FI20020292A - Menetelmä kapasitiivisen anturin lämpötilariippuvuuden pienentämiseksi sekä kapasitiivinen anturirakenne - Google Patents
Menetelmä kapasitiivisen anturin lämpötilariippuvuuden pienentämiseksi sekä kapasitiivinen anturirakenne Download PDFInfo
- Publication number
- FI20020292A FI20020292A FI20020292A FI20020292A FI20020292A FI 20020292 A FI20020292 A FI 20020292A FI 20020292 A FI20020292 A FI 20020292A FI 20020292 A FI20020292 A FI 20020292A FI 20020292 A FI20020292 A FI 20020292A
- Authority
- FI
- Finland
- Prior art keywords
- capacitive sensor
- reducing
- temperature dependence
- sensor structure
- capacitive
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/04—Means for compensating for effects of changes of temperature, i.e. other than electric compensation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
- G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/084—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Pressure Sensors (AREA)
- Measuring Fluid Pressure (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20020292A FI114825B (fi) | 2002-02-13 | 2002-02-13 | Menetelmä kapasitiivisen anturin lämpötilariippuvuuden pienentämiseksi sekä kapasitiivinen anturirakenne |
US10/503,089 US7302857B2 (en) | 2002-02-13 | 2003-02-10 | Method for reducing the temperature dependence of a capacitive sensor and a capacitive sensor construction |
AU2003202615A AU2003202615A1 (en) | 2002-02-13 | 2003-02-10 | Method for reducing the temperature dependence of a capacitive sensor and a capacitive sensor construction |
PCT/FI2003/000101 WO2003069295A1 (en) | 2002-02-13 | 2003-02-10 | Method for reducing the temperature dependence of a capacitive sensor and a capacitive sensor construction |
DE10392273T DE10392273T5 (de) | 2002-02-13 | 2003-02-10 | Verfahren zur Reduzierung der Temperaturabhängigkeit eines kapazitiven Sensors und Aufbau eines kapazitiven Sensors |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20020292 | 2002-02-13 | ||
FI20020292A FI114825B (fi) | 2002-02-13 | 2002-02-13 | Menetelmä kapasitiivisen anturin lämpötilariippuvuuden pienentämiseksi sekä kapasitiivinen anturirakenne |
Publications (3)
Publication Number | Publication Date |
---|---|
FI20020292A0 FI20020292A0 (fi) | 2002-02-13 |
FI20020292A true FI20020292A (fi) | 2003-11-20 |
FI114825B FI114825B (fi) | 2004-12-31 |
Family
ID=8563194
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20020292A FI114825B (fi) | 2002-02-13 | 2002-02-13 | Menetelmä kapasitiivisen anturin lämpötilariippuvuuden pienentämiseksi sekä kapasitiivinen anturirakenne |
Country Status (5)
Country | Link |
---|---|
US (1) | US7302857B2 (fi) |
AU (1) | AU2003202615A1 (fi) |
DE (1) | DE10392273T5 (fi) |
FI (1) | FI114825B (fi) |
WO (1) | WO2003069295A1 (fi) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5593613B2 (ja) * | 2009-02-12 | 2014-09-24 | ヤマハ株式会社 | 音響用木質材料及びその製造方法並びにアコースティック楽器 |
US8724832B2 (en) | 2011-08-30 | 2014-05-13 | Qualcomm Mems Technologies, Inc. | Piezoelectric microphone fabricated on glass |
US8824706B2 (en) | 2011-08-30 | 2014-09-02 | Qualcomm Mems Technologies, Inc. | Piezoelectric microphone fabricated on glass |
