6354736B1 (en) * | 1999-03-24 | 2002-03-12 | Honeywell International Inc. | Wide temperature range RTD |
US6970644B2 (en) | 2000-12-21 | 2005-11-29 | Mattson Technology, Inc. | Heating configuration for use in thermal processing chambers |
DE10109828A1 (de) | 2001-03-01 | 2002-09-05 | Xcellsis Gmbh | Elekrische Temperaturmessvorrichtung |
US6695886B1 (en) | 2002-08-22 | 2004-02-24 | Axcelis Technologies, Inc. | Optical path improvement, focus length change compensation, and stray light reduction for temperature measurement system of RTP tool |
JP4062263B2 (ja) | 2004-02-19 | 2008-03-19 | 株式会社デンソー | 温度センサ |
US7665890B2 (en) * | 2006-06-22 | 2010-02-23 | Watlow Electric Manufacturing Company | Temperature sensor assembly and method of manufacturing thereof |
US20090066353A1 (en) * | 2007-08-29 | 2009-03-12 | Heetronix | Probe assemblies and methods for housing and providing electrical contact to planar or chip-type sensors and heaters |
US8079758B2 (en) | 2007-10-25 | 2011-12-20 | Sebacs Co., Ltd. | Temperature computing instrument and method for calibrating temperature of sensor part used therefor |
JP5248360B2 (ja) * | 2009-02-10 | 2013-07-31 | 矢崎総業株式会社 | 温度検出用回路体構造 |
-
2010
- 2010-10-14 FI FI20106065A patent/FI126956B/fi not_active IP Right Cessation
-
2011
- 2011-10-13 DE DE102011084387A patent/DE102011084387A1/de active Pending
- 2011-10-14 US US13/273,907 patent/US9063020B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
FI20106065A0 (fi) | 2010-10-14 |
FI20106065A (fi) | 2012-04-15 |
US20120093192A1 (en) | 2012-04-19 |
FI126956B (fi) | 2017-08-31 |
US9063020B2 (en) | 2015-06-23 |
DE102011084387A1 (de) | 2012-04-19 |
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