FI20031796A - A method of constructing an EMI shield around a component to be embedded in a circuit board - Google Patents
A method of constructing an EMI shield around a component to be embedded in a circuit board Download PDFInfo
- Publication number
- FI20031796A FI20031796A FI20031796A FI20031796A FI20031796A FI 20031796 A FI20031796 A FI 20031796A FI 20031796 A FI20031796 A FI 20031796A FI 20031796 A FI20031796 A FI 20031796A FI 20031796 A FI20031796 A FI 20031796A
- Authority
- FI
- Finland
- Prior art keywords
- constructing
- embedded
- component
- circuit board
- emi shield
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20031796A FI20031796A (en) | 2003-12-09 | 2003-12-09 | A method of constructing an EMI shield around a component to be embedded in a circuit board |
EP04805147A EP1692926A1 (en) | 2003-12-09 | 2004-12-09 | Method for constructing emi shielding around a component embedded in a circuit board |
PCT/FI2004/000752 WO2005057999A1 (en) | 2003-12-09 | 2004-12-09 | Method for constructing emi shielding around a component embedded in a circuit board |
CN 200480036607 CN1891023A (en) | 2003-12-09 | 2004-12-09 | Method for constructing emi shielding around a component embedded in a circuit board |
JP2006543565A JP2007514309A (en) | 2003-12-09 | 2004-12-09 | Method for building an EMI shield around a component embedded in a circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20031796A FI20031796A (en) | 2003-12-09 | 2003-12-09 | A method of constructing an EMI shield around a component to be embedded in a circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
FI20031796A0 FI20031796A0 (en) | 2003-12-09 |
FI20031796A true FI20031796A (en) | 2005-06-10 |
Family
ID=29763494
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20031796A FI20031796A (en) | 2003-12-09 | 2003-12-09 | A method of constructing an EMI shield around a component to be embedded in a circuit board |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1692926A1 (en) |
JP (1) | JP2007514309A (en) |
CN (1) | CN1891023A (en) |
FI (1) | FI20031796A (en) |
WO (1) | WO2005057999A1 (en) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101562951B (en) * | 2008-04-18 | 2011-05-11 | 欣兴电子股份有限公司 | Circuit board and manufacture method thereof |
JP5139156B2 (en) * | 2008-05-30 | 2013-02-06 | タツタ電線株式会社 | Electromagnetic shielding material and printed wiring board |
FI20095110A0 (en) | 2009-02-06 | 2009-02-06 | Imbera Electronics Oy | Electronic module with EMI protection |
FR2952428B1 (en) * | 2009-11-12 | 2011-12-16 | Sagem Defense Securite | INERTIAL SENSOR |
CN101795524B (en) * | 2009-12-31 | 2013-06-19 | 浙江阳光照明电器集团股份有限公司 | Compact bracket lamp |
CN102378464A (en) * | 2010-08-12 | 2012-03-14 | 环鸿科技股份有限公司 | Circuit board module |
CN102740608A (en) * | 2011-04-15 | 2012-10-17 | 常熟东南相互电子有限公司 | Combined-type circuit board and manufacturing method thereof |
JP5931547B2 (en) * | 2012-03-30 | 2016-06-08 | イビデン株式会社 | Wiring board and manufacturing method thereof |
CN104066273A (en) * | 2013-03-20 | 2014-09-24 | 深南电路有限公司 | Package substrate and manufacturing method thereof, and substrate assembly |
CN104080280B (en) * | 2013-03-26 | 2017-08-08 | 深南电路有限公司 | A kind of package substrate unit and preparation method thereof and board unit |
CN104080274B (en) * | 2013-03-29 | 2016-12-28 | 深南电路有限公司 | A kind of base plate for packaging and preparation method thereof and board unit |
DE102014219792A1 (en) * | 2014-09-30 | 2016-03-31 | Technische Universität Berlin | Optoelectronic component |
US10321569B1 (en) | 2015-04-29 | 2019-06-11 | Vpt, Inc. | Electronic module and method of making same |
CN107613641B (en) * | 2016-06-28 | 2019-07-19 | Oppo广东移动通信有限公司 | Pcb board component and mobile terminal with it |
CN106535472B (en) * | 2017-01-12 | 2019-08-02 | 郑州云海信息技术有限公司 | A kind of PCB and signal transmission system |
KR102616814B1 (en) * | 2018-03-09 | 2023-12-21 | 삼성전자주식회사 | Semiconductor package and semiconductor module |
CN110300492B (en) * | 2019-07-25 | 2021-03-30 | 生益电子股份有限公司 | PCB manufacturing method and PCB |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6131269A (en) * | 1998-05-18 | 2000-10-17 | Trw Inc. | Circuit isolation technique for RF and millimeter-wave modules |
US6916122B2 (en) * | 2002-03-05 | 2005-07-12 | Jds Uniphase Corporation | Modular heat sinks |
EP1510844A1 (en) * | 2003-08-28 | 2005-03-02 | Siemens Aktiengesellschaft | An optical fibre connector with electromagnetic shielding |
-
2003
- 2003-12-09 FI FI20031796A patent/FI20031796A/en not_active IP Right Cessation
-
2004
- 2004-12-09 WO PCT/FI2004/000752 patent/WO2005057999A1/en not_active Application Discontinuation
- 2004-12-09 JP JP2006543565A patent/JP2007514309A/en active Pending
- 2004-12-09 EP EP04805147A patent/EP1692926A1/en not_active Withdrawn
- 2004-12-09 CN CN 200480036607 patent/CN1891023A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
EP1692926A1 (en) | 2006-08-23 |
WO2005057999A1 (en) | 2005-06-23 |
JP2007514309A (en) | 2007-05-31 |
FI20031796A0 (en) | 2003-12-09 |
CN1891023A (en) | 2007-01-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Transfer of assignment of patent |
Owner name: ASPOCOMP TECHNOLOGY OY Free format text: ASPOCOMP TECHNOLOGY OY |
|
MA | Patent expired |