US8811636B2 (en) | 2011-11-29 | 2014-08-19 | Qualcomm Mems Technologies, Inc. | Microspeaker with piezoelectric, metal and dielectric membrane |
FI125958B (fi) | 2013-05-10 | 2016-04-29 | Murata Manufacturing Co | Parannettu paineanturi |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2543083C3 (de) * | 1975-09-26 | 1979-01-11 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Bildsensor sowie Verfahren zum Betrieb eines solchen Bildsensors |
US4203128A (en) * | 1976-11-08 | 1980-05-13 | Wisconsin Alumni Research Foundation | Electrostatically deformable thin silicon membranes |
US4773972A (en) * | 1986-10-30 | 1988-09-27 | Ford Motor Company | Method of making silicon capacitive pressure sensor with glass layer between silicon wafers |
GB2202084A (en) * | 1987-03-13 | 1988-09-14 | Philips Electronic Associated | Thermal-image sensing devices and their manufacture |
US4823230A (en) * | 1988-03-04 | 1989-04-18 | General Electric Company | Pressure transducer |
JPH0795602B2 (ja) * | 1989-12-01 | 1995-10-11 | 三菱電機株式会社 | 太陽電池及びその製造方法 |
DE4136995C2 (de) | 1991-11-11 | 1996-08-08 | Sensycon Ind Sensorsyst | Kapazitiver Drucksensor |
US5365790A (en) * | 1992-04-02 | 1994-11-22 | Motorola, Inc. | Device with bonded conductive and insulating substrates and method therefore |
TW218426B (fi) * | 1992-05-11 | 1994-01-01 | Samsung Electronics Co Ltd | |
JP2625362B2 (ja) * | 1993-11-17 | 1997-07-02 | 日本電気株式会社 | 半導体装置の製造方法 |
US5600072A (en) * | 1995-06-23 | 1997-02-04 | Motorola, Inc. | Capacitive pressure sensor and method for making the same |
DE19640960A1 (de) * | 1996-10-04 | 1998-04-09 | Bosch Gmbh Robert | Kapazitiver Drucksensor mit variabler Kavitätenhöhe |
US5936164A (en) | 1997-08-27 | 1999-08-10 | Delco Electronics Corporation | All-silicon capacitive pressure sensor |
US6465271B1 (en) * | 1998-07-07 | 2002-10-15 | Wen H. Ko | Method of fabricating silicon capacitive sensor |
US6555870B1 (en) * | 1999-06-29 | 2003-04-29 | Kabushiki Kaisha Toshiba | Nonvolatile semiconductor memory device and method for producing same |
US6507475B1 (en) * | 2000-06-27 | 2003-01-14 | Motorola, Inc. | Capacitive device and method of manufacture |
US6842965B2 (en) * | 2000-12-28 | 2005-01-18 | Matsushita Electric Industrial Co., Ltd. | Method for manufacturing a strain detector |
EP1223420A3 (en) * | 2001-01-16 | 2003-07-09 | Fujikura Ltd. | Pressure sensor and manufacturing method thereof |
KR100404904B1 (ko) * | 2001-06-09 | 2003-11-07 | 전자부품연구원 | 차동 용량형 압력센서 및 그 제조방법 |
-
2002
- 2002-02-13 FI FI20020292A patent/FI114825B/fi not_active IP Right Cessation
-
2003
- 2003-02-10 AU AU2003202615A patent/AU2003202615A1/en not_active Abandoned
- 2003-02-10 US US10/503,089 patent/US7302857B2/en not_active Expired - Lifetime
- 2003-02-10 DE DE10392273T patent/DE10392273T5/de not_active Withdrawn
- 2003-02-10 WO PCT/FI2003/000101 patent/WO2003069295A1/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
US20050105245A1 (en) | 2005-05-19 |
FI20020292A0 (fi) | 2002-02-13 |
FI114825B (fi) | 2004-12-31 |
WO2003069295A1 (en) | 2003-08-21 |
AU2003202615A1 (en) | 2003-09-04 |
DE10392273T5 (de) | 2005-03-10 |
US7302857B2 (en) | 2007-12-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Transfer of assignment of patent |
Owner name: MURATA ELECTRONICS OY |
|
MM | Patent lapsed |