FI20105902A0 - Laite - Google Patents
LaiteInfo
- Publication number
- FI20105902A0 FI20105902A0 FI20105902A FI20105902A FI20105902A0 FI 20105902 A0 FI20105902 A0 FI 20105902A0 FI 20105902 A FI20105902 A FI 20105902A FI 20105902 A FI20105902 A FI 20105902A FI 20105902 A0 FI20105902 A0 FI 20105902A0
- Authority
- FI
- Finland
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45544—Atomic layer deposition [ALD] characterized by the apparatus
- C23C16/45548—Atomic layer deposition [ALD] characterized by the apparatus having arrangements for gas injection at different locations of the reactor for each ALD half-reaction
- C23C16/45551—Atomic layer deposition [ALD] characterized by the apparatus having arrangements for gas injection at different locations of the reactor for each ALD half-reaction for relative movement of the substrate and the gas injectors or half-reaction reactor compartments
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20105902A FI20105902A0 (fi) | 2010-08-30 | 2010-08-30 | Laite |
DE112011102856.3T DE112011102856B4 (de) | 2010-08-30 | 2011-08-29 | Anordnung |
PCT/FI2011/050747 WO2012028779A1 (en) | 2010-08-30 | 2011-08-29 | Apparatus |
CN201180041762.0A CN103080374B (zh) | 2010-08-30 | 2011-08-29 | 装置 |
TW100130878A TW201219117A (en) | 2010-08-30 | 2011-08-29 | Apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20105902A FI20105902A0 (fi) | 2010-08-30 | 2010-08-30 | Laite |
Publications (1)
Publication Number | Publication Date |
---|---|
FI20105902A0 true FI20105902A0 (fi) | 2010-08-30 |
Family
ID=42669406
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20105902A FI20105902A0 (fi) | 2010-08-30 | 2010-08-30 | Laite |
Country Status (5)
Country | Link |
---|---|
CN (1) | CN103080374B (fi) |
DE (1) | DE112011102856B4 (fi) |
FI (1) | FI20105902A0 (fi) |
TW (1) | TW201219117A (fi) |
WO (1) | WO2012028779A1 (fi) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FI125341B (fi) * | 2012-07-09 | 2015-08-31 | Beneq Oy | Laitteisto ja menetelmä substraatin käsittelemiseksi |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4597986A (en) * | 1984-07-31 | 1986-07-01 | Hughes Aircraft Company | Method for photochemical vapor deposition |
JP3103186B2 (ja) * | 1992-03-19 | 2000-10-23 | 富士通株式会社 | 原子層エピタキシー装置および原子層エピタキシー法 |
MX9303141A (es) | 1992-05-28 | 1994-04-29 | Polar Materials Inc | Metodos y aparatos para depositar recubrimientos de barrera. |
JP2004014953A (ja) * | 2002-06-10 | 2004-01-15 | Tokyo Electron Ltd | 処理装置および処理方法 |
US20050172897A1 (en) * | 2004-02-09 | 2005-08-11 | Frank Jansen | Barrier layer process and arrangement |
JP4734317B2 (ja) * | 2005-02-17 | 2011-07-27 | 株式会社日立国際電気 | 基板処理方法および基板処理装置 |
KR20060103640A (ko) * | 2005-03-28 | 2006-10-04 | 삼성전자주식회사 | 반도체 제조장치 |
JP5260050B2 (ja) | 2005-05-27 | 2013-08-14 | 麒麟麦酒株式会社 | ガスバリア性プラスチック容器の製造装置及びその容器の製造方法 |
JP2007111678A (ja) * | 2005-10-24 | 2007-05-10 | Sekisui Chem Co Ltd | 線状被処理物用プラズマ処理装置 |
US20090304924A1 (en) * | 2006-03-03 | 2009-12-10 | Prasad Gadgil | Apparatus and method for large area multi-layer atomic layer chemical vapor processing of thin films |
US8043432B2 (en) * | 2007-02-12 | 2011-10-25 | Tokyo Electron Limited | Atomic layer deposition systems and methods |
JP2010073822A (ja) * | 2008-09-17 | 2010-04-02 | Tokyo Electron Ltd | 成膜装置、成膜方法、プログラム及びコンピュータ可読記憶媒体 |
US20110076421A1 (en) * | 2009-09-30 | 2011-03-31 | Synos Technology, Inc. | Vapor deposition reactor for forming thin film on curved surface |
-
2010
- 2010-08-30 FI FI20105902A patent/FI20105902A0/fi not_active Application Discontinuation
-
2011
- 2011-08-29 CN CN201180041762.0A patent/CN103080374B/zh active Active
- 2011-08-29 WO PCT/FI2011/050747 patent/WO2012028779A1/en active Application Filing
- 2011-08-29 DE DE112011102856.3T patent/DE112011102856B4/de active Active
- 2011-08-29 TW TW100130878A patent/TW201219117A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
TW201219117A (en) | 2012-05-16 |
DE112011102856B4 (de) | 2023-03-23 |
CN103080374A (zh) | 2013-05-01 |
CN103080374B (zh) | 2016-04-13 |
DE112011102856T5 (de) | 2013-08-08 |
WO2012028779A1 (en) | 2012-03-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FD | Application lapsed |