FI10729U1 - Cooling arrangement for cooling the semiconductor module and electrical device - Google Patents
Cooling arrangement for cooling the semiconductor module and electrical deviceInfo
- Publication number
- FI10729U1 FI10729U1 FIU20144251U FIU20144251U FI10729U1 FI 10729 U1 FI10729 U1 FI 10729U1 FI U20144251 U FIU20144251 U FI U20144251U FI U20144251 U FIU20144251 U FI U20144251U FI 10729 U1 FI10729 U1 FI 10729U1
- Authority
- FI
- Finland
- Prior art keywords
- cooling
- electrical device
- semiconductor module
- arrangement
- cooling arrangement
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title 2
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FIU20144251U FI10729U1 (en) | 2014-11-25 | 2014-11-25 | Cooling arrangement for cooling the semiconductor module and electrical device |
DE202015100342.0U DE202015100342U1 (en) | 2014-11-25 | 2015-01-26 | Cooling arrangement for cooling a semiconductor module and electrical device |
CN201520508089.2U CN204792759U (en) | 2014-11-25 | 2015-07-14 | A cooling device and electric installation for cooling off semiconductor module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FIU20144251U FI10729U1 (en) | 2014-11-25 | 2014-11-25 | Cooling arrangement for cooling the semiconductor module and electrical device |
Publications (1)
Publication Number | Publication Date |
---|---|
FI10729U1 true FI10729U1 (en) | 2014-12-17 |
Family
ID=52281685
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FIU20144251U FI10729U1 (en) | 2014-11-25 | 2014-11-25 | Cooling arrangement for cooling the semiconductor module and electrical device |
Country Status (3)
Country | Link |
---|---|
CN (1) | CN204792759U (en) |
DE (1) | DE202015100342U1 (en) |
FI (1) | FI10729U1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108806930B (en) * | 2018-04-27 | 2020-06-23 | 山特电子(深圳)有限公司 | Heat radiator, heat radiating device comprising same, self-cooling inductor suite and electric equipment |
-
2014
- 2014-11-25 FI FIU20144251U patent/FI10729U1/en active IP Right Grant
-
2015
- 2015-01-26 DE DE202015100342.0U patent/DE202015100342U1/en active Active
- 2015-07-14 CN CN201520508089.2U patent/CN204792759U/en active Active
Also Published As
Publication number | Publication date |
---|---|
DE202015100342U1 (en) | 2015-02-06 |
CN204792759U (en) | 2015-11-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FGU | Utility model registered |
Ref document number: 10729 Country of ref document: FI Kind code of ref document: U1 |
|
PCU | New assignee or owner (utility models) |
Owner name: ABB SCHWEIZ AG |